A laser soldering device for laser soldering an electric circuit of a heating portion of an electronic cigarette, the soldering device including a head having an emitting area where a laser beam is emitted and a feeding device to feed a heating portion of an electronic cigarette along a feed path, where the heating portion faces the head at the emitting area. A movement device is operatively connected to the head to move the head between first and second points of the electric circuit such that the laser beam is perpendicular to the respective surface to be soldered at the first and second points to form first and second connections, respectively. The head generates two distinct pulses of the laser beam at the first and second points.

A method of bonding two components includes plating a first of the components with a first silver layer, a tin layer, and a second silver layer, plating a second of the components with silver, inserting the first and second components into a pre-heated press, and applying pressure to the components causing the components to bond. A stack of layers has a first component layer, a first silver layer, a tin layer, a second silver layer, a second component silver layer, and a second component layer.

A semiconductor device includes: a package including: a heat dissipating body comprising a metal, an insulting part surrounding the heat dissipating body, one or more semiconductor laser elements disposed on the heat dissipating body, at least one outer metal layer that is located on a lower surface of the insulting part and is spaced from a lower surface of the heat dissipating body; a mounting substrate including: at least one first metal pattern located at an upper surface of the mounting substrate, and a second metal pattern located at the upper surface of the mounting substrate; at least one first bonding member located between the at least one outer metal layer and the first metal pattern; and a second bonding member located between the lower surface of the heat dissipating body and the second metal pattern, wherein the second bonding member comprises a metal material.

A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.

A system for connecting electronic assemblies, in particular a soldering and/or sintering system, has a transport device for conveying the assemblies through the system, with a plurality of gas-tightly separable modules for connecting the assemblies to one another. At least one module is a soldering and/or sintering module and one module is a cooling module. Between the soldering/sintering and the cooling module, a further module is a soft cooling module for cooling between a process temperature of the soldering or sintering module and an intermediate temperature, in particular below a solder solidification temperature. In a soldering or sintering module in a gas-tightly sealable process chamber, in particular in the soft cooling module, at least one heat source is contactable with the assemblies for heating the assemblies and at least one cold trap is arranged, having in operation a surface temperature which is lower than a heat source operating temperature.

A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

A semiconductor assembly includes a substrate including a metal die attach surface, a semiconductor die that is arranged on the substrate, the semiconductor die being configured as a power semiconductor device and comprising a semiconductor body, a rear side metallization, and a front side layer stack, the front side layer stack comprising a front side metallization and a contaminant protection layer that is between the front side metallization and the semiconductor body, and a diffusion soldered joint between the metal die attach surface and the rear side metallization, the diffusion soldered joint comprising one or more intermetallic phases throughout the diffusion soldered joint, wherein the contaminant protection layer is configured to prevent transmission of contaminants into the semiconductor body.

Examples are disclosed related to forming solder joints between printed circuits by using radiant heat. One example provides a method of manufacturing an electronic device, the method comprising aligning a contact of a first printed circuit with a via of a second printed circuit. The method further comprises applying radiant heat via an infrared light source to a second surface of the second printed circuit, the radiant heat incident on the via to cause the via to conduct heat to solder located at an interface of the contact and the via, and after heating the solder to reflow, cooling the solder, thereby forming a solder joint between the contact of the first printed circuit and the via of the second printed circuit.

To suppress waste of bonding material in a printing device. A printing device includes a dispenser, a squeegee, and a controller. The dispenser individually feeds bonding material to a plurality of apertures formed in a mask. The squeegee moves with an edge portion pressed against the mask and prints the bonding material fed to the apertures from the dispenser on a substrate. The controller drive-controls the dispenser and the squeegee.

Systems and methods in which dot-like portions of a material (e.g., a viscous material such as a solder paste) are printed or otherwise transferred onto an intermediate substrate at a first printing unit, the intermediate substrate having the dot-like portions of material printed thereon is transferred to a second printing unit, and the dot-like portions of material are transferred from the intermediate substrate to a final substrate at the second printing unit. Optionally, the first printing unit includes a coating system that creates a uniform layer of the material on a donor substrate, and the material is transferred in the individual dot-like portions from the donor substrate onto the intermediate substrate at the first printing unit. Each of the first and second printing units may employ a variety of printing or other transfer technologies. The system may also include material curing and imaging units to aid in the overall process.