A soldering apparatus for selective soldering, comprising a solder bath for holding the molten solder at least one solder nozzle a solder pump for conveying solder from the solder bath through the solder nozzle a movement device for the relative movement of the solder nozzle and an assembly to be soldered
wherein several solder nozzles are provided in several solder nozzle assemblies, with each solder nozzle assembly having one or more solder nozzles and wherein each solder nozzle assembly may be assigned an assembly, and the movement device is designed for synchronous movement of the several solder nozzle assemblies relative to the respective assemblies in the horizontal X-Y plane, and the soldering machine is so designed that the individual solder nozzle assemblies and the respective assemblies may be moved towards one another and independently of one another in the vertical direction (Z-direction) by means of a coupling device.

Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

The invention relates to a soldering module (3) for the, in particular selective, soldering of components to a circuit board (14), having a soldering nozzle (32) for creating a solder wave. It is proposed that the soldering module (3) comprises a linear conveyor (8), in particular a belt conveyor or a chain conveyor, for applying solder to the circuit board (14) by moving the circuit board (14) in a conveying direction over the solder wave, and that the linear conveyor (8) is tiltable, in particular about a first tilting axis (23).

A flux comprising one or more amines which is especially useful as a solder flux in soldering operations involving reactive metals such as aluminum; and a process for making aluminum surfaces solderable using the flux and conventional solders.

The present disclosure teaches a method for manufacturing a module comprising an integrated circuit and a sensor. The method may comprise: mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnects of the PCB and the die; and printing a sensor directly onto the module after all high temperature mounting processes are complete.

A wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a reservoir of solder material, and an adjustable wave solder nozzle assembly adapted to create a solder wave. The adjustable wave solder nozzle assembly has a first curve plate and a second curve plate that together define a nozzle. The second curve plate is movable with respect to the first curve plate between a close proximate position in which the second curve plate is proximate the first curve plate and a spaced apart position in which the second curve plate is spaced from the first curve plate to adjust a width of the nozzle.

A soldering module for a soldering system for selective wave soldering, having at least one first and one second solder pot, wherein the solder pots are displaceable along an x-axis by means of an x-axis drive, along a y-axis by means of a y-axis drive, and along a z-axis by means of a z-axis drive, wherein the axes are all arranged orthogonally in relation to each other; wherein two y-axis drives and two moving devices are provided on which the solder pots are displaceable along the y-axis by means of the y-axis drives; wherein a first moving device is associated with the first solder pot, and wherein a second moving device which is different from the first moving device is associated with the second solder pot.

An apparatus for increasing solder hole-fill in a printed circuit board assembly (PCBA) are provided in the illustrative embodiments. In the PCBA comprising a Printed Circuit Board (PCB) and the device, a pin of a device is caused to move in a first direction, the pin occupying a hole in the PCB, the hole being filled to a first distance by a solder material. By causing the pin to move, the solder material is drawn into the hole up to a second distance that is greater than the first distance. The pin is allowed to move in a second direction, to return the pin to an initial position in the hole. Allowing the pin to move in the second direction keeps the solder material at a third distance, wherein the third distance is greater than the first distance in the hole.

An example method of calibrating the operation of soldering apparatus for use in a soldering machine, in which the soldering apparatus includes at least one nozzle which is configured to apply solder to an electronics board, in use, involves: providing machine settings to the soldering apparatus, the machine settings including a nozzle target calibration position and at least one solder setting for the at least one nozzle; positioning the at least one nozzle according to the nozzle target calibration position; pumping solder from the at least one nozzle according to the at least one solder setting, when the at least one nozzle is positioned according to the target calibration position; obtaining at least one image of the soldering apparatus when the at least one nozzle is positioned according to the nozzle target calibration position; determining, from the at least one image, at least one nozzle characteristic; and adjusting the machine settings to reduce a difference between the at least one nozzle characteristic determined from the at least one image, and a corresponding expected at least one nozzle characteristic.

A soldering device, in particular a soldering crucible for selective flow soldering, having a solder reservoir which is designed for storing a solder, in particular a molten solder, with a soldering nozzle and with a solder pump which is designed for conveying the solder out of the solder reservoir through the soldering nozzle, wherein the soldering device has an upper part and a lower part, wherein the upper part is releasably connectable to the lower part, and comprises the solder reservoir and the soldering nozzle, wherein a feed channel of the solder pump is disposed in the upper part and a device for generating a moving magnetic field of the solder pump is disposed in the lower part, designed (said device for generating a moving magnetic field) for generating a moving magnetic field along the feed channel.