B23K20/004

Method for manufacturing terminal-equipped electric wire, and terminal-equipped electric wire
10826261 · 2020-11-03 · ·

A method for manufacturing a terminal-equipped electric wire includes forming, in an electric wire, a bonded portion in which strands of a conductor exposed due to absence of a sheath are bonded to each other. A terminal including a wire barrel portion is fixed to the electric wire such that the wire barrel portion covers at least a part of the bonded portion. A sectional shape of the bonded portion before the fixing of the terminal is formed in such a shape that a variable range of a value of a distance between a geometric center of a cross section of the bonded portion and the wire barrel portion falls within a range of 0.71 to 1.29 when rotating the bonded portion by an arbitrary angle while engaging the bonded portion with the wire barrel portion within the wire barrel portion.

RIBBON BONDING TOOLS AND METHODS OF USING THE SAME

A ribbon bonding tool including a body portion is provided. The body portion includes a tip portion. The tip portion includes a working surface between a front edge of the tip portion and a back edge of the tip portion. The working surface includes a region defining at least one of a plurality of recesses and a plurality of protrusions. The working surface also defines at least one of (a) a first planar portion between the region and the front edge of the tip portion, and (b) a second planar portion between the region and the back edge of the tip portion.

WIRE BONDING APPARATUS AND CONTROL METHOD
20240014432 · 2024-01-11 · ·

A wire bonding apparatus includes a conveying unit configured to convey a pallet on which a work is placed, at least one bonding head configured to perform wire bonding for the work, and a moving unit configured to move the at least one bonding head. The conveying unit includes a first conveying unit configured to convey the pallet to a work region, and a second conveying unit configured to convey the pallet in the work region. The second conveying unit includes a table with a positioning unit configured to positioning the pallet, a second moving mechanism configured to repeat moving the table and stopping the table. A positioning state of the pallet by the positioning unit is kept while the pallet is conveyed, and the at least one bonding head performs work for the work.

BONDING TOOL AND METHOD FOR PRODUCING A BONDING TOOL

A production method for a bonding tool with a body that has an elongated tool shank of the bonding tool and a tool tip adjoining the tool shank, and with a blind hole that is provided in the region of an elongated tool shank of the bonding tool and that is carried into the region of a tool tip, wherein a contact surface of the bonding tool is provided on the tool tip, comprising the following production steps: first a through opening is produced that is carried through the tool shank to the tool tip; then the through opening is closed in the region of the tool tip by a terminating element inserted into the body.

Clamping system, wire bonding machine, and method for bonding wires

A clamping system, a wire bonding machine and a method for bonding wires are provided. An exemplary clamping system includes a clamping device. The clamping device includes: at least one linear guide rail; a first clamping rod arranged perpendicular to the linear guide rail; and a second clamping rod arranged perpendicular to the linear guide rail and parallel to the first clamping rod.

Display device and inspection method of bonding resistance
10768730 · 2020-09-08 · ·

A display device includes a plurality of pixels, a plurality of data lines connected to the pixels, an inspection circuit unit connected to the data lines, a driving circuit unit connected or configured to be connectable to the data lines, a bonding region comprising a first pad, a second pad, a third pad, and a fourth pad, the first pad and the second pad being electrically connected to each other through a first conductor, and the third pad and the fourth pad being electrically connected to each other through a second conductor, a first wire connected to the driving circuit unit and the third pad, a second wire connected to the driving circuit unit and the inspection circuit unit and a third wire connected to the inspection circuit unit and the first pad, where the second pad and the fourth pad are electrically connected to each other.

Systems and methods of operating wire bonding machines including clamping systems

A method of operating an ultrasonic bonding machine is provided. The method includes the steps of: (a) imaging at least one of (i) a semiconductor element supported by a substrate, and (ii) a clamping structure adapted for securing the substrate during a bonding operation; and (b) determining if a relative position of the semiconductor element and the clamping structure is acceptable using predetermined criteria and information from step (a).

Device and method for establishing electric contact between an energy storage cell and a conductor plate structure using a conductor cable
10741986 · 2020-08-11 · ·

A device for establishing an electric contact between an electric energy storage cell and an electrically conductive conductor plate structure via an electrically conductive conductor wire. A tool establishes an electric contact between the electrically conductive conductor wire and the electric energy storage cell, and establishes an electric contact between the electrically conductive conductor wire and the electrically conductive conductor plate structure. The tool has a tool element that is movable through a perforation on the side of a conductor plate structure at least with its free end. In the region of the free end, a contacting device is arranged or built for forming an electric contact between the energy storage cell.

LASER PRETREATMENT OF METAL SUBSTRATES FOR ELECTRICAL CIRCUIT BOARDS
20200223014 · 2020-07-16 ·

Methods for processing a metal substrate for use in a power electronics device are provided. In one example, the method includes placing a metal substrate on a support associated with a laser system. The method includes performing a pulsed laser treatment process on at least a portion of the surface of the metal substrate. The pulsed laser treatment process exposes the at least a portion of the surface of the metal substrate to a plurality of laser pulses to modify a surface roughness of the at least a portion of the surface of the metal substrate. After performing the pulsed laser treatment process, the method includes creating a metallized interface for coupling an electrical component to the metal substrate at the at least a portion of the surface of the metal substrate.

Method for cutting material to be cut
10695933 · 2020-06-30 · ·

The invention relates to a method for cutting material to be cut, which is preferably realized as a rod-shaped element, comprising a receiving device for fixedly receiving the material to be cut in such a manner that a part to be separated from the material to be cut protrudes over an element edge of the receiving device realized as a counter knife edge (42), and comprising a knife unit having a knife (24), which is movable with respect to the receiving device and which moves a knife edge (25) past the counter knife edge (42) in a cutting movement for executing a separating cut, the welding material being subjected to ultrasound for executing oscillations during the cutting movement.