Solder joints comprising two different solder materials having different melting points, an outer solder material extending over an inner solder material bonded to a conductive pad, the inner solder material having a lower melting point than a melting point of the outer solder material and being in a solid state at substantially ambient temperature. A metal material having a higher melting point than a melting point of either solder material may coat at least a portion of the inner solder material. Microelectronic components, assemblies and electronic systems incorporating the solder joints, as well as processes for forming and repairing the solder joints are also disclosed.

The present invention relates to a method for manufacturing a battery stack cooling plate for an electric vehicle, the method comprising: a plastic working step for plastic working each of an upper plate and a lower plate which are made of a clad material and constitute a cooling plate; a preheating step for preheating each of the upper plate and the lower plate; a coating step for coating a flux on the upper plate and the lower plate; and a brazing step for heating the upper plate and the lower plate in a state where the clad materials of the upper plate and the lower plate are in contact with each other, so as to bond the upper plate and the lower plate together.

An electronic device is described wherein the electronic device comprises a substrate with a first conductive metal layer and a second conductive metal layer. A first microphonic noise reduction structure is in electrical contact with the first conductive metal layer wherein the first microphonic noise reduction layer comprises at least one of the group consisting of a compliant non-metallic layer and a shock absorbing conductor comprising offset mounting tabs with a space there between coupled with at least one stress relieving portion. An electronic component comprising a first external termination of a first polarity and a second external termination of a second polarity is integral to the electronic device and the first microphonic noise reduction structure and the first external termination are adhesively bonded by a transient liquid phase sintering adhesive.

A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

A method of joining and sealing a vanadium based membrane to a metallic connection section comprising: mounting a section of a vanadium based membrane on a connector formation of a connection section, the connection section being formed of a different metal to the vanadium based membrane, the connector formation providing a recess into which a section of the vanadium based membrane is seated and a connection interface in which the end face of the vanadium based membrane is proximate to or substantially abuts an adjoining face of the connector formation; mounting and operating a chiller arrangement in thermal contact with vanadium based membrane proximate the connection interface; heating a filler metal on the connection section to at least the liquidus temperature of the filler metal using a laser beam directed onto the filler metal located on the connection section and having a beam edge positioned at an offset location spaced apart from the connection interface a distance that attenuates direct heating of the vanadium based membrane by the laser beam, and on the connection section, such that the filler metal can flow over the connection interface from the offset location onto the vanadium based membrane; and cooling the filler metal to form a bridging section of filler metal between the vanadium based membrane and connection section over the connection interface.

The present invention provides a method for manufacturing an electronic device including a base material that has an exposed metal portion on a surface of the base material and an electronic component that is provided on the base material. The method includes a flux treatment step of treating the exposed metal portion with a flux by bringing the exposed metal portion into contact with the flux and an introduction step of introducing a resin composition such that the resin composition comes into contact with a surface of the exposed metal portion treated with the flux. The flux contains a rosin, an activator, and a solvent. The content of the rosin is equal to or greater than 1 part by mass and equal to or smaller than 18 parts by mass with respect to 100 parts by mass of the flux. The percent change in mass of the flux before and after a heating treatment is equal to or lower than 21% by mass. The resin composition contains an epoxy resin and a phenolic resin curing agent. In a case where SP1 represents a Hansen's method-based average solubility parameter of a resin group consisting of the epoxy resin and the phenolic resin curing agent in the resin composition, and Mn1 represents a number average molecular weight of the resin group, SP1 and Mn1 satisfy Mn1≤210×SP1−4,095.

A brazing material outer coat and a method for preparing the same, an in-situ synthetic metal-coated flux-cored silver brazing material and a method for preparing the same, a welding method and a joint body, wherein the in-situ synthetic metal-coated flux-cored silver brazing material comprises a flux core and a brazing material outer coat wrapping the flux core, the brazing material outer coat comprises, in percentage by weight: silver Ag 20.0˜36.0%, copper Cu 35.0˜45.0%, zinc Zn 27.0˜37.0%, tin Sn 1.0˜3.0%, phosphorus P 0.1%˜0.5%, nickel Ni 0.5˜2.0%, germanium Ge 0.1˜0.3%, and lithium Li 0.1˜0.3%, the flux core comprises, in percentage by weight: elemental boron micropowder 5.0˜10.0%, sodium borohydride 5.0˜10.0%, potassium fluoroborate 15.0˜30.0%, boric anhydride 25.0˜40.0%, sodium fluoride 10.0˜30.0%, sodium bifluoride 2.0˜4.0%, and copper sulfate 1.0˜5.0%. The in-situ synthetic metal-coated flux-cored silver brazing material in the present disclosure realizes self-reaction in a brazing process to coat a layer of copper film on a surface of a brazed metal, the core of the brazing material has good wettability, good flowability, self-brazing function, and zinc being hard to volatilize, the flux coat has high activity, low hygroscopicity, few carbon residues, good plasticity and toughness, etc. The present disclosure is particularly suitable for brazing pipeline components of stainless steel, manganese brass and so on.

A solder joint in which an electronic component with a back metal is bonded to a substrate by a solder alloy. The solder alloy includes: a solder alloy layer having an alloy composition consisting of, in mass %: Ag: 2 to 4%, Cu: 0.6 to 2%, Sb: 9.0 to 12%, Ni: 0.005 to 1%, optionally Co: 0.2% or less and Fe: 0.1% or less, with the balance being Sn; an Sn—Sb intermetallic compound phase; a back metal-side intermetallic compound layer formed at an interface between the back metal and the solder alloy; and a substrate-side intermetallic compound layer formed at an interface between the substrate and the solder alloy. The solder alloy layer exists at least one of between the Sn—Sb intermetallic compound phase and the back metal-side intermetallic compound layer, and between the Sn—Sb intermetallic compound phase and the substrate-side intermetallic compound layer.

The invention concerns a flux for brazing, a process for brazing metal parts employing said flux, a flux composition containing said flux, aluminum parts coated with said flux or said flux composition, a process for brazing and a brazed metal object obtainable by said brazing process. The flux is high in KAlF.sub.4 and low in K.sub.3AlF.sub.6.

The present application provides a reflow oven (100) and a gas recovery method. The reflow oven (100) comprises a reflow oven hearth (101), a separator (105), the separator inlet (110) being connected to the gas outlet (102) of the reflow oven hearth (101) so that the gases in the reflow oven hearth (101) can flow into the separator (105), a zeolite box (107), the zeolite box inlet (112) being connected to the separator outlet (111), and the zeolite box outlet (113) being connected to the gas inlet (103) of the reflow oven hearth (101) so that the gases flowing through the separator (105) can enter the zeolite box (107) and the gases flowing through the zeolite box (107) can flow out of the zeolite box outlet (113), a sensor (106), which is provided in the gas passage between said zeolite box outlet (113) and the gas inlet (103) of the reflow oven hearth (101). The reflow oven (100) in the present application enables the gases flowing through the separator (105) to enter the zeolite box (107). After most of the flux is removed from the gases in the separator (105), the flux is further removed in the zeolite box (107). In addition, polygonal zeolites have certain volumes and are supported in the zeolite box (107) to form clearances, and thus almost no resistance is brought about to the flow of the gases in the zeolite box (107).