A rework process includes attaching a first bond head to a first semiconductor package. The contact pads of the first semiconductor package are bonded to contact pads of a second semiconductor package by solder joints. The rework process further includes performing a first local heating process to melt the solder joints, removing the first semiconductor package using the first bond head, and removing at least a portion of solder from the contact pads of the second semiconductor package.

A method for soldering hetero-junction with intrinsic thin layer solar cells together to form a string, includes soldering solar cells, and judging whether a temperature in a soldering chamber is within a preset temperature range every preset time; if the temperature is within the preset temperature range, continuing to solder; and if the temperature is beyond the preset temperature range, regulating the temperature in the soldering chamber to be within the preset temperature range, and continuing to solder the solar cells.

To provide a heating apparatus and a method for producing a plate-like object that can heat a heating target object uniformly. The heating apparatus includes a heater 10 for heating target object W, and a support member 20 disposed on a front face 11f of the heater 10 and for supporting a face Wf of the heating target object W. The support member 20 supports the heating target object W in such a manner that: the support member 20 prevents direct heat transfer between the face Wf and the support member 20; a clearance between the front face 11f and the face Wf is maintained in a predetermined clearance S, wherein the predetermined clearance S allows a fluid to be present in the clearance but does not induce convection of the fluid. The method includes supporting the heating target object W with the support member 20, and heating the heating target object W with the heater 10 to produce the plate-like object.

A device for soldering, in particular for reflow soldering, of at least one assembly, having a process chamber arrangement, comprises at least two process chambers for preparing a soldering method and/or for carrying out a soldering method and/or for post-processing a soldering method, wherein the at least two process chambers are arranged above one another, in particular in a stack-like manner.

A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.

A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.

An improved method for forming a capacitor is provided as is a capacitor, or electrical component, formed by the method. The method includes providing an aluminum containing anode with an aluminum oxide dielectric thereon; forming a cathode on a first portion of the aluminum oxide dielectric; bonding an anode lead to the aluminum anode on a second portion of the aluminum oxide by a transient liquid phase sintered conductive material thereby metallurgical bonding the aluminum anode to the anode lead; and bonding a cathode lead to said cathode.

An over-soldering prevented tabbing device for manufacturing solar cell modules is disclosed in which the over-soldering is prevented from occurring in the tabbing device for performing the soldering process in manufacturing the solar cell modules. The over-soldering prevented tabbing device according to an embodiment of the present disclosure includes a solar cell module cell that is transported on a conveyor by a unit of cell; a soldering head installed above the solar cell module cell and having a built-in heat source that provides heat to solder the flux coated on the transported solar cell module cell; a driver reciprocating the soldering head in a direction in which the conveyor moves; and a controller controlling the driver.

According to various embodiments, a particle containing structured solder material is provided as solder material for joining a solar cell connector with a solar cell. That is why for example, the light incident on the solder material is reflected diffusely and thus partially delivered back to the solar cell, whereby the light captured by the solar cell is increased. Less of the solar cell surface is shadowed based on the solder material or the solar cell connector.

A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.