A metal wire containing tungsten is provided. A tungsten content of the metal wire is at least 90 wt %. A tensile strength of the metal wire is at least 4000 MPa. An elastic modulus of the metal wire is at least 350 GPa and at most 450 GPa. A diameter of the metal wire is at most 60 m. An average crystal grain size of the metal wire in a cross-section orthogonal to an axis of the metal wire is at most 0.20 m.

The invention relates to a wire management system for a wire saw having a cutting wire guided through a cutting area. The system comprises a wire supplying unit for supplying cutting wire to the cutting area and a wire receiving unit for receiving cutting wire from the cutting area. At least one of the wire supplying unit and the wire receiving unit comprises: at least one rotatable reservoir spool for carrying the cutting wire in overlapping windings, at least one rotatable storage spool for temporarily receiving the cutting wire in windings, wherein the rotational axis of the storage spool coincides with the rotational axis of the reservoir spool, a wire guiding means for guiding the wire when being wound up on the storage spool, such that the wire windings on the storage spool do not overlap each other and/or have a lower density than the windings on the reservoir spool.

A bowstring which is attached to a recurve or other long bow providing a section having an abrasive circular margin used to cut wood or other substance in an emergency replacing the bowstring of the bow utilized for shooting an arrow.

A diamond wire cutter, using an adjustable length pulley system, a diamond wire saw, and a movable pulley cart, can perform a through-cut of complete sections of a structure such as a tubular subsea by fitting a chain about an outer surface of the structure, securing the chain to the movable pulley cart and using the chain to move or otherwise guide the movable pulley cart about the outer circumference of the structure to cut while using a diamond wire to effect a cut between the movable pulley cart and the diamond wire saw.

The invention relates to a wire management system (7) for a wire saw (8) having a cutting wire (3) which is guided through a cutting area (13), the wire management system (7) comprising a wire supplying unit (5) for supplying cutting wire (3) to the cutting area (13) of the wire saw (8) and a wire receiving unit (6) for receiving cutting wire (3) from the cutting area (13) of the wire saw (8), wherein at least one of the wire supplying unit (5) and the wire receiving unit (6) comprises: at least one rotatable reservoir spool (1) for carrying the cutting wire (3) in overlapping windings, at least one rotatable storage spool (2) for temporarily receiving the cutting wire (3) in windings, wherein the rotational axis (2b) of the storage spool (2) coincides with the rotational axis (1 b) of the reservoir spool (1), a wire guiding means (9) for guiding the cutting wire (3) when being wound up on the storage spool (2), such that the wire windings on the storage spool (2) do not overlap each other and/or have a lower density than the windings on the reservoir spool (1).

An abrasive article comprising a substrate having an elongated body and abrasive particles attached to the elongated body, the content of the abrasive particles oscillates along the length of the body between a minimum and maximum value, and the minimum content is greater than 0.

An abrasive article includes a substrate having an elongated body, a plurality of discrete tacking regions defining a discontinuous distribution of features overlying the substrate, where at least one discrete tacking region of the plurality of discrete tacking regions includes a metal material having a melting temperature not greater than 450? C., a plurality of discrete formations overlying the substrate and spaced apart from the plurality of discrete tacking regions, and a bonding layer overlying the substrate, plurality of discrete tacking regions, and plurality of discrete formations.

A method for cutting a starting panel of mineral wool or porous construction material into several panels includes supplying a starting panel having a front edge and cutting the panel into two in its thickness by a wire by moving the panel in a direction (X). The wire passes in a direction (Y) perpendicular to the direction (X) to form two first panels. The method also includes cutting the rear edge of the two first panels and the front edge of two second panels by moving the wire in a direction (Z) perpendicular both to the direction (X) and to the direction (Y), cutting the panel into two in its thickness using the wire by moving the panel in the direction (X) to form the two second panels, and repeating the cutting front/rear edges and cutting in the thickness to form two third, fourth, etc. panels.

A method produces wafers from a cylindrical ingot of semiconductor material having an axis and an indexing notch in an outer surface of the cylindrical ingot and parallel to the axis. The method includes, in the order specified: (a) simultaneous removal of a multiplicity of sliced wafers from the cylindrical ingot by multi-wire slicing in the presence of a cutting agent; (b) etching of the sliced wafers with an alkaline etchant in an etching bath at a temperature of 20? C. to 50? C. and for a residence time, such that the material removed from each of the sliced wafers is less than 5/1000 of an initial wafer thickness; and (c) grinding of the etched wafers by simultaneous double-disk grinding using an annular abrasive covering.

A cutting device comprising a drive assembly operably coupled to and powered by a drive means. The drive assembly comprises a worm gear operably coupled to and driven by the drive means, a crank assembly operably coupled to and driven by the worm gear, a timing assembly operably coupled to and driven by the crank assembly, an actuator assembly operably coupled to and driven by the timing assembly and a crank arm operably coupled to the crank assembly and the timing assembly. A drive cable extends from and is operably coupled to the actuator assembly. A flexible cutting means is operably coupled to the drive cable. The drive assembly is configured such that a reciprocating motion is transmitted to the cutting means such that the cutting means is reciprocated for cutting an article.