Methods and apparatus are described for high temperature assembly processes. In an example embodiment, a void defined by an expandable enclosure is filled with a quantity of gas. A clamping structure is configured to receive components to be joined and to apply a force from the surface of the enclosure to at least one of the components such that the components are urged together responsive to heating the quantity of gas. Example methods include providing a workpiece that comprises two or more components with a joining material disposed between them, providing an expandable enclosure that contains a volume of gas, heating the workpiece and the volume of gas, and coupling a force from the expandable enclosure to the workpiece such that the force urges the components together.

A welding connection element includes a body and an assembly portion. The body includes a fitting fastening portion having an elastic withdrawal space. The elastic withdrawal space is capable of elastically withdrawing two or more fastening portions, so as to enable the fastening portions to be receivingly fastened in another object. The welding connection element has a welding surface configured to be welding connected to a welding surface of the object. The welding surface of the object is provided in advance with a solder layer configured to be heated and to welding connect the welding connection element and the welding surface of the object. The welding connection element is provided at a carrier in advance, taken out by a tool, compared with an assembly position of the object by a comparison device, and placed at the assembly position by the tool so as to be assembled with the object.

Disclosed is a warpage suppressing reflow oven, which comprises a reflow oven body, where a perforated steel plate circulating device comprising a perforated steel plate is disposed at a reflow-oven inner oven. A plurality of downdraft modules is arranged in the perforated steel plate, and the downdraft acting forces thereof face the upper panel. More than one air extractor is communicated with the plurality of downdraft modules via a plurality of pipelines. Under actuation of the air extractors, the downdraft modules generate downdraft acting forces to the bottom surfaces of the products, so that the products are flatly attached to the universal perforated carriers without warpage in a heat soldering process. Thereby, more uniform heating of the products and better contact of solder joints and effectively improving the yield of reflow soldering operations are achieved.

A radiating structure assembly system includes a movable conveyor that supports fixtures. Work stations are spaced about the conveyor such that the fixtures are moved sequentially to position the fixtures at the plurality of work stations. A first work station includes a loading assembly for loading the radiating elements on the fixtures. A second work station includes a first automated vertical assembly machine for mounting a first printed circuit board to the radiating element. A third work station includes a second automated vertical assembly machine for mounting a second printed circuit board to the radiating element to create a dipole assembly. A holding device is movable with the conveyor aligns and supports the first and second printed circuit boards relative to the radiating element. A fourth work station includes an unloading assembly for removing the dipole assembly from the conveyor.

Disclosed are a laser bonding apparatus and a laser bonding method capable of bonding an electronic component to a three-dimensional structure having a regular or irregular shape in a curved portion such as an automobile tail lamp or a headlamp. The laser bonding apparatus and method for a three-dimensional structure may prevent misalignment and poor bonding of the electronic component with respect to the three-dimensional structure.

A bonding apparatus provided with a gas supplying unit for causing an inert gas to be sprayed from a spray aperture provided adjacent to a holding section of the bonding head. The spray aperture is provided so as to surround the holding section of the bonding head, in which a portion of the slits is a wide slit set to a higher jet flow rate of the inert gas than narrow slits of another portion, and the inert gas sprayed from the wide slit and the narrow slits forms an air curtain that surrounds the bonding portion between the semiconductor chip and the substrate. The inert gas sprayed from the wide slit forms a flow that passes between the semiconductor chip and the substrate.

A precision soldering fixture provides a way to properly align and hold wires in place for soldering. The precision soldering fixture comprises a support member and a clamping assembly. The support member includes one or more elongated channels for wires of varying gauges. The support member may also include a connector notch for holding and soldering wires to electrical connectors. The clamping assembly further comprises a nut and bolt base mechanism that includes clamping bars to hold the wires in place and nuts, preferably knurled fingers nuts, which tighten the clamping bars in place which in turn clamp down on the wires holding the wires in place. There can also be attachments secured to the support member to facilitate use. One such attachment may be a vise block fastened to the support member when securing the precision soldering fixture in a vise. Another attachment may be an alligator clip secured between the support member and the vise block for clipping the precision soldering fixture for soldering wires in situ. Another attachment is a base with a magnet for attaching the precision soldering fixture to magnetic surfaces.

A method of applying a braze component to a honeycomb structure may comprise: applying at least a partial vacuum within a chamber, the chamber defined at least partially by a vacuum device and a cover, the honeycomb structure disposed within the chamber, the braze component disposed between the honeycomb structure and the cover; pulling the cover towards the braze component in response to applying the partial vacuum; and pulling the braze component into a plurality of hexagonal cells defined by the honeycomb structure in response to pulling the cover towards the braze component.

Provided are a wire jig and a tabbing apparatus including the wire jig. The wire jig configured to support at least one wire includes: a main body including a window therein; and at least one support portion arranged to correspond to the window and including at least one support component, wherein the at least one support component is configured to press the at least one wire.

A heat exchanger brazing fixture including a baseplate including a first surface and a second surface located opposite the first surface and a first post including a first end and a second end located opposite the first end. The first post is operably associated with the first surface of the baseplate at the first end. The A heat exchanger brazing fixture further including a top plate operably connected to the first post and separated from the first surface of the baseplate by a selected distance. The top plate being configured to move in a first direction along the first post when a heat exchanger resting upon the first surface of the baseplate expands during a brazing process.