A method is disclosed for manufacturing a substrate soldered by a solder agent, which contains solder and a contained material that can be boiled at a temperature below a melting temperature of the solder. The method includes: setting the substrate onto a heat generation body heated to a first predetermined temperature, which is lower than a boiling point of the contained material and higher than an ordinary temperature; increasing a temperature of the substrate, which is set on the heat generation body, to a second predetermined temperature, which is lower than the melting temperature of the solder and is a reduction-enabling temperature, to reduce an oxide on the substrate by a reducing agent; and, after reduction, heating the substrate to a third predetermined temperature, which is equal to or higher than the melting temperature of the solder, to melt the solder. A soldering device includes a heating section, a chamber, a reducing agent supply section, and a controller configured to control a temperature of the heating section and supply of the reducing agent into the chamber to execute the above-described manufacturing method.

Since the solder 106 temporarily remaining in the first region 301 is in a state of being high in curvature, it is in point contact with the semiconductor element 105 at the vertex of the solder 106. Thereafter, the solder 106 is gradually wetted and spread from the center part to the peripheral part and from the first region 301 to the second region 302 while the semiconductor element 105 is pressed against the solder 106. At this time, since the solder 106 wets and spreads while discharging air, generation of voids can be suppressed.

The present invention provides a laser soldering device including a transfer unit configured to transfer a plurality of objects, a solder unit configured to operate under control of the controller to solder the object positioned on the transfer unit, and form a bonding surface by performing the soldering by a laser beam, and at least one nozzle unit in which a solder ball to which the laser beam is irradiated is accommodated, in which the laser beam irradiated from the solder unit is eccentric with respect to a center line of the solder ball and adjusted to be irradiated.

A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.

The present disclosure provides a substrate bonding apparatus capable of temperature monitoring and temperature control. The substrate bonding apparatus comprises a fluid cooling module and a sensor module for detecting temperatures at multiple zones (e.g., two or more zones) within a substrate. The substrate bonding apparatus according to the present disclosure achieves temperature stabilization within the substrate. The substrate bonding apparatus further improves bonding process performance by reducing distortion residual, reducing bubbles on edges of the substrate, and reducing non-bonded area within the substrate.

A solder joint, for bonding an electrode of a circuit board to an electrode of an electronic component, that includes: an Sn—Bi-based solder deposited on the electrode of the circuit board; and a solder alloy deposited on the electrode of the electronic component. The Sn—Bi-based solder alloy has a lower melting point than the solder alloy deposited on the electrode of the electronic component. Fine Bi phases in the solder joint each have an area of less than or equal to 0.5 μm.sup.2. Coarse Bi phases in the solder joint each have an area of greater than 0.5 μm.sup.2 and less than or equal to 5 μm.sup.2. A proportion of the fine Bi phases among the fine Bi phases and the coarse Bi phases is greater than or equal to 60%.

A first flexible electronic circuit includes a non-conductive substrate and a conductive trace layer, including a bonding pad, on a surface of the non-conductive substrate. A second flexible electronic circuit likewise includes a substrate and a conductive trace layer, including a bonding pad, on a surface of the non-conductive substrate. The second flexible electronic circuit also includes a conductive interface layer on an opposite surface of the non-conductive substrate to the bonding pad. A plurality of vias, filled with conductive material, extend through the substrate of the second flexible electronic circuit and couple the conductive interface layer to the bonding pad. The bonding pads are brought in contact with each other, and energy (e.g., ultrasonic energy or thermal energy) is applied to the conductive interface layer until the bonding pads are bonded (e.g., ultrasonically welded or soldered) to each other.

An approach for transferring solder to a laminate structure in IC (integrated circuit) packaging is disclosed. The approach comprises of a device and method of applying the device. The device comprises of a substrate, a laser ablation layer and solder layer. The device is made by depositing a laser ablation layer onto a glass/silicon substrate and plenty of solder powder/solder pillar is further deposited onto the laser ablation layer. The laminate packaging substrate includes pads with a pad surface finishing layer made from gold. The solder layer of the device is bonded to the laminate packaging substrate. Once bonded, using laser to irradiate the laser ablation layer, the substrate is removed from the laminate.

A stencil printing system for printing solder paste on a base substrate to establish an electrical connection is provided. The system includes a stencil configured to removably attach or rest on an upper surface of the base. The stencil has an opening that provides access to the upper surface of the base. A squeegee spreads conductive paste across the stencil, whereupon the paste can be forced onto the upper surface of the base via the opening. In embodiments, the stencil has a stepped edge at the boundary of the opening. The stepped edge may include a platform or floor that sits lower than the upper surface of the stencil to collect the paste and reduce the amount of paste that falls back to the base as the stencil is removed. The squeegee may have a lower surface that extends oblique relative to the squeegee's leading surface and trailing surface.

A method for printed circuit board design rework utilizing two components in series, the method includes selecting a first chip component and a second chip component for placement on an original land location previously occupied by an original chip component. The method further includes placing the first chip component and the second chip component on a chip component support structure. The method further includes soldering a first end of the first chip component to a first end of the second chip component. Responsive to transferring the first chip component and the second chip component to the original land location, the method further includes soldering a second end of the first chip component to a first land of the original land location. The method further includes soldering a second end of the second chip component to a second land of the original land location.