The present application provides an apparatus for preventing solder paste dripping, comprising: a working platform support apparatus; a working platform connected in a fixed manner to one end of the working platform support apparatus, the working platform being used to bear a solder paste tub comprising a housing, with a solder paste nozzle being accommodated in the housing, the solder paste nozzle being mounted on the working platform, so that the solder paste tub is borne in an inverted manner on the working platform by means of the solder paste nozzle, with the housing being capable of moving relative to the solder paste nozzle so as to extrude solder paste accommodated in the solder paste tub from the solder paste nozzle; and a holder, the holder being connected to the housing of the solder paste tub and located above the working platform, and the holder being slidably connected to the working platform support apparatus, so that the holder can move downward as the amount of solder paste in the solder paste tub decreases, to adjust the relative position of the solder paste nozzle and the housing.

Systems and methods are disclosed herein relating to eliminating solder bridges between adjacent leads of small-pitch through-hole electrical components soldered to circuit boards using wave-soldering techniques. Several wave solder pallet insert patterns are disclosed. Each wave solder insert may include an insert pattern of peeling members is intended to eliminate solder bridges from various small-pitch component lead layouts.

A pressing device for pressing a first component, such as a roof panel, onto an additional component, such as one or more a vehicle side bodywork components or vehicle side bodywork supports. A hose is arranged in a housing and is filled with a fluid to selectively press the first component onto the additional component to facilitate a laser brazing operation by closing a gap between the first component and the additional component. A T-shaped pressure element is arranged in the housing and is moved relative to the housing by controlling the pressure of the fluid supplied to the hose.

A connector-soldering aid (1) for soldering single and/or cable wires to a connector comprises a connector mount (5) with a first stand (9) and a cable mount (7) with a second stand (31). The connector mount (5) has a base body (17), which is arranged on the first stand (9) and is rotatable relative to the latter about a fixed axis of rotation (19). The connector mount (5) further comprises a replaceable attachment (21) with a connector receiver and a centring device (23) for centring the attachment (21). The centring device (23) is arranged on the base body (17) and is further formed to centre the attachment (21) such that the connector receiver is positioned centrally in relation to the axis of rotation (19) of the base body (17).

The invention relates to a method for producing a solder connection between a plurality of components (12A, 12B) in a process chamber (74) sealed off from its surroundings by heating and melting solder material (16) which is arranged between the components (12A, 12B) to be connected.

It is proposed that the components (12A, 12B) to be connected are provisionally connected with a bonding material (18) to form a solder group (10) in which the components (12A, 12B) are fixed relative to one another in a joining position.

A chassis welding device for welding brackets as standard members to a body of a chassis includes a frame, a first transferring member, a plurality of loading mechanisms, a plurality of carriers, a conveying member, a shifting member, and a spot welder. The loading mechanism transfers standard members to individual preset positions on the carrier to face the solder joints on the standard members away from the carrier. The first transferring member transports the carrier to the shifting member. The shifting member transfers the carrier from the first transferring member to the spot welder. The conveying member transfers the body into contact with the solder joints. The spot welder applies heat to melt the solder joints to bond the standard members to the body.

A jig apparatus is used for assembling a trunk lid including an upper panel, an extension panel, and a lower panel. The jig apparatus may include: a jig frame; a first activation jig unit configured to align and fix the upper panel and the extension panel and installed at the jig frame in front and rear directions to be tilting-rotatable; and a second activation jig unit aligning and fixing the lower panel and installed at the jig frame to be linearly movable in the front and rear directions with respect to the first activation jig unit.

An electrical connection is established between a first electrical component and a second electrical component of an assembly and a compression tool is used to apply a compression force to the assembly. The assembly also includes a metallized particle interconnect (MPI) between the first electrical component and the second electrical component and solder components outside a boundary of the MPI and extending from the first electrical component to the second electrical component. The solder components are melted by applying heat to the assembly. The solder components are solidified by cooling the assembly and the compression tool is removed.

A mounting apparatus is equipped with: an attachment including a surface for attaching a semiconductor die; a heater which is disposed on a side of the attachment opposite to the surface and heats the semiconductor die attached to the surface; a suction hole which penetrates through the attachment and the heater integrally and opens in the surface; and a body portion which is disposed on a side of the heater opposite to the attachment and on which a vacuum suction path in communication with the suction hole is arranged. The vacuum suction path includes a storage portion which stores a foreign matter consisting of a liquid formed by condensation of a gas suctioned from the suction hole or a solid formed by solidification of the liquid.

A welding system comprises a welding module and a moving module adapted to move the welding module to a predetermined welding position. The welding module includes a guiding device and a welding tool. The guiding device has a plurality of tubular guiding heads arranged in a row, ends of the plurality of tubular guiding heads are disposed close to joints of a plurality of cables so as to guide a plurality of welding wires to the joints of the plurality of cables. The welding tool has a plurality of tooth-shaped welding heads arranged in a row, ends of the plurality of tooth-shaped welding heads are disposed close to the joints of the plurality of cables and configured to simultaneously heat the plurality of welding wires guided to the joints of the plurality of cables, so as to simultaneously weld the joints of the plurality of cables onto a circuit board.