A system is for bonding a cover sheet to a core to form or repair a dual wall structure. The system includes a cover sheet probe and an inner pedestal probe. A three dimensional contoured tip of the cover sheet probe abuts against a three dimensional contoured outer surface of the cover sheet opposite a pedestal of the core. The pedestal abuts the inner surface of the cover sheet. The inner pedestal probe may be coupled to the core to create a conductive electrical path from the cover sheet probe through at least part of the structure. A flow of electric power is controlled and supplied to the cover sheet probe to heat a junction between the area of the cover sheet abutting the pedestal and the pedestal. A heated area is created in the junction and fixedly couples the coversheet and the pedestal.

A combined stackup apparatus with a perforated interlayer for resistance spot welding is provided. The apparatus comprises a first metal sheet of a first material and a second metal sheet of a second material. The apparatus further comprising a perforated interlayer disposed between the first metal layer and the second metal layer. The perforated interlayer is made of one of the first and second materials. The perforated interlayer has a plurality of perforations formed therethrough. Each perforation has a perforation size of between about 0.1 mm and about 3 mm.

A spot welding method includes a heating step of energizing an electrode in pressure contact with an Al alloy member to heat and melt a join part by resistance heating and a cooling step of cooling the join part after the heating step in a state in which the electrode is in pressure contact with the Al alloy member. The alloy is a wrought alloy of Mg: 0.2 to 1.2 mass %, Si: 0.4 to 1.5%, and Cu: 1.1% or less or a casting alloy of Si: 7 to 11% and Mg: 0.1 to 0.4% with respect to 100% as a whole. The cooling step includes a first cooling process performed with a reduced amount of input energy to the join part as compared with the heating step and a second cooling process performed after the first cooling process at a higher cooling rate than that in the first cooling process.

A bonding system is used for bonding a cover sheet to a core to form or repair a dual wall structure. The bonding system includes a plurality of bonding probes and controller circuitry. The bonding probes include a three dimensional (3D) contoured tip configured to align with a predetermined area of a 3D contoured cover sheet of a dual wall structure. The controller circuitry comprises processor circuitry and sensor circuitry. The sensor circuitry provides a location of an area of the 3D contoured cover sheet for bonding. The processor circuitry identifies a bonding probe having a contacting area that aligns with the 3D contour of the cover sheet in the location provided by the sensor circuitry.

A welding assembly including a current generator, a first electrode electrically coupled to the current generator, the first electrode including a first engagement surface, a second electrode electrically coupled to the current generator, the second electrode including a second engagement surface, a width-determining fixture positioned between the first electrode and the second electrode to define a welding volume having a width, and an electrically nonconductive material positioned to electrically insulate at least one of the first electrode and the second electrode from an electrical conductor outside the width.

A welding electrode includes a weld face that has a convex base weld face surface and a plurality of ringed ridges that are radially spaced apart on the base weld face surface and surround a central weld face axis. The plurality of ringed ridges including an innermost ringed ridge and an outermost ringed ridge. The innermost ringed ridge is located closest to the central weld face axis and rises above a central portion of the base weld face surface, and the outermost ringed ridge is located farthest from the central weld face axis and rises above an outer peripheral portion of the base weld face surface. At least one of the plurality of ringed ridges is a discontinuous ringed ridge.

A method of securing a first component part and a second component part together, the method comprising providing an electrically conductive member between a first surface of the first component part and a facing first surface of the second component part and securing the first and second components together by passing a current through the electrically conductive member. The electrically conductive member is distributed across at least 50% of the surface area of the first surface of the first component part.

A method of securing a first component part and a second component part together, the method comprising providing an electrically conductive member between a first surface of the first component part and a facing first surface of the second component part and securing the first and second components together by passing a current through the electrically conductive member. The electrically conductive member is distributed across at least 50% of the surface area of the first surface of the first component part.

Provided is a method of welding laminated metal foils that can prevent blowholes and spatter from being formed. It is a method of welding laminated metal foils sandwiched between a pair of metal plates to the pair of metal plates. The method of welding laminated metal foils sandwiched between a pair of metal plates to the pair of metal plates includes locally pressing and crimping the laminated metal foils sandwiched between the pair of metal plates at a welding point in a laminating direction, and welding the crimped pair of metal plates and laminated metal foils at the welding point.

A method for fusing an electrical conductor to a film pad circuit including the steps of: providing an electrically inert substrate having a first surface and an opposing second surface; applying an electrically conductive film to the second surface of the electrically inert substrate; applying an electrically conductive member to the electrically conductive film; placing an electrical conductor on the first surface of the electrically inert substrate; and fusing the electrical conductor to the conductive member.