Patent classifications
B23D61/185
SHAPED SAW WIRE WITH CONTROLLED CURVATURE AT BENDS
A saw wire to cut hard and brittle materials is disclosed that comprises a steel wire that is provided with bends with segments in between. The average degree of bending of the bends is between 0.5% and 5%. Such a saw wire has a higher breaking load compared to saw wires having a conventional, higher average degree of bending. A method to measure the curvature is described as well as a process to make the inventive saw wire. The invention is applicable to any shaped saw wire for example a single crimped saw wire, a saw wire with at least two crimps in different planes, a saw wire with crimps rotating in a plane.
Shaped saw wire with controlled curvature at bends
A saw wire to cut hard and brittle materials is disclosed that comprises a steel wire that is provided with bends with segments in between. The average degree of bending of the bends is between 0.5% and 5%. Such a saw wire has a higher breaking load compared to saw wires having a conventional, higher average degree of bending. A method to measure the curvature is described as well as a process to make the inventive saw wire. The invention is applicable to any shaped saw wire for example a single crimped saw wire, a saw wire with at least two crimps in different planes, a saw wire with crimps rotating in a plane.
METHOD AND DEVICE FOR CUTTING A MAT OR A PANEL OF MINERAL WOOL OR A BOARD OR A PANEL OF POROUS CONSTRUCTION MATERIAL
A device for cutting a mat or panel made of mineral wool or a board or panel made of porous construction material, including a system for moving the mat or panel made of mineral wool or the board or panel made of porous construction material, which includes at least one conveyor, capable of moving along a direction, an endless diamond element designed to cut the mat or panel made of mineral wool or the board or panel made of porous construction material, a device for running the endless diamond element in a direction perpendicular to the direction of movement of the mat or panel made of mineral wool or the board or panel made of porous construction material, the endless diamond element being an endless diamond wire, an endless diamond cable or an endless diamond strip.
Saw wire and cutting apparatus
A saw wire includes a metal wire containing rhenium-tungsten alloy. A rhenium content of the metal wire is at least 0.1 wt % and at most 10 wt % with respect to a total weight of rhenium and tungsten, an elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa, a tensile strength of the metal wire is at least 3500 MPa, and a diameter of the metal wire is at most 60 m.
Saw wire and cutting apparatus
A saw wire and various methods of use and manufacture are provided. The saw wire includes a metal wire containing at least one of tungsten and a tungsten alloy. A nickel plating layer is provided over the metal wire. An adhesion layer is provided at an interface between the metal wire and the nickel plating layer. The adhesion layer contains nickel and tungsten. A plurality of abrasive particles are provided at a surface of the nickel plating layer.
Cutting bead for a saw rope
A cutting bead (13) for a saw rope (15) comprises a geometrically defined cutting portion (2) and tapers from the geometrically defined cutting portion (2) contrary to a sawing direction. With such cutting beads (13), a saw rope (15) is formed. In a method for manufacturing a saw rope (15), a cutting element (1) with a geometrically defined cutting portion (2) and an abrasive element (6) with a geometrically undefined cutting portion (14) or a neutral element (8) are joined. With the cutting element (1) and the abrasive element (6) or the neutral element (8), a cutting bead (13) is formed. The cutting bead (13) is joined onto the support rope (16).
Linear saw, and machining method and numerical control machining device that use same
A linear saw, machining method using the same and numerical controlled machining device. The linear saw has: a machining part (1), for cutting a machining object in a linearly extending direction of the linear saw, and generating a slot on the machining object; and the linear saw further includes a space-keeping part (2) arranged such that the whole linear saw does not contact the slot or is not subject to an acting force of the slot when the space-keeping part passes through the slot. As the linear saw is provided with a space-keeping structure, the linear saw has time and space to recover from a deformation generated by cutting the machining object, thus effectively preventing accumulated errors, and greatly improving the position precision of the machining seam.
Abrasive article and method of forming
An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, and a first type of abrasive particle overlying the tacking layer and defining a first abrasive particle concentration at least about 10 particles per mm of substrate.
Wire saw, wire guide roll and method for simultaneously cutting a multiplicity of wafers from an ingot
A multiplicity of wafers are simultaneously cut from an ingot using a structured sawing wire having indentations and protrusions along its length, wherein the structured sawing wire is guided through grooves of two wire guide rolls, and a bottom of each groove, on which the structured wire bears, has a curved groove bottom with a radius of curvature which, for each groove, is equal to or up to 1.5 times as large as the radius of the envelope of the structured wire which the structured wire has in the respective groove.
Abrasive article and method of forming
An abrasive article includes a substrate having an elongated body, a plurality of discrete tacking regions defining a discontinuous distribution of features overlying the substrate, where at least one discrete tacking region of the plurality of discrete tacking regions includes a metal material having a melting temperature not greater than 450 C., a plurality of discrete formations overlying the substrate and spaced apart from the plurality of discrete tacking regions, and a bonding layer overlying the substrate, plurality of discrete tacking regions, and plurality of discrete formations.