Disclosed are processes and apparatuses for semiconductor die removal and rework, including thin dies. In one aspect the process involves the use of a localized induction heating system to melt targeted solder joints, thereby minimizing the degradation of the thermal performance of the assembly undergoing the rework. Use of a vacuum-based die removal head, optionally in combination with the induction heating system, allows for the removal of thin dies of 150 micrometers thick or less.

A detachment apparatus for detaching at least one component (120) from a circuit board (125) can include a shaft (105) configured to rotate about a central axis, at least one lever (110) having a first end and a second end, the lever being attached to the shaft at the first end, and a hook (115) attached to the second end of the lever. Rotation of the shaft causes the hook to come into contact with the component on the circuit board, and the hook is configured to separate the component from the circuit board.

A rework process includes attaching a first bond head to a first semiconductor package. The contact pads of the first semiconductor package are bonded to contact pads of a second semiconductor package by solder joints. The rework process further includes performing a first local heating process to melt the solder joints, removing the first semiconductor package using the first bond head, and removing at least a portion of solder from the contact pads of the second semiconductor package.

A desoldering tool and control system including enhanced features for detecting solder clogging as well as on-delay and sleep mode functions to enhance the life of the desoldering tool components.

Disclosed is a solder punch tool and method of using the same. The solder punch tool includes an extensible rod, such as a graphite rod, extensible from a first end of the solder punch tool, and a metal punch on an opposite end of the solder punch tool. Optionally, an A/C power cord and a light may each be removably attachable to the solder punch tool. In use, a user may melt solder clogging a hole in a printed circuit board, push a portion of the extensible rod through the hole and the molten solder, break off a portion of the extensible rod extending through the hole in the printed circuit board, and push such broken portion of the extensible rod through the hole using the metal punch so as to clear the hole to receive a replacement component.