An intelligent soldering cartridge that includes: a housing; a solder tip; a heater for heating the solder tip; a storage device for storing information about characteristics of the cartridge; a processor for retrieving the information about characteristics of the cartridge, monitoring the power level delivered to the solder tip to detect liquidus occurrence at a solder joint, determining a thickness of an intermetallic compound (IMC) of the solder joint using some of the retrieved information, determining whether the thickness of the IMC is within a predetermined range, and generating an indication signal indicating that a reliable solder joint connection is formed when the thickness of the IMC is within the predetermined range; and an interface for transmitting the indication signal.

A soldering tool may include a tip portion and a tool body. The tool body may include a handle and the tip portion may be operably coupled to the tool body at a flange that separates the handle from the tip portion. The tip portion may include a tip that is heated to melt solder. The flange may include an end face and a light ring disposed at the end face. The light ring may be configured to direct light toward the tip.

A brazing apparatus to join a first component and a second component includes a heating element configured to melt a ring located at a joint between the first component and the second component, and a probe configured to contact the ring. A position of the probe is biased toward the ring. The probe is installed at a probe support. The probe is movable along a probe central axis relative to the probe support. A sensor is operably connected to the probe and is configured to determine movement of the probe along the probe central axis. The movement of the probe is indicative of melting of the ring.

A spot welding tip for a short flange of a car body panel may include a tip mounting portion having a cylindrical structure and forming a closed upper surface, and a truncated cone-shaped tip head portion formed in a vertical direction from a center of the upper surface of the tip mounting portion, wherein a fore end diameter of the tip head portion is formed to be smaller than a diameter of the tip mounting portion. A spot welding machine may include and/or operate with the spot welding tip

A soldering tool may include a tip portion and a tool body. The tool body may include a handle and the tip portion may be operably coupled to the tool body at a flange that separates the handle from the tip portion. The tip portion may include a tip that is heated to melt solder. The flange may include an end face and a light ring disposed at the end face. The light ring may be configured to direct light toward the tip.

A bond head assembly includes a collet and a planar compliant locating structure having a plane. The collet is operative to hold a die during a bonding process. The planar compliant locating structure includes a first flexural element that is positioned to contact a first side surface of the collet and a second flexural element that is positioned to contact a second side surface of the collet. The first and second side surfaces of the collet are substantially orthogonal to each other. Each of the first and second flexural elements is arranged such that a portion thereof is deflectable by movement of the collet against the flexural element, thereby causing the first or second flexural element to exert a biasing force against the first or second side surface of the collet along the plane of the compliant locating structure to restrict positional shifts of the collet towards the flexural element.

A bond head assembly includes a collet and a planar compliant locating structure having a plane. The collet is operative to hold a die during a bonding process. The planar compliant locating structure includes a first flexural element that is positioned to contact a first side surface of the collet and a second flexural element that is positioned to contact a second side surface of the collet. The first and second side surfaces of the collet are substantially orthogonal to each other. Each of the first and second flexural elements is arranged such that a portion thereof is deflectable by movement of the collet against the flexural element, thereby causing the first or second flexural element to exert a biasing force against the first or second side surface of the collet along the plane of the compliant locating structure to restrict positional shifts of the collet towards the flexural element.

In an embodiment, a soldering tip is configured for a number of solder pads at a number of radial locations and includes a soldering head, a shank, and a number of soldering feet. The soldering head is made of a thermally-conductive, corrosion-resistant material. The soldering head defines an upper head surface and a curved forward extension, the curved forward extension descending from the upper surface. The curved forward extension is lengthwise convexly curved and defines an extension face obverse to the upper head surface. The shank is coupled to the upper head surface of the soldering head and is configured to operatively couple with a soldering iron. The shank is made of a thermally conductive material. The soldering feet are operatively coupled to and protrude from the extension face. The soldering feet are configured to transfer bonding energy to the corresponding solder pads.

Semiconductor manufacturing equipment including a main body having a bonding head, a head heater at a bottom of the bonding head, the head heater including a thermal compression surface, negative pressure channels recessed from the thermal compression surface and the negative pressure channels including holes therein, and a bonding tool having a first surface, a second surface, grooves at the first surface, the first surface configured to contact the thermal compression surface, and the second surface opposite to the first surface contacting a semiconductor chip for thermal compression may be provided.

A method for manufacturing a soldered product by soldering a solder object portion, including: a solder supplying step that causes a cylindrical soldering iron having a through hole to contact with the solder object portion to supply a thread solder piece to the solder object portion from the through hole; a heating step that heats the thread solder piece with the cylindrical soldering iron and causes to melt the thread solder piece at the solder object portion; and a curing step that cures a melting object of the thread solder piece to solder the solder object portion. The thread solder piece is composed of a core containing a flux and a coating member containing a solder alloy that covers the core. The flux has a rosin having an acid value which is substantially as a main component thereof.