Aspects include supplying a plurality of nickel-enriched braze powder particles to a cold spray system through a particle supply inlet. The nickel-enriched braze powder particles are accelerated through a transfer tube and out an exit in the transfer tube towards a substrate to produce a braze cold-sprayed substrate. A component surface is positioned proximate to the braze cold-sprayed substrate. The braze cold-sprayed substrate is heated to bond the braze cold-sprayed substrate to the component surface.

The invention relates to a method (S) for attaching an SMD to a printed circuit (10), comprising the following steps: applying an insulating layer (20) (S1) onto the printed circuit (10), forming a cavity (22) in the insulating layer (20) above the conductive layer (12) (S2) of the printed circuit, filling the cavity (22) with a solder paste (3), positioning the SMD over the cavity (22) (S4), and applying a heat treatment (S5) to the printed circuit (10).

In at least one embodiment, an apparatus for an automated soldering process is provided. The apparatus includes a stepper motor to provide solder and a hot end including a casing to heat the solder and to provide liquified solder to a terminal and to an exposed portion of a wire. The apparatus includes a terminal fixture to support the terminal and the exposed portion of a wire while the hot end provides the liquified solder to the terminal and to the exposed portion of the wire. The apparatus includes a first heating device to heat the terminal and the exposed portion of the wire to enable a flow of the liquified solder onto the terminal and the exposed portion of the wire.

A system of producing metal cored solder structures on a substrate includes: a decal, a carrier, and receiving elements. The decal includes one or more apertures each of which is tapered from a top surface to a bottom surface thereof. The carrier is positioned beneath the bottom of the decal and includes cavities in a top surface. The cavities are located in alignment with the apertures of the decal. The decal is positioned on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities. The feature cavities are shaped to receive one or more metal elements and are configured for receiving molten solder cooled in the cavities. The decal is separable from the carrier to partially expose metal core solder contacts. The receiving elements receive the metal core solder contacts thereon.

Disclosed is a micro-region semi-solid additive manufacturing method, where rod-shaped materials are used as consumables, and heating modes such as a high-energy beam, an electric arc, a resistance heat, or the like are applied to the front end of the consumables to enable the front end to be in a semi-solid state in which the solid-liquid two phases coexist; at the same time, the rotational torsion and the axial thrust applied on the consumables have powerful effects such as shearing, agitation and extrusion, that is, the mold-free semi-solid rheoforming is performed. The consumable is transmitted to the bottom layer metal continuously in this manner to form metallurgical bonding, the stacking process is repeated according to a planned route obtained after discretization slicing treatment, and then an object or a stack layer in a special shape can be formed.

Filing a plated through-hole of a circuit board with solder is facilitated by an apparatus which includes a wire solder assembly and a controller. The wire solder assembly includes a wire probe sized to extend into the plated through-hole from one side of the circuit board, and a solder block associated with the wire probe so that the probe passes through the solder block. The controller controls heating of the wire probe, when the wire probe is operatively inserted into the plated through-hole, by passing a current through the wire probe. The heating of the wire probe heats a conductive plating of the plated through-hole and melts the solder block. The heating of the conductive plating and the melting of the solder block causes the solder to migrate into the plated through-hole by capillary action to fill the plated through-hole with the solder.

A jetting device may include a vacuum nozzle configured to direct a gaseous flow of a gaseous fluid in flow communication with a jetting outlet; a vacuum pump configured to draw the gaseous flow into the vacuum nozzle and further towards the vacuum pump via the vacuum nozzle outlet; and an inlet conduit between a vacuum nozzle inlet and the ambient environment, where the inlet conduit includes a control valve configured to control a flow rate of the gaseous flow through the vacuum nozzle outlet based on adjusting a smallest diameter of the inlet conduit between an open diameter and a constricted diameter. The open diameter may be greater than a smallest diameter of the suction hole. The gaseous flow may include a first gaseous flow into the vacuum nozzle via a suction hole and an adjustable second gaseous flow into the vacuum nozzle via the vacuum nozzle inlet.

Provided are a logic switching device and a method of manufacturing the same. The logic switching device may include a domain switching layer adjacent to a gate electrode. The domain switching layer may include a ferroelectric material region and an anti-ferroelectric material region. The domain switching layer may be a non-memory element. The logic switching device may include a channel, a source and a drain both connected to the channel, the gate electrode arranged to face the channel, and the domain switching layer provided between the channel and the gate electrode.

A welding system comprises a welding module and a moving module adapted to move the welding module to a predetermined welding position. The welding module includes a guiding device and a welding tool. The guiding device has a plurality of tubular guiding heads arranged in a row, ends of the plurality of tubular guiding heads are disposed close to joints of a plurality of cables so as to guide a plurality of welding wires to the joints of the plurality of cables. The welding tool has a plurality of tooth-shaped welding heads arranged in a row, ends of the plurality of tooth-shaped welding heads are disposed close to the joints of the plurality of cables and configured to simultaneously heat the plurality of welding wires guided to the joints of the plurality of cables, so as to simultaneously weld the joints of the plurality of cables onto a circuit board.

A microwave heating method using a microwave, including: controlling a frequency of the microwave, to form a single-mode standing wave; disposing an object to be heated in a magnetic field region where a strength of a magnetic field formed by the single-mode standing wave is uniform and maximum; and heating the object to be heated by magnetic heat generation by magnetic loss caused by an action of the magnetic field of the magnetic field region, and/or induction heating by an induced current generated in the object to be heated due to the magnetic field of the magnetic field region.