A space-based circuit-replacing robotic system and method include a satellite grasper configured to grasp the satellite having a printed circuit onto which an integrated circuit is soldered and the integrated circuit is to be replaced; an access mechanism configured to remove the printed circuit and/or to provide access to the printed circuit; a printed circuit orientation device configured to orient a printed circuit such that sunlight is incident on the printed circuit; one or more temperature sensors configured to measure a temperature of the solder on the printed circuit; a processor configured to adjust a rate of heating to match a desired heating rate; a circuit grasping device configured to position the circuit for replacement; and an optical shield that is configured to be adjusted to allow light to pass substantially only to a desired area of the printed circuit.

An arrangement includes a chamber, a heating element arranged in the chamber, wherein the heating element, when a first connection partner with a pre-connection layer formed thereon is arranged in the chamber, is configured to heat the first connection partner and the pre-connection layer, thereby melting the pre-connection layer, and a cooling trap. During the process of heating the first connection partner with the pre-connection layer formed thereon, the cooling trap has a temperature that is lower than the temperature of all other components of or in the chamber such that liquid evaporating from the pre-connection layer is attracted by and condenses on the cooling trap.

A system for assembling a vehicular window assembly includes a heating device that, when electrically operated, heats an electrical connector disposed at a glass panel of a vehicular window assembly to heat and melt solder disposed between the electrical connector and an electrically conductive trace established at the glass panel to form a solder joint providing electrically-conductive connection between the electrical connector and the electrically conductive trace established at the glass panel. A temperature sensor captures sensor data indicative of a temperature of the electrical connector and the solder. The system, based on processing at an electronic control unit (ECU) of the captured sensor data, adjusts electrical operation of the heating device to adjust the temperature of the electrical connector and the solder during the soldering process that forms the solder joint.

Systems and methods are disclosed for integrated compressed air cooling for welding systems. In particular, the disclosed systems and methods may employ compressed air to implement one or more welding processes (e.g., a gouging or cutting processes), with the compressed air being conveyed through such welding systems. In some examples, the compressed air is routed within the welding system to provide cooling for one or more components therein. For instance, components such as power conversion circuitry may heat up during the welding process. Routing compressed air to or near the components will introduce relatively cool air to the environment. As the passing compressed air heats in response to interaction with the heated components, heat is drawn from the components and/or the nearby environment.

Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

Provided is a flip chip bonder including: a pickup flipping collet configured to flip a chip; and a bonding tool configured to receive the chip flipped with the pickup flipping collet from the pickup flipping collet and to bond the received chip to a circuit board. The pickup flipping collet includes a cooling channel through which cooling air flows to cool the pickup flipping collet. Thus, bonding time can be reduced without lowering bonding quality.

A substrate processing apparatus that reduces and/or minimizes contamination of mounting boards. The substrate processing apparatus includes a frame with an opening formed at its bottom and including an internal space; a first plate below the frame; and a second plate below the first plate. The first plate includes a plurality of first holes. The second plate includes a plurality of second holes, and at least one second dam which surrounds at least one of the second holes and protrudes toward the internal space. The first holes are staggered with respect to the second holes in a vertical direction.

A method for brazing a plate heat exchanger (10) having a stack of heat exchanger plates with depressions and elevations forming interplate flow channels and port openings being in selective fluid communication with said interplate flow channels, the method comprising the steps of placing the stack of heat exchanger plates in a heating chamber (16) of a furnace (15), conducting a gas for changing the temperature of the stack of heat exchanger plates through a plurality of nozzles (23) inside the heating chamber (16), and conducting gas from at least one of said nozzles (23) into at least one of the port openings (O1-O4) of the stack of heat exchanger plates. Disclosed is also a system for brazing a plate heat exchanger (10).

A method of using a processing oven may include disposing at least one substrate in a chamber of the oven and activating a lamp assembly disposed above them to increase their temperature to a first temperature. A chemical vapor may be admitted into the chamber above the at least one substrate and an inert gas may be admitted into the chamber below the at least one substrate. The temperature of the at least one substrate may then be increased to a second temperature higher than the first temperature and then cooled down.