A soldering apparatus for selective soldering, comprising a solder bath for holding the molten solder at least one solder nozzle a solder pump for conveying solder from the solder bath through the solder nozzle a movement device for the relative movement of the solder nozzle and an assembly to be soldered
wherein several solder nozzles are provided in several solder nozzle assemblies, with each solder nozzle assembly having one or more solder nozzles and wherein each solder nozzle assembly may be assigned an assembly, and the movement device is designed for synchronous movement of the several solder nozzle assemblies relative to the respective assemblies in the horizontal X-Y plane, and the soldering machine is so designed that the individual solder nozzle assemblies and the respective assemblies may be moved towards one another and independently of one another in the vertical direction (Z-direction) by means of a coupling device.

One embodiment of a robust process for the repair of a solder bridge defect in a Surface Mount Technology micro-electronic circuit assembly with fine pitch components. The defective solder joint is heated by various means and a cold gas jet blast is applied to the defective solder joint. An effect is created whereby the solder inducing the defect is conveyed away by the impact of the cold gas jet blast. The advantages of this embodiment include scalability for pin spacing and elimination of heat induced latent defects. The process is applicable to any pin spacing, but is of particular usefulness with pin spacing of 0.025 inch or finer. Other embodiments are described and shown.

A method for forming solder deposits on elevated contact metallizations of terminal faces of a substrate formed in particular as a semiconductor component includes bringing wetting surfaces of the contact metallizations into physical contact with a solder material layer. The solder material is arranged on a solder material carrier. At least for the duration of the physical contact, a heating of the substrate and a tempering of the solder material layer takes place. Subsequently a separation of the physical contact between the contact metallizations wetted with solder material and the solder material layer takes place.

Automation of soldering work may be difficult, in part because present systems may be configured to dispense solder in a uniform preset amount. Provided are systems and methods in which soldering products (such as soldering paste and soldering wire) are dispensed adjustably. An example method includes receiving, by a computing device, a first weight reading of a part container prior to dispensing of solder product and a second weight reading of the part container after the solder product is dispensed. The computing device may determine an amount of dispensed solder product based comparing the first weight reading with the second weight reading, and may determine whether the amount of dispensed solder product falls within an accepted range. If not, a second length of time of different length may be generated for use in a future dispensing of the solder product.

A solder supply unit includes a base member, a reel holder that is provided on the base member and rotatably holds a reel of a tape-like solder material, a support member provided on the base member, and a guidance member that is provided on the support member and that guides at least a lower surface of the tape-like solder material wound around the reel when the tape-like solder material is fed out.

A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle.

A soldering method includes intermittently ejecting a solder jet to a workpiece from a jet nozzle, and spraying gas on an outer side surface of the jet nozzle when stopping ejection of the solder jet from the jet nozzle. And a soldering apparatus includes a first nozzle from which a solder jet is intermittently ejected to a workpiece, and a second nozzle from which gas is sprayed on an outer side surface of the first nozzle.

A soldering system comprising a solder pot and a nozzle exchange unit. The solder pot is configured to detachably couple to a solder nozzle during a soldering operation. The nozzle exchange unit is arranged to: store a plurality of solder nozzles; detach a first nozzle from the nozzle coupling; and attach a stored second nozzle to the nozzle coupling.

A system of producing metal cored solder structures on a substrate includes: a decal, a carrier, and receiving elements. The decal includes one or more apertures each of which is tapered from a top surface to a bottom surface thereof. The carrier is positioned beneath the bottom of the decal and includes cavities in a top surface. The cavities are located in alignment with the apertures of the decal. The decal is positioned on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities. The feature cavities are shaped to receive one or more metal elements and are configured for receiving molten solder cooled in the cavities. The decal is separable from the carrier to partially expose metal core solder contacts. The receiving elements receive the metal core solder contacts thereon.

A system of producing metal cored solder structures on a substrate includes: a decal having a plurality of apertures, the apertures being tapered from a top surface to a bottom surface of the decal; a carrier configured for positioning beneath the bottom of the decal, the carrier having cavities in a top surface and the cavities located in alignment with the apertures of the decal; the decal being configured for positioning on the carrier having the decal bottom surface in contact with the carrier top surface to form feature cavities defined by the decal apertures and the carrier cavities, the feature cavities being shaped to receive a plurality of metal elements therein, the feature cavities configured for receiving molten solder being cooled in the cavities, the decal being separable from the carrier to partially expose metal core solder contacts; and receiving elements of a substrate being configured to receive the metal core solder contacts thereon, and the metal core solder contacts being exposed and positioned on the substrate.