A soldering system for processing at least one printed circuit board. The system comprises a first solder pot and a second solder pot, each configured to move within a movement plane. At least one of the first solder pot and the second solder pot is further configured to rotate about a solder pot axis extending transverse to the movement plane. The first solder pot and the second solder pot can be moved relative to the at least one printed circuit board, and at least one of the first solder pot and the second solder pot can be rotated about its solder pot axis relative to the at least one printed circuit board, to simultaneously process the at least one printed circuit board using both solder pots. The soldering system may thus be used to process either a single printed circuit board with both solder pots simultaneously or a pair of printed circuit boards simultaneously with each solder pot processing one of the pair of printed circuit boards. A corresponding soldering method is also disclosed.

The invention relates to a selective soldering plant for the soldering of electronic circuit boards, at least one container for liquid solder, a soldering arrangement with at least one soldering nozzle and at least one pump for conveying the liquid solder to the soldering arrangement being provided, an inner shielding device for at least partially shielding the soldering arrangement upwardly with regard to a gas flow being provided above the soldering arrangement, and an inflow device being provided, through which gas, in particular protective gas, can in any event flow into the region below the inner shielding device. It is proposed that an outer shielding device for at least partially shielding the inner shielding device upwardly with regard to a gas flow be provided.

A wave soldering machine is configured to perform a wave soldering operation on a printed circuit board. The wave soldering machine includes a housing and a conveyor coupled to the housing. The conveyor is configured to deliver a printed circuit board through the housing. The wave soldering machine further includes a wave soldering station coupled to the housing. The wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave. The wave soldering nozzle assembly is configured to control a width of the solder wave through the solder distribution baffle to produce a maximum width solder wave and a minimum width solder wave.

A jet soldering apparatus includes a first housing; a first supply port provided on the first housing and configured to provide first molten solder; a second housing; and a second supply port provided on the second housing and configured to provide second molten solder. The jet soldering apparatus is configured to mix the first molten solder and the second molten solder so as to obtain mixed molten solder. The jet soldering apparatus is configured to provide the mixed molten solder such that the mixed molten solder is not separated from a substrate conveyed by a conveyance unit between the first supply port and the second supply port.

A wave soldering station includes a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The wave soldering nozzle assembly has a solder distribution baffle configured to create a solder wave, a throttle gate coupled to the flow duct and configured to move from an open position to enable complete flow of solder through the solder distribution baffle and a closed position to inhibit a portion of flow of solder through the solder distribution baffle, and an exit wing coupled to the flow duct and configured to move from a lowered position to enable increased solder flow and a raised position to decrease solder flow. A controller is configured to control the movement of the throttle gate and the exit wing to control the flow of solder.

A solder removing mechanism 520 is a solder removing mechanism for removing solder from conveyance claws 510 for conveying a substrate 200 to which the solder is supplied. The solder removing comprise an abutment body 530 that can relatively pass through recesses 511 of the conveyance claws 510 or below the conveyance claws 510.

The present application provides a position detection apparatus, comprising a bottom plate, an abutting member, a trigger member, a trigger member, and a distance sensor. The abutting member is movably disposed on the bottom plate. The trigger member is connected to the abutting member. The induction member is disposed on the trigger member. The distance sensor is disposed on the bottom plate. The induction member and the distance sensor are disposed such that: the distance sensor is capable of detecting a movement distance of the induction member when the abutting member drives the induction member to move, and wherein the trigger member bypasses the distance sensor. The position detection apparatus of the present application has a higher detection accuracy of relative movement of the induction member to the distance sensor.

A wave soldering machine performs a wave soldering operation on an electronic substrate. The wave soldering machine includes a wave soldering station having a solder pot having a reservoir of solder material, a flow duct positioned in the reservoir of the solder pot, and a wave soldering nozzle assembly coupled to the flow duct. The nozzle assembly is configured to generate a solder wave. The wave soldering machine further includes a conveyor configured to deliver an electronic substrate to the wave soldering station, at least one first gas diffuser configured to supply gas to pass over the solder wave on each side of the solder wave and to provide a gas blanket over the solder wave, and at least one second gas diffuser configured to supply gas below the solder wave on each side of the solder wave and to provide a gas blanket under the solder wave.

A wave soldering machine includes a wave soldering station configured to create a solder wave used to perform the wave soldering operation on the printed circuit board. The wave soldering machine further includes a finger conveyor system configured to deliver a printed circuit board to the wave soldering station. The finger conveyor system includes at least one chain conveyor including a chain having a plurality of fingers configured to support an edge of the printed circuit board. The finger conveyor system further includes a finger detection system having a tension roller assembly configured to engage each finger of the plurality of fingers. The tension roller assembly further is configured to move in response to engaging a finger in a non-operational position. The finger conveyor system further includes a sensor configured to detect movement of the tension roller assembly to the non-operational position.

A wave soldering station of a wave soldering machine includes a flow duct positioned in a reservoir of a solder pot, and a core frame supported by the flow duct. The wave soldering station further includes a first pump to deliver solder material to a first chamber, a second pump to deliver solder material to a second chamber, and a wave soldering nozzle assembly supported by the core frame. The wave soldering nozzle assembly includes a solder distribution baffle to create a solder wave, and an exit wing coupled to the core frame and configured to move from a lowered position to enable increased solder flow and a raised position to decrease flow of solder material. The first pump, the second pump and the exit wing are configured to control the flow of solder through the solder distribution baffle to vary a contact length of the solder wave.