B23K1/203

FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD
20220193834 · 2022-06-23 · ·

A flux used for soldering with a tin-silver-copper alloy comprises an imidazole compound and/or an imidazoline compound; a dicarboxylic acid having 3 or more and 36 or less carbons; and a quaternary ammonium iodine salt. Relative to the total amount of the flux, the dicarboxylic acid content is 6 mass % or more and 25 mass % or less, and the iodine content is 200 ppm or more and 3600 ppm or less.

LOW TEMPERATURE MELTING AND MID TEMPERATURE MELTING LEAD-FREE SOLDER PASTE WITH MIXED SOLDER ALLOY POWDERS
20220184749 · 2022-06-16 ·

Implementations of the disclosure are directed to a lead-free mixed solder powder paste suitable for low temperature to middle temperature soldering applications. The lead-free solder paste may consist of: an amount of a first solder alloy powder between 44 wt % and 83 wt %, the first solder alloy powder comprising Sn; an amount of a second solder alloy powder between 5 wt % to 44 wt %, the second alloy powder comprising Sn, where the first solder alloy powder has a liquidus temperature lower than a solidus temperature of the second solder alloy powder; and a remainder of flux. The solder paste may be used for reflow at a peak temperature below the solidus temperature of the higher solidus temperature solder powder but above the melting temperature of the lower solidus temperature one.

Lead-free solder paste with mixed solder powders for high temperature applications

Some implementations of the disclosure relate to a lead-free solder paste with mixed solder powders that is particularly suitable for high temperature soldering applications involving multiple board-level reflow operations. In one implementation, the solder paste consists of 10 wt % to 90 wt % of a first solder alloy powder, the first solder alloy powder consisting of an SnSbCuAg solder alloy that has a wt % ratio of Sn:Sb of 0.75 to 1.1; 10 wt % to 90 wt % of a second solder alloy powder, the second solder alloy powder consisting of an Sn solder alloy including at least 80 wt % of Sn; and a remainder of flux.

Brazeable metal sheet material, and heat exchanger with components made of the same

A brazeable metal sheet material for heat exchanger components is used for producing a heat exchanger by a controlled atmosphere brazing process. The metal sheet material is made up of a core material with a brazing layer at least on one side and a corrosion-reducing intermediate layer arranged between the brazing layer and the core material. The core material consists of an Al3000-series alloy or an Al6000-series alloy having a magnesium content of 0.1% to 1.5% by weight. The brazing layer consists of an Al4000-series alloy having a maximum of 0.2% magnesium by weight. The corrosion-reducing intermediate layer consists of an Al1000-series alloy or an Al7000-series alloy having 0.1% to 1.5% magnesium by weight.

Heat exchanger and method of manufacturing the same

A method for manufacturing a heat exchanger (1) includes joining an inner fin (3) to a hollow structure (20) formed from at least two clad plates (200a, 200b) by heating and brazing a filler metal layer (B). Each clad plate has a core layer (A) composed of an aluminum alloy that contains Mg: 0.40-1.0 mass %. The filler metal layer is composed of an aluminum alloy that contains Si: 4.0-13.0 mass %, and further contains Li: 0.0040-0.10 mass %, Be: 0.0040-0.10 mass %, and/or Bi: 0.01-0.30 mass %. The inner fin is composed of an aluminum alloy that contains Si: 0.30-0.70 mass % and Mg: 0.35-0.80 mass %. A flux (F) that contains cesium (Cs) is applied along a contact part (201), and the vicinity thereof, of the at least two clad plates prior to the heating. A heat exchanger (1) may be manufactured according to this method.

CONDENSATION DEVICE, FLUX RECOVERY DEVICE, SOLDERING DEVICE, WATER VAPOR REMOVING METHOD, FLUX RECOVERY METHOD AND SOLDER PROCESSING METHOD
20220126236 · 2022-04-28 · ·

Provided is a condensation device capable of removing water vapor from a larger amount of gas without making a size larger than in related art. A condensation device 700 according to the present invention includes an outer cooling unit 720 including one or two or more inner tubes 722, an outer tube 724 located outside the one or two or more inner tubes 722, and a first flow path 726 through which a first cooling medium passes between the one or two or more inner tubes 722 and the outer tube 724.

Battery and battery production method

The battery of the present disclosure comprises a plurality of electrode bodies, wherein one of the electrode bodies and another of the electrode bodies are connected via a conductive material, each of the electrode bodies includes a metal current collector, an active material layer, and an electrolyte layer, the metal current collector has a connection surface which contacts the conductive material and a laminate surface which contacts the active material layer, and a ten-point average roughness of the laminate surface is less than a ten-point average roughness of the connection surface. According to the battery of the present disclosure, both adhesion between the metal current collector and the active material layer in the electrode body and connectivity between the electrode bodies via the conductive material can be achieved.

Leadless multi-layered ceramic capacitor stack

A stacked MLCC capacitor is provided wherein the capacitor stack comprises multilayered ceramic capacitors wherein each multilayered ceramic capacitor comprises first electrodes and second electrodes in an alternating stack with a dielectric between each first electrode and each adjacent second electrode. The first electrodes terminate at a first side and the second electrodes second side. A first transient liquid phase sintering conductive layer is the first side and in electrical contact with each first electrode; and a second transient liquid phase sintering conductive layer is on the second side and in electrical contact with each second electrode.

Jet solder bath and jet soldering apparatus

Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

METHOD FOR PRODUCING A COMPONENT OF A SLIDING BEARING, AND COMPONENT, SLIDING BEARING AND TRANSMISSION OF A WIND TURBINE

A method for producing a component of a sliding bearing includes a) providing a metal bolt with a cylindrical lateral surface and two end faces; b) coating the lateral surface of the bolt with a soldering flux or solder material; c) providing a metal sheet made of bronze and forming it into a cylindrical sleeve having a longitudinal slot, wherein a first side of the metal sheet forming an inside is coated with a solder material or a soldering flux before or after the forming process, either the lateral surface of the bolt or the inside of the sleeve having soldering flux; d) sliding the sleeve onto the lateral surface of the bolt; e) integrally bonding the lateral surface and the sleeve soldering; f) optionally closing the longitudinal slot by welding; and g) optionally machining a second side of the metal sheet facing away from the bolt.