An automatic wire arranging device includes a controller, at least one driving device electrically connected with the controller, a first wire clamping jig connected with the at least one driving device, a second wire clamping jig disposed to the first wire clamping jig, at least one charge-coupled device camera connected with the controller, and at least one puncher pin connected with the at least one driving device. The first wire clamping jig opens a plurality of first clamping slots. Each of the plurality of the first clamping slots opens a through-hole. The second wire clamping jig opens a plurality of second clamping slots. The at least one puncher pin is capable of penetrating through the through-hole and pushing against a core wire to be away from one of the plurality of the first clamping slots and be blocked in one of the plurality of the second clamping slots.

A solder reflow apparatus includes: a reflow chamber configured to receive a heat transfer fluid, wherein the heat transfer fluid transfers heat to a solder for mounting an electronic part on a substrate; a heater configured to heat the heat transfer fluid in the reflow chamber; a stage arranged in the reflow chamber to support the substrate; and a jig disposed on the electronic part and fixing the electronic part.

Presented herein is a device processing boat comprising a base and at least one unit retainer disposed in the base. The device further comprises a cover having at least one recess configured to accept and retain at least one unit. The at least one recess is aligned over, and configured to hold the at least one unit over, at least a portion of the at least one unit retainer. The cover is retained to the device processing boat by the at least one unit retainer. At least one pressure sensor having at least one sensel is disposed in the base. The sensel is configured to sense a clamping force applied by the cover to the at least one unit.

An apparatus for bonding a flexible part including inclined leads is provided, more particularly, an apparatus for bonding a flexible part including inclined leads, which aligns parts to bond the parts is provided. According to the apparatus for bonding a flexible part including inclined leads, an electronic part may be easily bonded to a part having an inclined surface.

Systems and methods for moving a substrate to a vision system using a robot; using the vision system to determine where a braze material is to be applied to the substrate; moving the substrate to a braze dispenser using the robot; applying a braze material to the substrate using the braze dispenser based on the determination from the vision system; and using the vison system to determine whether to apply additional braze to the substrate, including for the substrate of a component for gas turbine engine, such as configured for use in an aircraft.

The present invention relates to a soldering method of a soldering jig. The soldering method comprises the steps of providing a substrate having a soldering area and at least one positioning area in which a positioning part is disposed in the positioning area, placing a workpiece on the substrate, positioning the workpiece through the positioning part, using a heating method to remove an isolating film on the workpiece, and placing a piece of solder in the soldering area of the substrate and then melting the piece of solder such that the workpiece is soldered to the soldering area through the piece of solder.

The present invention relates to a soldering jig. The soldering jig comprises a substrate having a soldering area and at least one positioning area in which a positioning part is disposed in the positioning area. A workpiece is placed on the substrate and positioned through the positioning part. By means of a heating method, an isolating film is moved from the workpiece. A piece of solder is placed in the soldering area of the substrate and melting such that the workpiece is soldered to the soldering area through the piece of solder.

A thermal interface material and method of making the same includes growing a carbon nanotube array on a first substrate and brazing the distal ends of the carbon nanotube array to a second substrate using a braze material. In at least one embodiment, the braze material includes active elements. The method further includes performing the brazing process in an inert or vacuum atmosphere.

A jig for bonding a semiconductor chip may include a pressurizing portion and at least one opening. The pressuring portion may be configured to pressurize an upper surface of the semiconductor chip bonded to a package substrate via a bump and a flux using a laser. The opening may be surrounded by the pressurizing portion. The laser irradiated to the bump and the flux may be transmitted through the opening. A vapor generated from the flux by the laser may be discharged through the opening. Thus, the contamination of the jig caused by the vapor may be prevented so that a transmissivity of the laser through the jig may be maintained.

A jaw assembly includes an electrically-conductive tissue-engaging structure, a jaw member including a support base, and a non-electrically conductive member including a first portion configured to engage the electrically-conductive tissue-engaging structure and a second portion configured to engage the support base of the jaw member. The non-electrically conductive member adapted to electrically isolate the electrically-conductive tissue-engaging structure from the jaw member. The electrically-conductive tissue-engaging structure and the non-electrically conductive member cooperatively define a longitudinally-oriented knife channel therethrough.