A method to make sawing beads by means of laser cladding is disclosed whereby metal matrix powder is molten by means of a laser beam on a rotating sleeve while diamonds are thrown in the molten metal pool. By carefully controlling the temperature of the molten metal pool at or above 1150 C. for less than 200 ms the internal graphitization of the diamonds can be limited. Although some of the diamonds in the sawing bead show internal graphitization it is demonstrated by the inventors that a sawing cord using the bead obtained by the method has an above standard sawing performance.

A diamond wire cutter, using an adjustable length pulley system, a diamond wire saw, and a movable pulley cart, can perform a through-cut of complete sections of a structure such as a tubular subsea by fitting a chain about an outer surface of the structure, securing the chain to the movable pulley cart and using the chain to move or otherwise guide the movable pulley cart about the outer circumference of the structure to cut while using a diamond wire to effect a cut between the movable pulley cart and the diamond wire saw.

An abrasive article includes a substrate comprising an elongated body, a first type of abrasive particle overlying the substrate, a bonding layer overlying the first type of abrasive particle, and a lubricious material overlying or integrated within the bonding layer.

An abrasive article includes a substrate having an elongated body, a plurality of discrete tacking regions defining a discontinuous distribution of features overlying the substrate, where at least one discrete tacking region of the plurality of discrete tacking regions includes a metal material having a melting temperature not greater than 450? C., a plurality of discrete formations overlying the substrate and spaced apart from the plurality of discrete tacking regions, and a bonding layer overlying the substrate, plurality of discrete tacking regions, and plurality of discrete formations.

A method for designing a diamond coated wire for use in a wafer slicing system includes adjusting an initial diamond size distribution until an intermediate diamond size distribution is generated, wherein the intermediate diamond size distribution has a corresponding simulated penetration thickness value less than or equal a predetermined penetration thickness value, and wherein penetration thickness is a parameter proportional to a depth of subsurface damage that would occur when slicing an ingot using a diamond coated wire having an associated diamond size distribution. The method may include adjusting the intermediate diamond size distribution until a final diamond size distribution is generated, wherein the final diamond size distribution has a maximum diamond grit size that is substantially equal to a predetermined maximum diamond grit size, and manufacturing the diamond coated wire such that the diamond coated wire has a plurality of diamond grits that fit the final diamond size distribution.

An abrasive article comprising an elongated body, a bonding layer overlying a surface of the elongated body, and abrasive grains contained within the bonding layer at an average abrasive grain concentration within a range between about 0.02 ct/m and about 0.30 ct/m.

An abrasive article including a substrate having an elongated body, a tacking layer overlying the substrate, and a first type of abrasive particle overlying the tacking layer and defining a first abrasive particle concentration at least about 10 particles per mm of substrate.

A method for slicing a workpiece into wafers by imparting axial reciprocating motion to a wire wound around a plurality of grooved rollers, and moving the workpiece relatively downwardly to press the workpiece against the reciprocating wire and feed the workpiece with the workpiece cut into while supplying a slurry to the wire, the method including the steps of: configuring each of the grooved rollers such that a distance from a bottom of grooves of the grooved roller to a rotating shaft of the grooved roller decreases gradually from a wire-supply side toward a wire-collection side; slicing the workpiece in such a manner that the workpiece is pressed against the wire on the wire-supply side before the workpiece is pressed against the wire on the wire-collection side.

A method of removing partially sintered powder from an internal passage in a metal component formed by electron beam additive manufacturing (EBAM) includes co-forming a solid wire cutter in the passage during the EBAM forming process and removing partially sintered powder from the cavity by extracting the cutter from the cavity.

Saw cords made of saw beads threaded on a steel cord, where the saw beads are separated by polymer spacers. The saw beads have a metal sleeve of which the outer surface is covered with an abrasive layer. The inner surface of the sleeve has with two sets of parallel grooves in a first and second axial part of the sleeve. The two sets of parallel grooves differ in at least one of the groove angle, the groove offset or the groove spacing, thereby preventing axial movement of the sleeve and blocking the rotation of the saw bead.