The present disclosure is directed to a compact vertical oven for reflow of solder bumps for backend processes in semiconductor wafer assembly and packaging. This disclosure describes a vertical oven which uses a plurality of wafers (e.g., an example value is 50-100 wafers) in a batch with controlled injection of the reducing agent (e.g. formic acid), resulting in a process largely free of contamination. This disclosure describes controlled formic acid flow through a vertical system using laminar flow technology in a sub-atmospheric pressure environment, which is not currently available in the industry. The efficacy of the process depends on effective formic acid vapor delivery, integrated temperature control during heating and cooling, and careful design of the vapor flow path with exhaust. Zone-dependent reaction dynamics managed by vapor delivery process, two-steps temperature ramp control, and controlled cooling process and formic acid content ensures the effective reaction without any flux.

Soldering system includes a first soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which includes a communication module designed for setting up a wireless data connection, and at least a second soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which comprises a communication module designed for setting up a wireless data connection.

A heating apparatus for induction heating is disclosed. The heating apparatus may comprise a bearing ring, at least one bearing element disposed in the bearing ring, and a braze material adjacent to the at least one bearing element and the bearing ring. The heating apparatus may additionally comprise an inductor positioned radially adjacent to at least a portion of the bearing ring. A current source may be electrically coupled to the inductor. A bearing orienting member may also abut a surface of the at least one bearing element. The bearing orienting member may orient a surface of the at least one bearing element. A heating method is also disclosed.

An LED tube lamp with overvoltage protection capability is provided. The LED tube lamp includes a lamp tube, two external connection terminals, a rectifying circuit, a filtering circuit, an LED module, and a protection circuit. The protection circuit is coupled between two input terminals of the LED module and configured to perform overvoltage protection when determining that a voltage level between the two input terminals of the LED module reaches or is higher than a predefined voltage value, wherein the protection circuit includes a diode and the predefined voltage value is in a range of about 40V to about 600V.

An LED tube lamp with overvoltage protection capability is provided. The LED tube lamp includes a lamp tube, two external connection terminals, a rectifying circuit, a filtering circuit, an LED module, and a protection circuit. The protection circuit is coupled between two input terminals of the LED module and configured to perform overvoltage protection when determining that a voltage level between the two input terminals of the LED module reaches or is higher than a predefined voltage value, wherein the protection circuit includes a diode and the predefined voltage value is in a range of about 40V to about 600V.

A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The body portion defines a non-contact region adjacent the contact region. The bonding tool also includes a heat resistant coating applied to the non-contact region.

A bonding tool for bonding a semiconductor element to a substrate on a bonding machine is provided. The bonding tool includes a body portion including a contact region for contacting the semiconductor element during a bonding process on the bonding machine. The body portion defines a non-contact region adjacent the contact region. The bonding tool also includes a heat resistant coating applied to the non-contact region.

A solder feed structure has a solder exit aperture with an elongated shape. The elongated shape can help reduce the incidence of clogging, as it has a dimension that is significantly larger than the wire diameter of solder. The solder feed structure has a bent segment leading up to the solder exit aperture. The arc of the bent segment can cause the solder wire to be in a stable position at one end of the elongated shape of the solder exit aperture instead of wobbling within the solder exit aperture.

A unitary wafer assembly arrangement for the application of solder balls onto a substrate for subsequent use in the electronics industry. This wafer tool assembly comprises a number of modules connected to one another and all serviced by a robotic arm to transfer processed wafers from one module to another. The tool assembly comprises a load port and pre-aligner module, a binder module, a solder ball mount module and a reflow module. A wafer inspection and repair module arrangement is also part of the tool assembly.

A method for continuously applying hardbanding to an oil and gas tubular or building up a worn oil and gas tubular that includes low heat input welding without compromising the mechanical properties of the tubular. The method includes preparation of the surface of the oil and gas tubular and applying a consumable wire to the surface. The consumable wire may be hardbanding or buildup material with a hardness that is similar to the hardness of the oil and gas tubular.