A multiplicity of wafers are simultaneously cut from an ingot using a structured sawing wire having indentations and protrusions along its length, wherein the structured sawing wire is guided through grooves of two wire guide rolls, and a bottom of each groove, on which the structured wire bears, has a curved groove bottom with a radius of curvature which, for each groove, is equal to or up to 1.5 times as large as the radius of the envelope of the structured wire which the structured wire has in the respective groove.

The present subject matter discloses a method of lateral slicing of cylindrical silicon ingot to maximize resulting chips yield as compared to the conventional transverse slicing of ingot. The resulting rectangular wafers made from lateral slicing of ingot maximizes yield as by the lateral slicing of ingot, overall chips per wafer ratio gets increased as compared to transversal cutting while the said method decreases waste due to conflict between chip and wafer geometry. The novel apparatus or system of present method includes JIG having plurality of parallel bars. The JIG is provided to covers and holds the ingot during slicing while the parallel bars of JIG between which diamond dust embedded wires gets located and which behaves as a guide for diamond embedded wires during the slicing of ingot. Also, this JIG mechanism protects and holds the wires from sliding down and miss the designated location of slicing during the process as the slicing of cylindrical ingot is being done longitudinally. Further, the parallel bars of the JIG mechanism are made such a way that the slurry and debris from the slicing automatically gets released.

A cutting apparatus and the method of operating same is provided. The apparatus includes a feed tower assembly configured to be attached to an object and a frame assembly movably attached thereto. The frame assembly has arm assemblies thereon which accept a cutting member. A liquid spray system is provided for cooling components of the cutting apparatus.

A device for cutting a plate or panel of porous construction material includes a movement structure that moves the plate or panel and includes at least one conveyor, and which is able to move in a direction (X). The device also includes a wire to cut the plate or panel and a structure for passing the wire in a direction (Y) perpendicular to the direction (X) of travel of the plate or panel. The device for cutting allows a cut to be made that greatly limits the waste and dust generated.

A multiplicity of wafers are simultaneously cut from an ingot by means of a structured sawing wire, wherein the structured sawing wire is guided through grooves of two wire guide rolls, and a bottom of each groove, on which the structured wire hears, has a curved groove bottom with a radius of curvature which, for each groove, is equal to or up to 1.5 times as large as the radius of the envelope of the structured wire which the structured wire has in the respective groove.

A dust collection system comprises: a cover configured to hermetically seal nuclear power plant structure, which is a target to be cut, the cover being provided at an outer circumferential surface thereof with a plurality of cutting groove members adjusted for a height of the cutting wire, the cover being made of a transparent material; an air compressor configured to supply compressed air; an air hose configured to convey the compressed air; a passage member provided in each of the plurality of cutting groove members, the passage member being configured to receive the compressed air such that the compressed air is sprayed to the cutting wire through the cover made of the transparent material; a packing member configured to wrap at least a part of an inner circumferential surface of each of the plurality of cutting groove members.

A cable saw for cutting a workpiece includes a circulating saw cable, a guide device, and a cable storage device and cable tensioning device. The saw cable is driven by a drive and includes a sawing section. The guide device is arranged to move the sawing section along a cutting direction for cutting engagement with the workpiece. The guide device is arranged to allow several movement directions including the cutting direction and at least one lengthening or shortening of the sawing section. The cable storage device and cable tensioning device is arranged for storing, releasing and/or tensioning the saw cable when changing a position and/or length of the sawing section. The guide device includes a lever gear with a pivot lever rotatably hinged to a base holder. The lever gear is arranged to convert a rotational movement of the pivot lever into a movement of deflection rollerswhich form the sawing section therebetweento lengthen and/or shorten the sawing section.

A cutting apparatus and the method of operating same is provided. The apparatus includes a feed tower assembly configured to be attached to an object and a frame assembly movably attached thereto. The frame assembly has arm assemblies thereon which accept a cutting member. At least one arm assembly can be pivoted relative to the other arm assembly and relative to the feed tower assembly. One arm assembly can further be moved relative to the other arm assembly and relative to the feed tower assembly in a vertical direction.

The invention relates to a wire management system for a wire saw having a cutting wire guided through a cutting area. The system comprises a wire supplying unit for supplying cutting wire to the cutting area and a wire receiving unit for receiving cutting wire from the cutting area. At least one of the wire supplying unit and the wire receiving unit comprises: at least one rotatable reservoir spool for carrying the cutting wire in overlapping windings, at least one rotatable storage spool for temporarily receiving the cutting wire in windings, wherein the rotational axis of the storage spool coincides with the rotational axis of the reservoir spool, a wire guiding means for guiding the wire when being wound up on the storage spool, such that the wire windings on the storage spool do not overlap each other and/or have a lower density than the windings on the reservoir spool.

A diamond wire cutter, using an adjustable length pulley system, a diamond wire saw, and a movable pulley cart, can perform a through-cut of complete sections of a structure such as a tubular subsea by fitting a chain about an outer surface of the structure, securing the chain to the movable pulley cart and using the chain to move or otherwise guide the movable pulley cart about the outer circumference of the structure to cut while using a diamond wire to effect a cut between the movable pulley cart and the diamond wire saw.