A method for joining by welding a weld stud to a workpiece, with the following steps: providing a drawn arc welding device and a plasma gas cleaning device; providing a weld stud and providing a workpiece including a joining surface; cleaning the joining surface using a plasma gas cleaning method including the cleaning steps of: generating in the plasma gas generating device a non-transferred arc, generating with the non-transferred arc a plasma from a compressed gas, and directing the plasma onto the joining surface to remove contaminants thereon; and then, after the cleaning steps, joining the weld stud to the workpiece by drawn arc welding using the drawn arc welding device including forming of a transferred electric arc between the weld stud and the joining surface.

According to an embodiment, a temperature of an inside of a furnace is set to fall within a range of a reduction temperature or more of a carboxylic acid and less than a melting temperature of a solder bump, and the inside is concurrently set to have a first carboxylic acid gas concentration. Thereafter, the temperature of the inside is raised up to the melting temperature, and the inside is concurrently set to have a second carboxylic acid gas concentration. The second carboxylic acid gas concentration is lower than the first carboxylic acid gas concentration, and is a concentration containing a minimum amount of carboxylic acid gas defined to achieve reduction on an oxide film of the solder bump. The inside has the second carboxylic acid gas concentration at least at a time when the temperature of the inside reaches the melting temperature.

Solder joints comprising two different solder materials having different melting points, an outer solder material extending over an inner solder material bonded to a conductive pad, the inner solder material having a lower melting point than a melting point of the outer solder material and being in a solid state at substantially ambient temperature. A metal material having a higher melting point than a melting point of either solder material may coat at least a portion of the inner solder material. Microelectronic components, assemblies and electronic systems incorporating the solder joints, as well as processes for forming and repairing the solder joints are also disclosed.

Aspects of the invention include a press-fit pin for mechanically and electrically connecting to a through-hole of a substrate. The press-fit pin can include a press-fit portion configured to be deformed upon insertion into the through-hole against a plated surface of the through-hole. A surface mount technology (SMT) pad can be coupled to a first end of the press-fit portion. The SMT pad can include a conductive material. The press-fit pin can further include a trace extension coupled to the SMT pad. The trace extension can extend from the SMT pad in a direction perpendicular to the press-fit portion. The press-fit pin can include a tip portion coupled to a second end of the press-fit portion.

A method of bonding two components includes plating a first of the components with a first silver layer, a tin layer, and a second silver layer, plating a second of the components with silver, inserting the first and second components into a pre-heated press, and applying pressure to the components causing the components to bond. A stack of layers has a first component layer, a first silver layer, a tin layer, a second silver layer, a second component silver layer, and a second component layer.

A method for brazing a metal part onto a surface of a zirconia component. The method involves the steps of altering the surface state of the component to permit the attachment of a first metallization layer, cleaning the component to eliminate the impurities from its surface, depositing a first metallization layer, having mainly titanium, on the surface of the component, depositing a second metallization layer, having mainly niobium, on the first metallization layer, applying the part against the second metallization layer, depositing a gold brazing metal on the part and the second metallization layer, cooling the brazed area in a temperature-controlled manner, and stress-relieving heat treatment being performed under load on the metal part before brazing.

A system may include a current source; a first metal or alloy component with a first major surface electrically coupled to the current source; a second metal or alloy component with a second major surface electrically coupled in series to the first component and the current source via an external electrical conductor, where the first and second major surfaces are positioned adjacent to each other to define a joint region; a metal or alloy powder disposed in at least a portion of the joint region; and a controller. The controller may be configured to cause the current source to output an alternating current that conducts through the first component and the second component to induce magnetic eddy currents, magnetic hysteresis, or both within at least a portion of the metal or alloy powder disposed in at least the first portion of the joint region.

In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.

A solder and methods of forming an electrical interconnection are shown. Examples of solders include gallium based solders. A solder including gallium is shown that includes particles of other solders mixed with a gallium based matrix. Methods of applying a solder are shown that include swiping a solder material over a surface that includes a resist pattern. Methods of applying a solder are also shown that include applying a solder that is immersed in an acid solution that provides a fluxing function to aid in solder adhesion.

A semiconductor manufacturing apparatus includes; a component separating apparatus configured to separate a defective component from a substrate, a bump conditioning apparatus including an end mill cutter and receiving the substrate following separation of the defective component from the substrate, the bump conditioning apparatus being configured to cut a first connection bump using the end mill cutter to provide a conditioned first connection bump, and the first connection bump being exposed by separating the defective component from the substrate, and a component attaching apparatus configured to receive the substrate following provision of the conditioned first connection bump, and mount a new component including a second connection bump to the substrate by coupling the second connection bump and the conditioned first connection bump.