An oven for assisting in conductive joint formation related to a workpiece is provided. The oven includes (a) a chamber, the chamber being at least partially defined by (i) an oven plate and (ii) a cover; (b) a material handling system for moving the workpiece through the oven in connection with a conductive joint formation process; and (c) at least one vacuum chamber within the chamber. The oven provides a stepped temperature profile including a plurality of temperature zones along the oven plate.

A heat transfer device for thermal coupling of a component to be soldered with a heat source or a heat sink in a soldering machine includes a heat source or a heat sink, and at least one base plate, said base plate being in thermally conductive contact at least with the heat source or the heat sink, said base plate comprising at least two contact units having respective contact surfaces, said contact surfaces being thermally contactable to the component, said contact units being designed in such a way that relative distances between the contact surfaces and the surface of the base plate facing the component are changeable.

A method for brazing a plate heat exchanger (10) having a stack of heat exchanger plates with depressions and elevations forming interplate flow channels and port openings being in selective fluid communication with said interplate flow channels, the method comprising the steps of placing the stack of heat exchanger plates in a heating chamber (16) of a furnace (15), conducting a gas for changing the temperature of the stack of heat exchanger plates through a plurality of nozzles (23) inside the heating chamber (16), and conducting gas from at least one of said nozzles (23) into at least one of the port openings (O1-O4) of the stack of heat exchanger plates. Disclosed is also a system for brazing a plate heat exchanger (10).

A semiconductor processing apparatus includes a process chamber that defines an enclosure. The enclosure includes a substrate support configured to support a substrate and rotate the substrate about a central axis of the process chamber. The substrate support is also configured to move vertically along the central axis and position the substrate at multiple locations in the enclosure. The apparatus also includes one or more UV lamps configured to irradiate a top surface of the substrate supported on the substrate support.

Disclosed in the present application is a cooling system for a reflow furnace, the reflow furnace comprising a heating zone, and the cooling system being used to regulate a temperature of the heating zone, the cooling system comprising: at least one gas inlet and at least one gas discharge port, the at least one gas inlet and the at least one gas discharge port being disposed on the heating zone; a blowing apparatus; at least one gas intake pipeline, an inlet of the at least one gas intake pipeline being connected to the blowing apparatus, an outlet of the at least one gas intake pipeline being connected to the at least one gas inlet, the at least one gas intake pipeline being able to controllably establish fluid communication between the blowing apparatus and the at least one gas inlet; and at least one gas discharge pipeline, an inlet of the at least one gas discharge pipeline being connected to the at least one gas discharge port, an outlet of the at least one gas discharge pipeline being connected to the outside, and the at least one gas discharge pipeline being able to controllably establish fluid communication between the at least one gas discharge port and the outside. The cooling system of the present application can shorten the time taken for the reflow furnace to change from a higher heating temperature to a lower heating temperature.

Provided are a jet solder bath and a jet soldering apparatus using the jet solder bath. The jet solder bath contains first and second jet nozzles which inject molten solder by first and second pumps and a bridge member arranged between the first and second jet nozzles. The bridge member includes a guide portion that guides at least one of flows of the molten solder injected from the first jet nozzle and flowing on the downstream side of the first jet nozzle and of the molten solder injected from the second jet nozzle and flowing on an upstream side of the second jet nozzle, and side members which controls the flow of the molten solder, the side members being arranged near opposite ends of the guide portion across a direction that is perpendicular to the carrying direction of the substrate.

A system for automatically brazing joints in a manifold has a loading station, a brazing station, and a cooling station. The brazing station has a plurality of brazing torches moveable to a joint in the manifold to braze the joint. First, second and third fixture frames extend from a common rotatable platform. The platform rotates each of the fixture frames to each of the loading station, brazing station, and cooling station in turn. The fixture frames support manifolds with joints requiring brazing. The torches are disposed on a lifting platform that lifts the torches up to a desired joint. The lifting platform is disposed on a sliding platform that slides the torches horizontally to the desired joint. The torches surround the joint and braze it from all sides simultaneously. While brazing is being performed at the brazing station, loading and unloading of manifolds may be done at the loading station, and cooling of already-brazed manifolds may take place at the cooling station.

A soldering apparatus includes a cooling zone, upper and lower vent holes, an external channel, a blower unit, a heat exchanger, a pair of bypass channels, and a ventilation plate. The vent holes are provided, respectively, above and below a pair of rails configured to transport a board in the cooling zone. The external channel connects the vent holes with each other outside the cooling zone. The blower unit causes gas in the external channel to flow through the upper vent hole, the cooling zone, and the lower vent hole. The heat exchanger is provided in a lower opening linked to the lower vent hole in the cooling zone. The pair of bypass channels deliver gas above the pair of rails to the lower opening while bypassing locations of the pair of rails. The ventilation plate is provided in a space formed between the pair of bypass channels.

A system for assembling a vehicular window assembly includes a heating device that, when electrically operated, heats an electrical connector disposed at a glass panel of a vehicular window assembly to heat and melt solder disposed between the electrical connector and an electrically conductive trace established at the glass panel to form a solder joint providing electrically-conductive connection between the electrical connector and the electrically conductive trace established at the glass panel. A temperature sensor captures sensor data indicative of a temperature of the electrical connector and the solder. The system, based on processing at an electronic control unit (ECU) of the captured sensor data, adjusts electrical operation of the heating device to adjust the temperature of the electrical connector and the solder during the soldering process that forms the solder joint.

The present disclosure provides for a heatshield that can be actively cooled during a rework process. The heatshield may include a backer plate, a metal plate, and/or a package pedestal. The backer plate may include one or more air inlet ports configured to be connected to an air compressor. Air inlet ducts may extend from the air inlet ports through at least a portion of the backer plate. A plurality of vents may extend from the air inlet ducts to a top surface of the backer plate such that the plurality of vents directs cooling gas forced into the heatshield towards the metal plate and a first BGA. The cooling gas may maintain the solder joint temperature of the first BGA package below the reflow temperature and below the solidus temperature of the solder joints to prevent reflow-related solder joint defects from occurring in the first BGA package during rework of a second BGA package.