Provided is a flip-chip laser bonding system for bonding a semiconductor chip in the form of a flip chip to a substrate using a laser beam. In the flip-chip laser bonding system, the semiconductor chip is laser-bonded to the substrate while pressure is applied to the semiconductor chip. Accordingly, even a semiconductor chip that is bent or is capable of being bent can be bonded to a semiconductor chip without contact failure.

The present invention relates to a method for process control in laser material processing and provides a method for process control and regulation in laser material processing, comprising generating at least two ST individual diagrams in the regions of interest of images of laser material processing and orienting the at least two ST individual diagrams in a previously determined pattern

Provided is an apparatus for attaching semiconductor parts. The apparatus includes a substrate loading unit, at least one semiconductor part loader, a first vision examination unit, at least one semiconductor part picker, at least one adhesive hardening unit, and a substrate unloading unit, wherein the substrate loading unit supplies a substrate on which semiconductor units are arranged, the at least one semiconductor part loader supplies semiconductor parts, the first vision examination unit examines arrangement states of the semiconductor units, the at least one semiconductor part picker mounts semiconductor parts in the semiconductor units, the at least one adhesive hardening unit hardens and attaches adhesives interposed between the semiconductor units and the semiconductor parts, and the substrate unloading unit releases the substrate on which semiconductor parts are mounted. The adhesive hardening units restrictively transmit a heat source only to at least one semiconductor unit, which is to be hardened.

There is provided a tool blade, comprising a backing strip particles of abrasive material and a binder layer of binding material which binds the abrasive particles along an edge of the backing strip, wherein the edge of the backing strip is pre-formed with teeth, on which the abrasive particles are bound by the binding material. A profiled cutting portion extends beyond the pre-formed teeth. The pre-formed teeth are shaped as generally triangular waves or are flattened at least partially along an upper edge on which the cutting portion is at least partially disposed. A method of making such a blade is also provided.

The disclosure discloses a manufacturing method of tempered vacuum glass, comprising the following steps: (1) manufacturing metalized layers, and performing tempering or thermal enhancement on the glass substrates; (2) placing a metal solder on the metalized layers; (3) superposing the glass substrates to form a tempered glass assembly; (4) heating the tempered glass assembly to 60-230° C.; (5) keeping the tempered glass assembly within the heating temperature range of step (4) in a vacuum chamber, and vacuumizing the vacuum chamber to a preset vacuum degree; and (6) hermetically sealing the metalized layers by adopting a metal brazing process. By adopting the manufacturing method of the disclosure, the stress when the two glass substrates are sealed can be greatly reduced, and the connection strength can be increased; moreover, when gas is exhausted within the temperature range, the exhaust efficiency is high, and the exhaust effect is better, vacuum glass with high vacuum degree can be obtained, and the service life of the vacuum glass is prolonged. The disclosure further discloses a tempered vacuum glass production line based on the above mentioned manufacturing method.

Beam-shaping laser optics are provided with a lens field (28) which comprises a plurality of first lenses (32) which are configured and arranged next to one another such that the plurality of first lenses (32) effect a beam shaping in a first direction (y) normal to an optical axis (x), as well as with an individual second lens (30) which is configured such that the individual second lens (30) effects a beam shaping in a second direction (z) normal to the optical axis as well (x) as well as the first direction (y). The lens field (28) and the second lens (30) are arranged in a beam path (12) one after the other along the optical axis (x). A laser system is provided with such beam optics.

A method for repairing a test contact arrangement in which a test contact which is disposed on a test contact carrier by means of solder material and is incorrectly positioned is gripped at a body edge by means of a gripping tool in a gripping contact phase, an absorption surface which is realized on an outer surface of the gripping tool is treated with laser radiation during the gripping contact phase, and the gripping tool performs a movement on at least one axis when the temperature is at the softening point of the solder material, in such a manner that the incorrect position is corrected by means of the movement to bring the test contact into a desired position.

In various examples, a component is for use in an implantable medical device. The component includes a pin including a first material attached to a lead including a second material different from the first material of the pin. At least a portion of the lead includes a channel in which at least a portion of the pin sits, the channel including a channel opening defined at least partially by opposing first and second channel sides extending a channel length. At least a first joint is formed along at least a portion of the first channel side. The first joint includes the second material of the lead deformed to at least partially close the channel opening to retain the pin within the channel to attach the lead to the pin. In some examples, the first material includes molybdenum and the second material includes aluminum.

A lead-free, antimony-free tin solder which is reliable at high temperatures and comprises up to 10 wt % Ag, up to 10 wt % Bi, up to 3 wt % Cu, other optional additives, balance tin, and unavoidable impurities.

In an embodiment, a method comprises: configuring a direct conversion compound semiconductor sensor over a first surface of a readout integrated circuit, IC, comprising two surfaces, each surface comprising solder material on the surface; illuminating the solder material with an infra-red laser such that the solder material on the readout IC melts and forms solder joints between the readout IC and the direct conversion compound semiconductor sensor; configuring a substrate over a second surface of the readout IC comprising solder material; and illuminating the solder material of the second surface with the infra-red laser such that the solder material on the readout IC melts and electrically connects the readout IC with the substrate. In other embodiments, a high frequency radiation detector and an imaging apparatus are discussed.