Disclosed is a handle clamp for an exothermic mold. The clamp includes a pair of legs, each having a plurality of rods that are shaped to fit into engagement holes on sections of the mold. The rods of each leg engage with one section of the mold. Engagement brackets are rotatably disposed on one or more or the rods. The brackets each have a thumb bolt that can be extended toward a mold section connected with the clamp. When engaged with the mold section, the thumb bolt stabilizes the mold section on the handle. A detent mechanism is provided between the bracket and the leg of the handle. The detent mechanism releasably holds the bracket in one of a selected plurality of rotational positions with respect to the rod. By selecting different rotational positions for the brackets, the handle can be configured to engage with different configurations of mold. The thumb bolts that are biased toward the mold section by a spring. The bolts include a key that can be aligned or misaligned with a key slot on the bracket. By aligning the key with the key with the key slot, the bolt can be moved toward or away from the mold section under the biasing force of the spring. By misaligning the key and key slot, the bolt can be locked into engagement with the mold section or else held in a disengaged position.

A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

A bonding apparatus includes a vacuum holder and a thermal head. The vacuum holder is configured to attach a non-bonding area of a printed circuit board. A side of the vacuum holder has a first lower sidewall, a first upper sidewall, and a first connection surface adjoining the first lower sidewall and the first upper sidewall. The thermal head is adjacent to the vacuum holder and configured to hot press a bonding area of the printed circuit board. A side of the thermal head proximal to the vacuum holder has a second lower sidewall, a second upper sidewall, and a second connection surface adjoining the second lower sidewall and the second upper sidewall. The second connection surface overlaps at least a portion of the first connection surface, and a height of the second lower sidewall is greater than a height of the first lower sidewall.

A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

A paste dispensing transfer system of a stencil printer is configured to print an assembly material on an electronic substrate. The transfer system includes a paste cartridge mechanism coupled to a print head assembly of the stencil printer, and a rotary indexing mechanism coupled to a frame of the stencil printer. The paste dispensing transfer system is configured to transfer a used paste cartridge from the print head assembly to the rotary indexing mechanism supported by the frame and to transfer a new paste cartridge from the rotary indexing mechanism to the print head assembly.

A solar cell connecting method for manufacturing a solar cell string, includes placing first interconnectors on a working table by a first fixing member fixing both sides of the first interconnectors in a longitudinal direction and transporting the first interconnectors in a state that the first interconnectors are spaced apart from each other at intervals; placing a first solar cell on the first interconnectors, fixing the first solar cell and the first interconnectors by an exhaust adsorption, and releasing the first fixing member from the first interconnectors; and placing second interconnectors on the first solar cell and the working table by the first fixing member fixing both sides of the second interconnectors in a longitudinal direction and transporting the second interconnectors in a state that the second interconnectors are spaced apart from each other at intervals.

A stencil printer is configured to print an assembly material on an electronic substrate. The stencil printer includes a frame, a stencil coupled to the frame, a support assembly coupled to the frame, and a print head gantry coupled to the frame. The print head gantry includes an elongate beam that rides along rails provided on the frame and a print head assembly supported by the print head gantry in such a manner that the print head assembly is configured to traverse the stencil during print strokes. The print head assembly includes a print head having a squeegee blade assembly configured to roll solder paste along the stencil. The stencil printer further includes a solder paste bead recovery system configured to remove a bead of solder paste from a top surface of the stencil and to deposit the bead of solder paste onto a new replacement stencil.

Disclosed is a handle clamp for an exothermic mold. The clamp includes a pair of legs, each having a plurality of rods that are shaped to fit into engagement holes on sections of the mold. The rods of each leg engage with one section of the mold. Engagement brackets are rotatably disposed on one or more or the rods. The brackets each have a thumb bolt that can be extended toward a mold section connected with the clamp. When engaged with the mold section, the thumb bolt stabilizes the mold section on the handle. A detent mechanism is provided between the bracket and the leg of the handle. The detent mechanism releaseably holds the bracket in one of a selected plurality of rotational positions with respect to the rod. By selecting different rotational positions for the brackets, the handle can be configured to engage with different configurations of mold. The thumb bolts that are biased toward the mold section by a spring. The bolts include a key that can be aligned or misaligned with a key slot on the bracket. By aligning the key with the key with the key slot, the bolt can be moved toward or away from the mold section under the biasing force of the spring. By misaligning the key and key slot, the bolt can be locked into engagement with the mold section or else held in a disengaged position.

The present application provides an automatic solder paste addition apparatus and system for a solder paste printer, the apparatus comprising: a push rod, a pressure plate, a support plate, a movable plate and a working platform; the pressure plate moves up and down as the push rod moves up and down, the support plate is fixed in relation to movement of the push rod, an outer side of the movable plate is disposed on the support plate so as to be capable of sliding up and down, the pressure plate is disposed on an inner side of the movable plate so as to be capable of sliding up and down, and the working platform is fixed to the movable plate and used for bearing a solder paste tub, wherein a lower one-way locking mechanism is provided between the movable plate and the support plate, the lower one-way locking mechanism being configured to lock the movable plate when the movable plate is in the working position, so that the movable plate cannot move downward; and wherein an upper locking mechanism is provided between the movable plate and the pressure plate, the upper locking mechanism being configured so that the pressure plate can move relative to the movable plate when the movable plate is not moving, and can also move together with the movable plate when the movable plate is moving.

A system for automatically brazing joints in a manifold has a loading station, a brazing station, and a cooling station. The brazing station has a plurality of brazing torches moveable to a joint in the manifold to braze the joint. First, second and third fixture frames extend from a common rotatable platform. The platform rotates each of the fixture frames to each of the loading station, brazing station, and cooling station in turn. The fixture frames support manifolds with joints requiring brazing. The torches are disposed on a lifting platform that lifts the torches up to a desired joint. The lifting platform is disposed on a sliding platform that slides the torches horizontally to the desired joint. The torches surround the joint and braze it from all sides simultaneously. While brazing is being performed at the brazing station, loading and unloading of manifolds may be done at the loading station, and cooling of already-brazed manifolds may take place at the cooling station.