A metallic tubular member having a closed end member for use in heating, ventilation, and air conditioning (HVAC) systems or refrigeration systems and method of manufacturing are presented. In one instance, the method includes providing a metallic tubular stock member having a first end and a second end, wherein the first end is open and closing the first end of the metallic tubular stock member to form a first closed circular member having an outside diameter D.sub.1; forming a sealing aperture having an outside diameter D.sub.2 through the first closed circular end, wherein D.sub.2 is less than 5 percent of D.sub.1; and applying a heat-based sealing process including a metallic flow into the sealing aperture. Other methods and systems are presented.

A composition for use in an electronic assembly process, the composition comprising a filler dispersed in an organic medium, wherein: the organic medium comprises a polymer; the filler comprises one or more of graphene, functionalized graphene, graphene oxide, a polyhedral oligomeric silsesquioxane, graphite, a 2D material, aluminum oxide, zinc oxide, aluminum nitride, boron nitride, silver, nano fibers, carbon fibers, diamond, carbon nanotubes, silicon dioxide and metal-coated particles, and the composition comprises from 0.001 to 40 wt. % of the filler based on the total weight of the composition.

Disclosed is a method for attaching an interconnector of a solar cell panel. The method includes forming a flux layer by spraying flux over the interconnector via spraying, the interconnector including a core layer and a solder layer formed on a surface of the core layer, and attaching the interconnector to a solar cell via soldering of the solder layer by pressing the interconnector onto the solar cell while applying heat.

A system and method of braze resistance spot welding of an aluminum component to a galvanized steel component involve providing an aluminum-side electrode having a first tip defining a rounded shape, providing a galvanized steel-side electrode having a second tip defining a flat shape, depositing a braze filler material between the aluminum and galvanized steel components at a desired location for a spot weld, performing a pre-heat including providing a first current across the electrodes for a first period such that the braze filler melts and removes a portion of a zinc coating from the galvanized steel component, and after performing the pre-heat, performing a spot weld between the aluminum and galvanized steel components by providing a second current across the electrodes for a second period such that the aluminum melts and the galvanized steel does not melt, wherein the second current is greater than the first current.

Provided are a device packing facility and method using DEHT and a device processing apparatus utilizing the DEHT. The device packaging facility includes a mounting unit providing bis(2-ethylhexyl) terephthalate (DEHT) between first and second devices to attach the first and second devices to each other, a processing unit thermally processing the first and second devices that are attached to each other to remove the DEHT and fix the first and second devices to each other, and a transfer unit transferring the first and second devices that are attached to each other from the mounting unit to the processing unit.

A flux composition which includes one or more organic compounds including one or more sulfonic acid groups, salts or anhydrides thereof is applied to tin or tin alloy deposits. The flux composition is then homogenized on the tin or tin alloy to inhibit tin or tin alloy oxidation and improve brightness of the tin or tin alloy.

A soldering flux composition containing a resin, a solvent, and carbon particles is provided herein.

A rework process includes attaching a first bond head to a first semiconductor package. The contact pads of the first semiconductor package are bonded to contact pads of a second semiconductor package by solder joints. The rework process further includes performing a first local heating process to melt the solder joints, removing the first semiconductor package using the first bond head, and removing at least a portion of solder from the contact pads of the second semiconductor package.

A method for manufacturing a heat exchanger includes preparing heat exchange tubes by using an aluminum extrudate made of an alloy containing Mn (0.1 to 0.3 mass %), and Cu (0.4 to 0.5 mass %), the balance being Al and unavoidable impurities; preparing fins by using an aluminum bare material made of an alloy containing Mn (1.0 to 1.5 mass %) and Zn (1.2 to 1.8 mass %), the balance being Al and unavoidable impurities; causing Zn, Si, and flux powders to adhere to the outer surfaces of the heat exchange tubes such that the Zn powder adhesion amount becomes 2 to 3 g/m.sup.2, the Si powder adhesion amount becomes 3 to 6 g/m.sup.2, and the flux powder adhesion amount becomes 6 to 24 g/m.sup.2; and brazing the heat exchange tubes and the fins together by utilizing the Si powder and the flux powder adhered to the outer surfaces of the heat exchange tubes.

An aqueous aluminum brazing composition contains, as a binder resin, a water-soluble/dispersible polyurethane resin that exhibits a residual ratio of 60% by mass or less in a 400 C. heating environment and exhibits a residual ratio of 1.0% by mass or less in a 520 C. heating environment.