B23K3/085

MOLD FOR FORMING SOLDER DISTAL TIP FOR GUIDEWIRE

A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.

Mold for forming solder distal tip for guidewire

A mold is used to form a solder joint to join the distal end of the guidewire to a wire coil. The mold has a cavity that can have different configurations so that the solder joint can be any of bullet shaped, micro-J shaped, cone shaped, truncated cone shaped, or have a textured surface.

Method of manufacturing components made of dissimilar metals

An article of manufacture comprises a first component having a first mating surface and a second component having a second mating surface. The first component may include an aperture having internal splines or gear teeth, and/or an outer perimeter having external splines or gear teeth. The first and second components are disposed such that a gap is provided between the first and second mating surfaces. Brazing material is disposed between the first and second mating surfaces so as to mechanically couple the first and second components. The first component may be made of a powdered metal or a non-powdered metal, and the second component may be made of the other of such two metals. In one embodiment, the first component may be a planetary carrier plate portion having internal splines and the second component may be a planetary carrier spider portion.

Reflow furnace and soldering method

A reflow furnace that can reduce both the flux clinging defect in a circuit board, and the thermal cracking defect in an electronic component has a heat zone in which a circuit board with a mounted electronic component is heated, and a cooling zone in which the heated circuit board is cooled, and includes: a shield disposed between the heat zone and the cooling zone and having an opening for passage of the circuit board; and a tunnel-like cover physically coupled to the opening and extending along a transport direction of the circuit board.

SOLDERING TOOL FOR INDUCTIVE SOLDERING
20210276112 · 2021-09-09 ·

A soldering tool for inductive soldering, includes an induction loop and an induction generator that is electrically conductively connected to the induction loop, wherein the induction loop consists of a metal profiled element, has at least one U-shaped region or two U-shaped regions, and each U-shaped region has in each case two legs and an end region connecting the legs, the at least one U-shaped region has a length L of at least 3 mm to 500 mm and a width B of 2 mm to 30 mm.

FLUX TRANSFER APPARATUS
20210185828 · 2021-06-17 · ·

This flux transfer apparatus (10) comprises: a stage (12) having a recessed portion (13) for collecting flux (51); a flux pot (20) which is an annular member having a through hole (21) into which the flux (51) is introduced, which reciprocates along a top surface (14) of the stage (12) to supply the flux (51) that has been introduced into the through hole (21) into the recessed portion (13), and which levels off the top surface of the flux using a bottom surface (22); and a cooling mechanism (30) for cooling the stage (12). By this means, a rise in the temperature of the stage in the flux collecting apparatus is suppressed.

BRAZE JOINTS FOR A COMPONENT AND METHODS OF FORMING THE SAME

A system for creating a braze joint within a component. The system includes an environment operable to reach a braze temperature sufficient to melt at least a portion of a braze material. The system also includes a component within the environment, the component including a base having a base surface, a recess depending from the base surface into the base to an inner edge, and a braze material within the recess and forming a cap above the base surface. The braze material fills the recess from the cap to the inner edge. The cap has an exposed braze surface. The system also includes an insulation layer that at least partially covers the exposed braze surface.

A METHOD OF JOINING AND SEALING A VANADIUM BASED MEMBRANE TO A METALLIC CONNECTION SECTION
20210138584 · 2021-05-13 ·

A method of joining and sealing a vanadium based membrane to a metallic connection section comprising: mounting a section of a vanadium based membrane on a connector formation of a connection section, the connection section being formed of a different metal to the vanadium based membrane, the connector formation providing a recess into which a section of the vanadium based membrane is seated and a connection interface in which the end face of the vanadium based membrane is proximate to or substantially abuts an adjoining face of the connector formation; mounting and operating a chiller arrangement in thermal contact with vanadium based membrane proximate the connection interface; heating a filler metal on the connection section to at least the liquidus temperature of the filler metal using a laser beam directed onto the filler metal located on the connection section and having a beam edge positioned at an offset location spaced apart from the connection interface a distance that attenuates direct heating of the vanadium based membrane by the laser beam, and on the connection section, such that the filler metal can flow over the connection interface from the offset location onto the vanadium based membrane; and cooling the filler metal to form a bridging section of filler metal between the vanadium based membrane and connection section over the connection interface.

Reflow soldering apparatus having independently openable main bodies

A soldering apparatus includes transfer rails as a first transfer means for transferring a printed circuit board, transfer rails as a second transfer means provided in parallel to a transfer direction of the printed circuit board to be transferred by the transfer rails, a muffle as a first reflow furnace main body for heating the printed circuit board transferred by the transfer rails, a muffle as a second reflow furnace main body for heating a printed circuit board transferred by the transfer rails, and a main frame as a frame for housing the muffle and the muffle. The main frame includes an opening/closing part as a first opening/closing means for opening/closing the muffle, and an opening/closing part as a second opening/closing means for opening/closing the muffle.

METHOD FOR LOW HEAT INPUT WELDING ON OIL AND GAS TUBULARS
20210138570 · 2021-05-13 · ·

A method for continuously applying hardbanding to an oil and gas tubular or building up a worn oil and gas tubular that includes low heat input welding without compromising the mechanical properties of the tubular. The method includes preparation of the surface of the oil and gas tubular and applying a consumable wire to the surface. The consumable wire may be hardbanding or buildup material with a hardness that is similar to the hardness of the oil and gas tubular.