There is provided a method which includes placing a component on a substrate and extending an alignment member through an opening in the substrate. Once the alignment member is extended through the opening, the component is moved to abut against the alignment member to align the component relative to the substrate. After the component is aligned relative to the substrate, the component is secured to the substrate and the alignment member is retracted through the opening.

A die dipping structure includes a plate including a first recessed portion having a first depth and filled with a first flux material. The plate further includes a second recessed portion, isolated from the first recessed portion, with a second depth and filled with a second flux material. The second depth is different from the first depth. The die dipping structure further includes a motor configured to move the plate so as to simultaneously dip a first die and a second die into the flux of the first recessed portion and the flux of the second recessed portion, respectively.

A fan module for a soldering system and a soldering system, in particular for a reflow soldering system, for circulating air in a process channel of the soldering system, the module having a housing-like support part, a first shaft bearing provided in or on the support part, a motor, which includes a stator and a rotor which cooperates with the stator, a rotor shaft provided on the rotor, a fan wheel provided on the rotor shaft and having a second shaft bearing for supporting the rotor shaft, wherein the fan module includes a flange plate, which in the assembled state covers a channel opening in the process channel and which includes an aperture in or on which the second shaft bearing is provided.

This disclosure teaches methods for making high-temperature superconducting striated tape combinations and the product high-temperature superconducting striated tape combinations. This disclosure describes an efficient and scalable method for aligning and bonding two superimposed high-temperature superconducting (HTS) filamentary tapes to form a single integrated tape structure. This invention aligns a bottom and top HTS tape with a thin intervening insulator layer with microscopic precision, and electrically connects the two sets of tape filaments with each other. The insulating layer also reinforces adhesion of the top and bottom tapes, mitigating mechanical stress at the electrical connections. The ability of this method to precisely align separate tapes to form a single tape structure makes it compatible with a reel-to-reel production process.

Methods of forming a metallic-ceramic brazed joint are disclosed herein. The method of forming the brazed joint includes deoxidizing the surface of metallic components, assembling the joint, heating the joint to fuse the joint components, and cooling the joint. In certain embodiments, the brazed joint includes a conformal layer. In further embodiments, the brazed joint has features in order to reduce stress concentrations within the joint.

An approach for transferring solder to a laminate structure in IC (integrated circuit) packaging is disclosed. The approach comprises of a device and method of applying the device. The device comprises of a substrate, a laser ablation layer and solder layer. The device is made by depositing a laser ablation layer onto a glass/silicon substrate and plenty of solder powder/solder pillar is further deposited onto the laser ablation layer. The laminate packaging substrate includes pads with a pad surface finishing layer made from gold. The solder layer of the device is bonded to the laminate packaging substrate. Once bonded, using laser to irradiate the laser ablation layer, the substrate is removed from the laminate.

A brazing apparatus and method for brazing an anode target plate of an X-ray generator are disclosed. The brazing apparatus comprises: a vacuum part for providing, during brazing, a vacuum environment at least for a target plate main body formed of an alloy, a brazing material, and a substrate; an induction brazing part for applying an induction current to the target plate main body, the brazing material and the substrate in the vacuum part so as to achieve heating to a temperature higher than the melting point of the brazing material, causing the substrate to be welded to the target plate main body through melting of the brazing material and a resulting reaction; and a directional energy welding part for applying a generated directional energy beam to a position of lower temperature determined on the target plate main body to perform heating.

A device for inductively soldering at least one ferromagnetic contact element to at least one conductor structure on a nonmetallic plate, includes a system for fastening a plate during the soldering operation, at least one soldering tool having at least one induction loop or induction coil suitable for emitting a magnetic field, a system for mutually positioning the soldering tool and the contact element such that the switched-on magnetic field of the soldering tool reliably heats the ferromagnetic contact element and thus the solder joint, a generator that is suitable for generating an alternating voltage with a frequency of up to 1500 kHz and that can be connected to the induction loop or induction coil.

The present application discloses a reflow oven and the operation method thereof. The reflow oven can operate in air mode and inert gas mode. The reflow oven comprises a heating zone, a blocked exhaust zone and a cooling zone. The reflow oven further comprises a first pipeline, a second pipeline and a third pipeline. When the reflow oven operates in air mode, external clean air is delivered to the heating zone and is discharged from the heating zone and the blocked exhaust zone. When the reflow oven operates in inert gas mode, an inert gas is delivered from the blocked exhaust zone to the heating zone and is discharged from the heating zone. Satisfying the accurate temperature profiling necessary for reflow processing in the operation atmosphere of air or an inert gas, the reflow oven in the present application can effectively discharge volatile pollutants to reduce the number of follow-up services and maintenances. In addition, the reflow oven in the present application can save the expensive inert gas.

Provided is a multi-beam laser debonding apparatus for debonding an electronic component from a substrate, the apparatus including: a first laser module to emit a first laser beam to a predetermined range of a first substrate area including attachment positions of a debonding target electronic component and a neighboring electronic component to thereby heat a solder of the electronic components to reach a predetermined pre-heat temperature; and a second laser module to emit a second laser beam overlapping the first laser beam to a second substrate area smaller than the first substrate area, the second substrate area including the attachment position of the debonding target electronic component to thereby heat the solder of the debonding target electronic component to reach a debonding temperature at which the solder commences melting.