B23K9/042

Welded assembly and method of welding using electro-spark discharge

A welded assembly includes a first object, a second object, and an interlayer. The interlayer is an ESD coating deposited on the first object, and the second object is welded to the coating. The second object may be a material that has thermally sensitive properties, such as a shape-memory material. The second weld may also be made by ESD. The interlayer may be made of more than one layer. The layer or layers may be deposited of a material chosen for its compatibility with one, the other, or both of the material of the first object and the material of the second object.

METHODS OF WELDING AND WELDED ARTICLES
20180236583 · 2018-08-23 ·

In some embodiments, a method of welding includes welding at least one fill bead to fill at least one gap on a substrate with arc scanning by an arc welder. The gap is defined by at least one weld bead on the substrate. The weld beads are non-overlapping. A welded article includes a substrate including a crack-prone superalloy and at least one weld bead and at least one fill bead welded on the substrate. The fill bead, the weld bead, and a heat-affected zone of the substrate are micro-crack-free and macro-crack-free. In some embodiments, a method of welding includes welding weld beads on a substrate and welding fill beads on the substrate with an arc welder while arc scanning. The fill beads fill the gaps between neighboring pairs of weld beads. The fill beads are welded in a non-sequential order.

Reaction material pre-placement for reaction metallurgical joining

A method of pre-placing a reaction material onto a surface of a metal workpiece substrate involves the use of oscillating wire arc welding. The method involves depositing and adhering the reaction material from a consumable electrode rod. In doing so, the reaction material can be deposited at any time before the metal workpiece substrate is ready for joining by reaction metallurgical joining, and the size and shape of the reaction material deposit can be more easily controlled.

3D PRINTING APPARATUS
20180178304 · 2018-06-28 ·

An apparatus for making three-dimensional physical objects of a predetermined shape includes a printing header having a least one arc welding torch. The arc welding torch includes an axially extending first nozzle and an axially extending non-consumable electrode, which is disposed substantially coaxially within the first nozzle and having a tip disposed at a distal end thereof and/or outside the first nozzle; means for supplying electricity to the electrode; means for supplying a protecting gas to the first nozzle for shielding the electrode from oxidising conditions; an axially extending through-hole formed through the electrode; an elongated non-electrified guide portion disposed within the through-hole terminating inwardly of the tip; and a consumable material wire that is fed through the guide portion relatively to the electrode so that the material wire is not electrified by the guide portion or by the electrode.

Method for repairing fuel nozzle guides for gas turbine engine combustors using cold metal transfer weld technology
09995487 · 2018-06-12 · ·

A fuel nozzle guide for a combustor of a turbine engine includes an annular base with a hub section, the hub section at least partially formed of a Cold Metal Transfer (CMT) weld and a method and system therefor.

Method and system for additive manufacturing using high energy source and hot-wire

A method and system to manufacture workpieces employing a high intensity energy source to create a puddle and at least one resistively heated wire which is heated to at or near its melting temperature and deposited into the puddle as droplets.

METHOD AND DEVICE FOR PRODUCING A HOLLOW BODY
20180071849 · 2018-03-15 · ·

In a method for producing a hollow body, a hollow body wall is created, which delimits a hollow space and which has a hollow space side facing the hollow space and an outer side facing away from the hollow space. The hollow body wall is created in portions by constructing wall segments that are adjacent to one another. Following the construction of a wall segment, the constructed wall segment is processed on the hollow space side before a further wall segment is constructed adjacent to the constructed wall segment. A device for carrying out this method comprises a processing device, by means of which a wall segment constructed by a constructing device is processed on the hollow space side before a further wall segment can be constructed adjacent to the constructed wall segment by the constructing device.

Systems for Dual Plasma Wire Arc Additive Manufacturing and Methods Thereof

A plasma arc torch assembly is capable of additively manufacturing articles. A device may additively manufacture at least a portion of an article using the plasma arc torch assembly. A device may deactivate at least one plasma arc associated with the plasma arc torch assembly. A device may perform plasma arc surface smoothing of the article using the plasma arc torch assembly.

Metal laminating and modeling method

A metal laminating and modeling method includes a first inclination angle modeling step including a first inclination step of setting a table on which the metal layers are to be formed at a first table inclination angle and setting a welding torch at a first torch inclination angle and a first welding step of forming a weld bead that becomes a part of the modeled object by arc welding with the welding torch and a second inclination angle modeling step including a second inclination step of inclining the table at a second table inclination angle that is larger than the first table inclination angle and setting the welding torch at a second torch inclination angle and a second welding step of forming the weld bead.

Directly Cooled Substrates for Semiconductor Modules
20170304922 · 2017-10-26 ·

A semiconductor module includes a substrate having a metallized first side and a metallized second side opposing the metallized first side. A semiconductor die is attached to the metallized first side of the substrate. A plurality of cooling structures are welded to the metallized second side of the substrate. Each of the cooling structures includes a plurality of distinct weld beads disposed in a stacked arrangement extending away from the substrate. The substrate can be electrically conductive or insulating. Corresponding methods of manufacturing such semiconductor modules and substrates with such welded cooling structures are also provided.