An apparatus configured to automatically set a stroke range of a cutting device includes: a driver including a rotary shaft on which a bobbin is detachably mounted; a traverse configured to move an attachment point of a wire with respect to the bobbin; and a sensor configured to measure a distance between the driver and the bobbin. The apparatus further includes a controller configured to adjust the stroke range of the traverse to move in parallel based on the distance measured by the sensor. The sensor is configured to measure, as first distance data, a distance between a side of the driver and a side of the bobbin.

A wire saw apparatus for an excavator, according to the present invention, comprises: a support plate; an excavator connection part attached to the support plate so as to be able to be detachably attached to an excavator arm; a pair of guide rails attached to the support plate; an ascending/descending member which ascends or descends along the pair of guide rails; an electric motor for raising or lowering the ascending/descending member; a driving pulley rotated by a hydraulic motor attached to the ascending/descending member; a plurality of driven pulleys mounted to the support plate; and a wire mounted to the driving pulley and the plurality of driven pulleys.

Wafers are sliced from a workpiece using a wire saw during slicing operations. The wire saw has a wire web of sawing wire and a setting device. The wire web is stretched in a plane between wire guide rollers that are mounted between fixed and moveable bearings. During each of the slicing operations, the setting device feeds the workpiece through the wire web along a feed direction perpendicular to a workpiece axis and perpendicular to the plane of the wire web. During each of the slicing operations, the movable bearings move oscillatingly axialy. The feeding of the workpiece through the wire web includes a simultaneous displacement of the workpiece along the workpiece axis using the setting element in accordance with a correction profile, which includes an oscillating component that is opposite to the effect which the axial moving of the movable bearings has on the shape of the sliced-off wafers.

An overhead sawing device comprising a central frame, a cutting cable, a driving unit, a first and a second arms configured to deflect the cutting cable to a lower level, at least two rotatable arms configured to receive the cutting cable from the higher level and to guide said cable during a cut. The device further includes a telescopic cable tensioning element. A method of operating the device is also provided, which method permits the execution of a continuous cut without repositioning the device, even in confined spaces.

Systems for cooling and directing a cutting wire. The systems include a water cooling box which permits cooling a cutting cable without any loss of cleaning/cooling fluid or contamination of the driving elements of the system. The systems also include a plurality of cutting wire directing elements which permit multiple cutting directions without derailing of the wire out of the guiding pulleys.