Reflow condensation soldering machine comprising a circulation system for a heat transfer medium, the reflow condensation soldering machine comprising the circulation system, a centrifuge and a condensation device for the heat transfer medium.

A reflow soldering system comprising one or a plurality of individually heatable soldering process zones. The reflow soldering system is configured to supply heat to a workpiece selectively through condensation or through convection or as a combination of convection and condensation.

A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.

A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.

A method of diffusion bonding utilizing vapor deposition comprises depositing a coating from a vapor comprising a temperature suppressant element onto a surface of a first component comprising a metal alloy, thereby forming a vapor deposited coating comprising the temperature suppressant element; assembling the first component with a second component comprising a mating surface to form an assembly, the vapor deposited coating contacting the mating surface; and exposing the assembly to a bonding temperature and a compressive force, thereby diffusion bonding the first component to the second component and forming a monolithic third component.

A method of diffusion bonding utilizing vapor deposition comprises depositing a coating from a vapor comprising a temperature suppressant element onto a surface of a first component comprising a metal alloy, thereby forming a vapor deposited coating comprising the temperature suppressant element; assembling the first component with a second component comprising a mating surface to form an assembly, the vapor deposited coating contacting the mating surface; and exposing the assembly to a bonding temperature and a compressive force, thereby diffusion bonding the first component to the second component and forming a monolithic third component.

In a vapor-phase type heating method, an object is heated by a heated gas containing vapor in a heating furnace. The heat transfer fluid falling from a front surface of the object to a lower portion of the heating furnace is collected, after the vapor comes into contact with the object and cools to liquefy and latent heat of vaporization of the vapor is applied to the object through phase change. The heated gas obtained after heating the object is discharged from an inside of the heating furnace to the circulation route. In the circulation route, the heat transfer fluid is supplied as droplets to the discharged heated gas and is vaporized after heating, and the heated gas including the vapor is supplied to the heating furnace.

In a vapor-phase type heating method, an object is heated by a heated gas containing vapor in a heating furnace. The heat transfer fluid falling from a front surface of the object to a lower portion of the heating furnace is collected, after the vapor comes into contact with the object and cools to liquefy and latent heat of vaporization of the vapor is applied to the object through phase change. The heated gas obtained after heating the object is discharged from an inside of the heating furnace to the circulation route. In the circulation route, the heat transfer fluid is supplied as droplets to the discharged heated gas and is vaporized after heating, and the heated gas including the vapor is supplied to the heating furnace.

A method for formation of a patterned solder mask (10) on a substrate is provided, in which method the mask is deposited by a process of chemical deposition in vapor phase. A method for manufacturing a printed circuit board and/or an electronic component comprising formation of said patterned solder mask is further provided.

A method for formation of a patterned solder mask (10) on a substrate is provided, in which method the mask is deposited by a process of chemical deposition in vapor phase. A method for manufacturing a printed circuit board and/or an electronic component comprising formation of said patterned solder mask is further provided.