To provide a solder material capable of performing soldering with high reliability while suppressing materials other than a solder metal to remain inside the solder after the soldering. Coil-shaped carbons are heated by electromagnetic waves by using a solder material in which coil-shaped carbons of 0.5 weight % to 1.5 weight % with respect to a weight of a solder paste are mixed, thereby performing soldering by heating the solder material itself.

Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads.

An air data probe includes a probe head having an interior surface defining a cavity, a component positioned within the cavity of the probe head, a plurality of protrusions defining contact between the interior surface of the probe head and a peripheral surface of the component prior to brazing the component to the probe head, and a braze material located between the interior surface of the probe head and the peripheral surface of the component as a result of brazing the component to the probe head.

A method of manufacturing a terminal-formed electric wire includes a welding member placing process in which at least one welding member formed of metal having a melting point lower than that of a plurality of metal strands included in a core wire is arranged to the core wire of at least a terminal-forming target portion of the electric wire, and a terminal forming process in which the exposed terminal-forming target portion is interposed between first and second electrodes having a shape corresponding to a desired terminal shape, at least the welding member in the terminal-forming target portion is melted by electrically conducting the first and second electrodes while pressing the terminal-forming target portion with the first and second electrodes, and the melted metal is then solidified, so that the terminal-forming target portion is formed as a terminal portion having a desired terminal shape.

Circuit assemblies can be electrically interconnected by providing a circuit assembly having a top surface, a bottom surface, and a perimeter edge connecting the top and bottom surfaces, the perimeter edge being formed of insulative material and having a plurality of conductive features embedded in and exposed on the surface of the edge. The conductive features are arranged in contact sets, and each contact set is separated from adjacent contact sets by a portion of the perimeter edge that is free of conductive features. Each contact set includes conductive features that together form a distributed electrical connection to a single node. The insulative material is selectively removed to form recesses adjacent the conductive features exposing additional surface contact areas along lateral portions of the conductive features in the recesses.

Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are generally described. According to certain embodiments, PWBs comprising solder can be positioned within a rotatable housing. The rotatable housing can, in some embodiments, be at least partially immersed within a liquid heat medium. The liquid heat medium can be heated and/or maintained at a temperature sufficiently high to melt the solder. In some embodiments, the rotatable housing can be rotated while it is at least partially immersed in the liquid heat medium. The rotational force can aid, according to some embodiments, in the removal of solder, electronic chips (including those in which an integrated circuit is positioned on a piece of semiconductor material, such as silicon), and/or other electronic components attached to one or more surfaces of the PWB.

The present disclosure provides a method of forming a hermetically sealed enclosure that comprises a diamond material. The method comprises providing first and second enclosure components comprising the diamond material and having first and second recesses, respectively, at edge portions. At least one of the first and second enclosure components has a cavity. The enclosure components have respective contact surfaces at the first and second recesses and are shaped such that an outer channel is formed by the co-operation of the first and second recesses when the first and second enclosure components are contacted at the contact surfaces to form the enclosure. The method further comprises bonding a first type of material to at least surface portions of the first and second recesses of the first and second enclosure components, respectively. The method also comprises bonding a second type of material to the first type of material so that the second type of material covers at least portions of the first type of material. The second type of material is biocompatible and suitable for forming a hermetically sealed seal. In addition, the method comprises contacting the enclosure components to form the enclosure and bonding the second type of material of the first enclosure component to the second type of material of the second enclosure component so as to form a hermetically sealed seal in the outer channel.

A method for producing a wired circuit board, including an insulating layer having a first through portion passing through in a thickness direction thereof and a first terminal portion having a second through portion overlapped with the first through portion when projected in the thickness direction, includes the steps of providing a first bonding material at one surface in the thickness direction of the first terminal portion and allowing the first bonding material to flow from the one surface in the thickness direction of the first terminal portion toward the other surface in the thickness direction thereof into the second through portion by allowing the first bonding material to flow.

The disclosure relates to a brazing method for joining substrates, in particular where one of the substrates is difficult to wet with molten braze material. The method includes formation of a porous metal layer on a first substrate to assist wetting of the first substrate with a molten braze metal, which in turn permits joining of the first substrate with a second substrate via a braze metal later in an assembled brazed joint. Ceramic substrates can be particularly difficult to wet with molten braze metals, and the disclosed method can be used to join a ceramic substrate to another substrate. The brazed joint can be incorporated into a solid-oxide fuel cell, for example as a stack component thereof, in particular when the first substrate is a ceramic substrate and the joined substrate is a metallic substrate.

The present invention provides a power module substrate including an insulating substrate, a circuit layer which is formed on one surface of the insulating substrate, and a metal layer which is formed on the other surface of the insulating substrate, in which the circuit layer has a first aluminum layer made of aluminum or an aluminum alloy which is bonded to the insulating substrate and a first copper layer made of copper or a copper alloy which is bonded to the first aluminum layer by solid-phase diffusion, the metal layer has a second aluminum layer made of aluminum or an aluminum alloy, and a relationship between a thickness t.sub.1 of the circuit layer and a thickness t.sub.2 of the second aluminum layer of the metal layer satisfy t.sub.1<t.sub.2.