A wire saw includes a U-shaped cutting area. An endless sawing wire loop runs between a plurality of wire pulleys including at least two displaceable cutting area pulleys, displaceable wire tensioning pulleys and wire plane changing pulleys. The endless wire loop defines a first cutting area plane P1 in the U-shaped cutting area and at least one further wire loop plane dissimilar from the first cutting area plane. The wire plane changing pulleys guide the sawing wire between the first cutting area plane and the further wire loop plane P2. A wire driving pulley is driven by a wire drive motor. A cutting area pulley actuator runs the cutting area pulleys along each side of the workpiece cutting area. The displaceable wire tensioning pulleys are displaceable by at least one tensioning actuator within the further wire loop plane P2 to maintain a tensioned sawing wire.

A device for cutting a mat or panel made of mineral wool or a board or panel made of porous construction material, including a system for moving the mat or panel made of mineral wool or the board or panel made of porous construction material, which includes at least one conveyor, capable of moving along a direction, an endless diamond element designed to cut the mat or panel made of mineral wool or the board or panel made of porous construction material, a device for running the endless diamond element in a direction perpendicular to the direction of movement of the mat or panel made of mineral wool or the board or panel made of porous construction material, the endless diamond element being an endless diamond wire, an endless diamond cable or an endless diamond strip.

Disclosed herein is a machine for cutting nozzles of reactor vessels. The machine for cutting nozzles of reactor vessels comprises a cutting unit positioned at an upper surface edge of a reactor vessel having a nozzle and having a saw blade part having different contact areas to cut the nozzle, a drive unit providing the saw blade part with rotary power, and a foreign substance suction unit provided at one end of the cutting unit in contiguity with the saw blade part to suck foreign substances generated when the nozzle is cut by the saw blade part, wherein the foreign substance suction unit sucks the foreign substances by approaching an outer peripheral surface of the nozzle when the saw blade part moves in a cutting direction of the nozzle.

Provided are a method for machining a plate material by using a linear saw, and a numerical control saw machine apparatus. The numerical control saw machine apparatus includes: two carrying mechanisms, which are connected to two ends of a linear saw respectively; at least one control motor, configured for adjusting a distance between the two carrying mechanisms; and a pair of vibration motors, configured for driving the vibration of the linear saw, wherein, the distance between the two carrying mechanisms is adjusted by the control motor based on a monitored change in a torque of the control motor.

Disclosed herein is a machine for cutting nozzles of reactor vessels. The machine for cutting nozzles of reactor vessels comprises a cutting unit positioned at an upper surface edge of a reactor vessel having a nozzle and having a saw blade part having different contact areas to cut the nozzle, a drive unit providing the saw blade part with rotary power, and a foreign substance suction unit provided at one end of the cutting unit in contiguity with the saw blade part to suck foreign substances generated when the nozzle is cut by the saw blade part, wherein the foreign substance suction unit sucks the foreign substances by approaching an outer peripheral surface of the nozzle when the saw blade part moves in a cutting direction of the nozzle.

An electronic component removal device comprising a cutting wire routed through a cutting region configured to receive an electronic component coupled to a substrate. The electronic component removal device can also include a leading actuator coupled to a leading end of the cutting wire to cause movement of the cutting wire in a cutting direction at a cutting speed. The electronic component removal device can further include a trailing resistance device coupled to a trailing end of the cutting wire to resist movement of the cutting wire in the cutting direction with a variable resistance. In addition, the electronic component removal device can include a leading tension sensor to sense a leading tension in the cutting wire between the cutting region and the leading actuator. The trailing resistance device can resist movement of the cutting wire with a resistance that varies based on the leading tension in the cutting wire.

The present invention relates to a processing module for a building panel and a method for processing a building panel. The processing module for a building panel comprises an input station and a manoeuvring station. The input station comprises a reception for a building panel and the building panel bundles several individual building elements. The manoeuvring station comprises a swiveling device for transporting and swiveling the building panel.

An attachment for converting a CNC milling machine to a CNC wire saw machine. The attachment may include a gantry that may be coupled with a respective gantry of the CNC milling machine, a carriage that may be attached to and moveable with a respective carriage of the CNC milling machine. A drive pulley of the system may be coupled with and driven by a spindle of the CNC milling machine. The drive pully may drive a wire saw through an assembly of idler pulleys. A wire tension mechanism may keep the wire fully stretched. The wire tension mechanism may include a curved guide rail mounted on the gantry and a vertical guide rail mounted on the carriage. A slider that slides vertically on the vertical guide rail and follows the curved guide rail may house a tension wheel that may keep the wire at a fully stretched state.

In various aspects, the diamond wire saw apparatus disclosed herein includes a frame formed in a U-shape from a first rail and a second rail secured to a base, the first rail and the second rail being parallel to one another and perpendicular to the base. Several pulleys are disposed about the frame, and a diamond wire is engaged with the several pulleys to be cycled about the several pulleys. Some of the several pulleys traverse portions of the frame in opposing directions to maintain a selected tension in the diamond wire as the diamond wire is advanced while being cycled to cut a workpiece releasably engaged with the frame. The first rail, the second rail, and the base are formed in sections to be sized to correspondingly size an interior region of the frame to accommodate a workpiece by selective inclusion of sections in the first rail, the second rail, and the base.

A substantial reduction in scrap produced by an interrupted process for the sawing of a workpiece into a multiplicity of wafers with a wire saw caused by wire breakage, is made possible by detecting the exact or approximate position of the wire break, repairing or replacing the sawing wire, and rethreading the sawing wire web into the saw kerfs, while excluding the kerf in which breakage occurred.