A hand-held heating tool includes a handle unit, a pivot unit, a positioning unit, and a heating unit. The handle unit has a recess and a positioning portion. The pivot unit is pivotally connected to the handle unit and has a guiding groove and an abutment section. The positioning unit includes a positioning member, a control member, and an elastic member arranged between the control member and the abutment section. The control member is movably arranged in the guiding groove to actuate the positioning member to move relative to the recess so that the positioning member is selectively engaged with the positioning portion for adjusting a relative angle between the handle unit and the heating unit.

An electric heating device includes a body and a heating head connected to the body. The heating head includes an electric heating wire and a heat storage member. The electric heating wire includes a first section and a second section connected to the first section. The first section is made of pure nickel. The second section is made of ferrochrome. The heat storage member is mounted around an outer radial periphery of the second section. The heat storage member is made of porcelain clay. The electric heating wire is connected by sections of three different materials so that the heating head can be raised to a very high temperature with extremely high heat generation efficiency, and the electric heating device is not easily damaged by high temperature.

A solder processing method according to one or more embodiments may include: sequentially supplying at least two solder pieces into a substantially tubular iron tip that is extended vertically, such that the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides; and heating the substantially tubular iron tip in a state where the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides, to melt the flux to be flown out from at least one of the at least two solder pieces to a space between an inner wall of the iron tip and the at least two solder pieces.

A solder processing method according to one or more embodiments may include: sequentially supplying at least two solder pieces into a substantially tubular iron tip that is extended vertically, such that the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides; and heating the substantially tubular iron tip in a state where the at least two solder pieces are erected within the iron tip in such a manner that on the solder piece which is first supplied, the solder piece which is subsequently supplied rides, to melt the flux to be flown out from at least one of the at least two solder pieces to a space between an inner wall of the iron tip and the at least two solder pieces.

A soldering tool may include a tool body comprising circuitry configured to interface with a controller, and a tip portion including a tip that is heated to melt solder and a handpiece that is graspable by an operator. The tip portion includes a heater and a sensor disposed in the tip. The tip portion includes a tip memory device disposed at the handpiece. The tip memory device is configured to store parametric data. The tip memory device is configured to exchange data with the controller.

A soldering iron with temperature profiling, comprising a hand piece or a robot arm including a soldering tip; a processor configured to provide temperature profiling where the soldering tip is one or more of the following during a soldering event: provided at multiple tip temperatures at fixed times during the soldering event; and provided at multiple tip temperatures at self-adjusting times during the soldering event.

A heating tool having a temperature sensor fixed within a tip of the heating tool with maximum heat conductivity to the temperature sensor.

A soldering tool includes a housing having a handle portion defining a first longitudinal axis, and a head portion coupled to the handle portion and defining a second axis. The soldering tool further includes a heating element coupled to the head portion for movement therewith. The head portion is movable relative to the handle portion between a first orientation in which the second axis is coaxial with the first axis, and a second orientation in which the second axis is non-coaxial with the first axis.

A soldering tip fastening device includes a soldering device fastener configured for fastening the soldering tip fastening device on a soldering device, and a soldering tip fastener configured to fasten a soldering tip on a soldering device when the soldering tip fastening device is fastened to the soldering device. The soldering tip fastener and the soldering device fastener are associated with opposite ends of the soldering tip fastening device. The soldering tip fastening device has a sleeve with an elastic element, the sleeve being configured such that the elastic element is tensioned during the fastening of the soldering tip on the soldering device by the soldering tip fastening device.

A solder removal apparatus is provided. The solder removal apparatus comprises a plurality of solder-interfacing protrusions extending from a body by a length. Each of the plurality of solder-interfacing protrusions is configured to remove a corresponding one of a plurality of solder features from a semiconductor device, where each of the plurality of solder features has a height and an amount of solder material.