The robot apparatus includes a solder pot having a nozzle from which solder flows out, a flux ejection tool for ejecting flux, and a support tool for supporting the solder pot. The robot apparatus includes a table for supporting a workpiece, and a placement member on which the operation tools and the solder pot can be placed. The controller performs a flux application control for coupling the flux ejection tool to the robot and applying flux to the workpiece, a preheating control for coupling the support tool to the robot and arranging the solder pot below the workpiece so as to heat the workpiece, and a supply control for moving the nozzle of the solder pot closer to the workpiece and supplying the solder.

Disclosed is a method for attaching an interconnector of a solar cell panel. The method includes forming a flux layer by spraying flux over the interconnector via spraying, the interconnector including a core layer and a solder layer formed on a surface of the core layer, and attaching the interconnector to a solar cell via soldering of the solder layer by pressing the interconnector onto the solar cell while applying heat.

A fluxing system for a bonding machine is provided. The fluxing system includes a flux holder defining a cavity for holding flux, and a fluid source for providing a cooling fluid to cool the flux holder.

A soldering apparatus for selective soldering, comprising a solder bath for holding the molten solder at least one solder nozzle a solder pump for conveying solder from the solder bath through the solder nozzle a movement device for the relative movement of the solder nozzle and an assembly to be soldered
wherein several solder nozzles are provided in several solder nozzle assemblies, with each solder nozzle assembly having one or more solder nozzles and wherein each solder nozzle assembly may be assigned an assembly, and the movement device is designed for synchronous movement of the several solder nozzle assemblies relative to the respective assemblies in the horizontal X-Y plane, and the soldering machine is so designed that the individual solder nozzle assemblies and the respective assemblies may be moved towards one another and independently of one another in the vertical direction (Z-direction) by means of a coupling device.

Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

A flux unit includes a flux supply device configured to eject flux to a storage tray, an ejection port configured to eject the flux, and an ejection port moving device configured to move the ejection port in the radial direction of the storage tray. By this, the flux is ejected in a wide range in the radial direction of the storage tray. Also, the storage tray is rotated by a tray rotation device. Thus, the film thickness of the flux ejected in the wide range of the storage tray is adjusted by a squeegee all at once. Thus, the time required for adjusting the film thickness of the flux can be reduced.

Reflow Grid Array (RGA) technology may be implemented on an interposer device, where the interposer is placed between a motherboard and a ball grid array (BGA) package. The interposer may provide a controlled heat source to reflow solder between the interposer and the BGA package. A technical problem faced by an interposer using RGA technology is application of solder to the RGA interposer. Technical solutions described herein provide processes and equipment for application of solder and formation of solder balls to connect an RGA interposer to a BGA package.

A flux reservoir apparatus (100, 200) includes a stage (12) having a recessed portion (13) for reserving flux (51, 52, 53) therein and a flux pot (20) composed of an annular member having a through hole (30) through which the flux (51, 52, 53) flows, the flux pot arranged to move back and forth on the surface (14) of the stage (12) to feed the flux (51, 52, 53) into the recessed portion (13) and to smooth the surface of the flux (51, 52, 53), in which the through hole (30) is an elongated hexagonal hole with a length greater than the width of the recessed portion (13) in the direction perpendicular to the back-and-forth direction, and in which the bottom surface of a flux pot main body (21) is a chevron surface. This reduces leakage of the flux (51, 52, 53) in the flux reservoir apparatus (100, 200).

An apparatus for at least partially wetting a component with a flux. The apparatus includes a flux reservoir that includes a recess that is filled with the flux. The apparatus further includes a viscosity reduction unit that is configured, when the flux reservoir is filled with flux, to reduce the viscosity of the flux at least in a localized region by excitation of the flux.

A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.