A wire electrical discharge machine for performing electrical discharge machining on a workpiece to be machined by applying voltage to an electrode gap formed between a wire electrode and the workpiece to generate electrical discharge at the electrode gap under predetermined machining conditions while conveying the wire electrode along a transfer path, includes: a wire breakage detector for detecting a breakage of the wire electrode; a position calculator for calculating the breakage position of the wire electrode in the transfer path; and an adjustment unit for adjusting the machining conditions when the breakage position is in a predetermined section of the transfer path.

A wire electrical discharge machine includes: a wire electrode cumulative moving time calculator for calculating a value correlated to a wire electrode cumulative moving time as a cumulative value of time for which a wire electrode has moved in each of multiple wire electrode moving regions which are defined by dividing a movable range of the wire electrode moving relative to a worktable; and a display control unit for displaying on a display unit the information on values correlated to the wire electrode cumulative moving time for respective wire electrode moving regions.

A wire electrical discharge machine includes: a wire electrode cumulative moving time calculator for calculating a value correlated to a wire electrode cumulative moving time as a cumulative value of time for which a wire electrode has moved in each of multiple wire electrode moving regions which are defined by dividing a movable range of the wire electrode moving relative to a worktable; and a display control unit for displaying on a display unit the information on values correlated to the wire electrode cumulative moving time for respective wire electrode moving regions.

A method of yielding a thinner product wafer from a thicker base SiC wafer cut from a SiC ingot includes: supporting the base SiC wafer with a support substrate: and while the base SiC wafer is supported by the support substrate, cutting through the base SiC wafer in a direction parallel to a first main surface of the base SiC wafer using a wire as part of a wire electrical discharge machining (WEDM) process, to separate the product wafer from the base SiC wafer, the product wafer being attached to the support substrate when cut from the base SiC wafer.

A method of yielding a thinner product wafer from a thicker base SiC wafer cut from a SiC ingot includes: supporting the base SiC wafer with a support substrate: and while the base SiC wafer is supported by the support substrate, cutting through the base SiC wafer in a direction parallel to a first main surface of the base SiC wafer using a wire as part of a wire electrical discharge machining (WEDM) process, to separate the product wafer from the base SiC wafer, the product wafer being attached to the support substrate when cut from the base SiC wafer.

A program editing device edits a machining program in which a machining path along which a wire electrode of a wire electrical discharge machine machines a workpiece is defined. The machining program includes a plurality of blocks corresponding to respective multiple partial paths into which the machining path is divided, each of the blocks including path information indicating the corresponding partial path. The program editing device includes an analyzer analyzing the machining program and thereby identifying a predetermined shape pattern formed by a series of the multiple partial paths in the machining path, an information generator generating shape information corresponding to the identified predetermined shape pattern, and an editor inserting the shape information into the machining program.

In wire-electrical discharge machine and a numerical control apparatus thereof and a numerical control apparatus for controlling a machine tool, optional minute blocks are automatically created in front of and behind a connecting point, which is a joint of a block to which an offset command is instructed, and an offset value is exchanged between the minute blocks so that a correct offset value is set in a desired block.

In wire-electrical discharge machine and a numerical control apparatus thereof and a numerical control apparatus for controlling a machine tool, optional minute blocks are automatically created in front of and behind a connecting point, which is a joint of a block to which an offset command is instructed, and an offset value is exchanged between the minute blocks so that a correct offset value is set in a desired block.

Provided is a wire electric discharge machine in which workpiece attaching and detaching unit attaches and detaches a workpiece to and from workpiece fixing unit, machining-reference-part detecting unit detects the position of a machining reference part of the workpiece, workpiece-positioning executing unit positions the workpiece in a position where the workpiece does not collide with machining-reference-part measuring unit, measurement-positioning executing unit positions the machining-reference-part measuring unit in a predetermined measurement start position, the machining-reference-part measuring unit measures the position of the machining reference part of the workpiece, and machining-reference-part-measurement executing unit executes a position measuring operation for the machining reference part of the workpiece using the machining-reference-part measuring unit.

A numerical controller controlling a wire electric discharge machining device of the present invention is configured to perform perpendicular setting of the wire electrode with respect to the workpiece while the wire electrode is inserted into and passed through a machining hole of a workpiece and calculate the inclination of the workpiece; drive an XY axis and detect short-circuit; obtain the diameter of the machining start hole; subsequently drive the upper wire guide and the lower wire guide respectively and detect the short-circuit and calculate the location of the center of the upper portion of the machining start hole and the location of the center of the lower portion of the machining start hole; and, based on these calculated values, calculate the correction amount for the workpiece on the upper wire guide surface of the upper wire guide and the correction amount for the workpiece on the lower wire guide surface of the lower wire guide.