A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

A closed socket brazed joint assembly is provided. The assembly comprises: a first member composed of a first base material; a second member composed of a second base material with a first end composed of a first profile with at least first and second faying surfaces; a socket formed in said first member configured to receive the first end of the second member with a faying surface with at least two portions separated by a first fillet; wherein the socket further is configured such that in a first state before the application of energy to the joint there is a gap with a width between the faying surfaces of the first member and the faying surfaces of the second member; and, in the first state a slug of brazing fill material is disposed between the first end of the second member and at least one faying surface of the socket; and, wherein a second state is created when upon application of energy the brazing fill material melts and flows from between first end of the second member and the at least one faying surface of the socket filling aforesaid gap between the faying surfaces of the first and second members.

A method of making a semiconductor including soldering a conductor to an aluminum metallization is disclosed. In one example, the method includes substituting an aluminum oxide layer on the aluminum metallization by a substitute metal oxide layer or a substitute metal alloy oxide layer. Then, substitute metal oxides in the substitute metal oxide layer or the substitute metal alloy oxide layer are at least partly reduced. The conductor is soldered to the aluminum metallization using a solder material.

The present invention discloses a solder paste laser induced forward transfer device and method. The device comprises a laser, a beam shaping module, an optical path adjustment module, a solder paste transfer module and a computer control system, wherein the laser is connected to the beam shaping module, followed by the optical path adjustment module, and the solder paste transfer module is located below the optical path adjustment module. The beam shaping module comprises a beam expanding lens, an aperture, a flat-top beam shaper and a spatial light modulator. The optical path adjustment module comprises a two-dimensional galvanometer and an f- lens. The solder paste transfer module consists of a transparent substrate, a solder paste film, a clamp, a Z-axis lifting table, a receiving substrate, and an XYZ precise moving platform. The computer control system consists of a computer and drivers of other devices. The device and method can achieve mask-free, non-contact and high-precision solder paste transfer, thereby greatly shortening the production cycle and reducing the production cost.

A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.

A nanoparticle powder is disclosed including a plurality of stabilized nanoparticles having a superalloy composition. At least about 90% of the particles have a convexity between about 0.980-1 and a circularity between about 0.850-1. A method for forming a braze paste is disclosed including mixing the plurality of stabilized nanoparticles with at least one organometallic precursor and up to about 5 wt % binder. A method for modifying an article is disclosed including applying the braze paste to a substrate including at least one crack, removing at least about 70% of the binder in the braze paste, and then applying additional braze paste over the first portion. Under vacuum or inert gas atmosphere, essentially all remaining binder is evaporated. The braze paste is brazed to the article at about 40-60% of the superalloy's bulk liquidus temperature, forming a brazed material and thereby sealing the at least one crack.

A system for flux residue detection is provided. The system includes a flux heater, where the flux heater controls a temperature of a flux spray applied to a printed circuit board, and an infrared camera, wherein the infrared camera provides a thermal image of the flux on the printed circuit board. A method, a computer system, and a computer program product for flux residue detection is provided, including setting flux application parameters, applying flux to a printed circuit board, and capturing an infrared image of the flux applied to the printed circuit board. A method, a computer system, and a computer program product for flux residue detection is provided, including setting flux application parameters, applying flux to a printed circuit board, capturing an infrared image of the flux applied to the printed circuit board, and determining there is excess flux residue on the printed circuit board.

The invention relates to a method for connecting components, comprising the following steps: (1) applying a metal paste containing an organic solvent to the contact surface of a first component; (2) optionally applying the metal paste to the contact surface of a second component to be connected to the first component; (3) producing a sandwich arrangement with the two components and a layer of the metal paste in-between; (4) drying the layer of metal paste between the components; and (5) pressureless sintering of the sandwich arrangement comprising the layer of dried metal paste, the drying and the pressureless sintering being performed by irradiation with IR radiation with a peak wavelength in the wavelength range of between 750 and 1500 nm. The components can be selected from the group consisting of substrates, active components and passive components. One or both of the components can be permeable to IR radiation. Step (4) and/or step (5) can be carried out in an atmosphere containing oxygen or an oxygen-free atmosphere. In both cases, at least one of the components can have an oxidation-sensitive contact surface.

A solder scattering is prevented at the time of reflow and the oxide films formed on the surfaces of solder or electrodes are thoroughly removed. The soldering method according to the present invention contains the steps of: applying solder paste to the electrode on a printed circuit board and mounting an electronic part on the solder paste, volatilizing the residue-free flux contained in the solder paste by heating the printed circuit board in a chamber set to be a vacuum state and approximately 180 degree C. at the time of pre-heating (interval A), removing oxide films formed on the electrode and the like by heating the printed circuit board in the chamber set to be a formic acid atmospheric state and the temperature of approximately 200 degree C. at the time of reducing (interval B), and melting solder powder contained in the solder paste by heating the printed circuit board in the chamber set to be a vacuum state and the temperature of 250 degree C. at the time of main heating (interval C).

A process for brazing of aluminium magnesium alloys is described applying a flux which comprises KAlF.sub.4 or CsAlF.sub.4 or both as major constituent. The flux further comprises at least one alkaline or alkaline earth metal compound selected from the group consisting of KAlF.sub.4, CsAlF.sub.4, Li.sub.3AlF.sub.6, CaF.sub.2, CaCO.sub.3, MgF.sub.2, MgCO.sub.3, SrF.sub.2, SrCO.sub.3, BaF.sub.2, and BaCO.sub.3. Preferably the flux comprises or consists of KAlF.sub.4, CsAlF.sub.4, and Li.sub.3AlF.sub.6 and optionally contains also BaF.sub.2.