An apparatus includes: a vapor generating chamber configured to accommodate a heat transfer fluid and to be filled with saturated vapor generated by the heat transfer fluid; a heater configured to heat the heat transfer fluid in the vapor generating chamber; a substrate stage configured to be movable upward or downward in the vapor generating chamber and to support a substrate on which an electronic device is mounted via a solder. The apparatus also includes at least one mesh plate extending in a horizontal direction in the vapor generating chamber. The at least one mesh plate includes a plurality of openings through which the vapor moves.

A solder reflow apparatus includes: a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate; a heater configured to heat the heat transfer fluid in the reflow chamber; a stage arranged in the reflow chamber to support the substrate; and a jig disposed on the electronic part and fixing the electronic part.

A solder reflow apparatus includes: a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate; a heater configured to heat the heat transfer fluid in the reflow chamber; a stage arranged in the reflow chamber to support the substrate; and a jig disposed on the electronic part and fixing the electronic part.

In a vapor-phase type heating method, an object is heated by a heated gas containing vapor in a heating furnace. The heat transfer fluid falling from a front surface of the object to a lower portion of the heating furnace is collected, after the vapor comes into contact with the object and cools to liquefy and latent heat of vaporization of the vapor is applied to the object through phase change. The heated gas obtained after heating the object is discharged from an inside of the heating furnace to the circulation route. In the circulation route, the heat transfer fluid is supplied as droplets to the discharged heated gas and is vaporized after heating, and the heated gas including the vapor is supplied to the heating furnace.

In a vapor-phase type heating method, an object is heated by a heated gas containing vapor in a heating furnace. The heat transfer fluid falling from a front surface of the object to a lower portion of the heating furnace is collected, after the vapor comes into contact with the object and cools to liquefy and latent heat of vaporization of the vapor is applied to the object through phase change. The heated gas obtained after heating the object is discharged from an inside of the heating furnace to the circulation route. In the circulation route, the heat transfer fluid is supplied as droplets to the discharged heated gas and is vaporized after heating, and the heated gas including the vapor is supplied to the heating furnace.

A vapor-phase type heating method includes: collecting, in the vapor tank, the heat transfer liquid which has come into contact with a heating target object, has cooled to liquefy, and has fallen down as droplets from a front surface of the heating target object to a lower portion of a heating furnace; resupplying, to the heating furnace, heated gas to which the vapor has been supplied and which has been formed by supplying the vapor from the vapor tank to heated gas obtained from heating the heating target object discharged from the heating furnace to a circulation pathway; and heating the heating target object, at a predetermined rate of temperature rise in a state of an even distribution of the vapor of the heat transfer liquid by maintaining the vapor of the heat transfer liquid in a predetermined amount in the heating furnace by the collection and the supply.

A vapor-phase type heating method includes: collecting, in the vapor tank, the heat transfer liquid which has come into contact with a heating target object, has cooled to liquefy, and has fallen down as droplets from a front surface of the heating target object to a lower portion of a heating furnace; resupplying, to the heating furnace, heated gas to which the vapor has been supplied and which has been formed by supplying the vapor from the vapor tank to heated gas obtained from heating the heating target object discharged from the heating furnace to a circulation pathway; and heating the heating target object, at a predetermined rate of temperature rise in a state of an even distribution of the vapor of the heat transfer liquid by maintaining the vapor of the heat transfer liquid in a predetermined amount in the heating furnace by the collection and the supply.

A device for soldering, in particular for reflow soldering, of at least one assembly, having a process chamber arrangement, comprises at least two process chambers for preparing a soldering method and/or for carrying out a soldering method and/or for post-processing a soldering method, wherein the at least two process chambers are arranged above one another, in particular in a stack-like manner.

A device for soldering, in particular for reflow soldering, of at least one assembly, having a process chamber arrangement, comprises at least two process chambers for preparing a soldering method and/or for carrying out a soldering method and/or for post-processing a soldering method, wherein the at least two process chambers are arranged above one another, in particular in a stack-like manner.

In a method of manufacturing an electronic device, a substrate having a plurality of bonding pads formed on a first surface of the substrate is provided. Solder balls are attached on the bonding pads respectively. At least one radiant heating cover is disposed on the first surface of the substrate to cover the solder balls. The substrate on which the at least one radiant heating cover is disposed is loaded into a vapor generating chamber that accommodates a heat transfer fluid therein. The heat transfer fluid is heated to form the heat transfer fluid in a vapor phase within the chamber. The solder balls are soldered by transferring heat generated when the heat transfer fluid in the vapor phase is brought to contact a surface of the radiant heating cover and condenses toward the solder balls as radiant heat emitted from the radiant heating cover.