The present application relates to a reflow soldering oven (1) for soldering an electronic circuit board (300), the oven (1) comprising a gas purification system (11, 21) for purifying gas that contains flux components vaporized from the electronic circuit board (300). The gas purification system further comprises at least one gas purification unit (11, 21) comprising a catalyst unit comprising a catalyst material. The invention further relates to a corresponding reflow soldering method.

A process for brazing of aluminium magnesium alloys is described applying a flux which comprises KAlF.sub.4 or CsAlF.sub.4 or both as major constituent. The flux further comprises at least one alkaline or alkaline earth metal compound selected from the group consisting of KAlF.sub.4, CsAlF.sub.4, Li.sub.3AlF.sub.6, CaF.sub.2, CaCO.sub.3, MgF.sub.2, MgCO.sub.3, SrF.sub.2, SrCO.sub.3, BaF.sub.2, and BaCO.sub.3. Preferably the flux comprises or consists of KAlF.sub.4, CsAlF.sub.4, and Li.sub.3AlF.sub.6 and optionally contains also BaF.sub.2.

A method and a system of balancing a shaft for an axle assembly. The method may include using an electrical resistance welder to weld a balance weight to a shaft proximate an imbalance location using an insert or brazing material. The insert material may have a lower liquidus temperature than a liquidus temperatures of the shaft and balancing weight.

A method of pretinning a guidewire core made of shape memory alloy and having an elongate axis, comprising: placing a ball of solder in a pocket in a soldering block; melting the ball of solder; holding a guidewire core over the ball of solder; lowering the guidewire core into the ball of solder; removing the guidewire from the ball of solder.

Provided is a flux for resin-cored solder that is used in resin-cored solder that is supplied into a through hole formed along a central axis of a soldering iron. The flux includes 60% by mass to 99.9% by mass of a rosin ester to a total mass of the flux, 0.1% by mass to 15% by mass of a covalent halogen compound to the total mass of the flux, and more than 0% by mass to 10% by mass of rosin amine, N,N-diethyloctylamine, or rosin amine and N,N-diethyloctylamine to the total mass of the flux.

A structure, such as a cable assembly, is provided that has a Nb/Ti substrate and a metal layer electroplated on a portion of the Nb/Ti substrate, wherein the metal layer has a metal capable of being soldered to, such as copper, and a metal coaxial connector soldered to the metal layer.

A solder material having a good thermal-cycle fatigue property and wettability. The solder material contains not less than 6.0% by mass and not more than 8.0% by mass Sb, not less than 3.0% by mass and not more than 5.0% by mass Ag, and the balance of Sn and incidental impurities. Also, a semiconductor device may include a joining layer between a semiconductor element and a substrate electrode or a lead frame, the joining layer being obtained by melting this solder material.

Examples are disclosed related to forming solder joints between printed circuits by using radiant heat. One example provides a method of manufacturing an electronic device, the method comprising aligning a contact of a first printed circuit with a via of a second printed circuit. The method further comprises applying radiant heat via an infrared light source to a second surface of the second printed circuit, the radiant heat incident on the via to cause the via to conduct heat to solder located at an interface of the contact and the via, and after heating the solder to reflow, cooling the solder, thereby forming a solder joint between the contact of the first printed circuit and the via of the second printed circuit.

A solder scattering is prevented at the time of reflow and the oxide films formed on the surfaces of solder or electrodes are thoroughly removed. The soldering method according to the present invention contains the steps of: applying solder paste to the electrode on a printed circuit board and mounting an electronic part on the solder paste, volatilizing the residue-free flux contained in the solder paste by heating the printed circuit board in a chamber set to be a vacuum state and approximately 180 degree C. at the time of pre-heating (interval A), removing oxide films formed on the electrode and the like by heating the printed circuit board in the chamber set to be a formic acid atmospheric state and the temperature of approximately 200 degree C. at the time of reducing (interval B), and melting solder powder contained in the solder paste by heating the printed circuit board in the chamber set to be a vacuum state and the temperature of 250 degree C. at the time of main heating (interval C).

An applying apparatus according to one embodiment of the invention includes an application liquid nozzle, a wall and an air nozzle. The application liquid nozzle sprays an application liquid onto a predetermined area of a board. The wall is arranged so as to surround the predetermined area of the board, and includes a flow channel through which the application liquid that has been sprayed from the application liquid nozzle flows to the predetermined area. The air nozzle is provided adjacent to the wall, and sprays air onto the board.