An ultrasonic bonding head includes a vibrator unit, a holder, and a pressurizing shaft. The vibrator unit includes a press part formed at a tip of the vibrator unit in a longitudinal axis thereof and configured to press a bonding scheduled part to be bonded. The holder holds a base of the vibrator unit in a cantilever manner so that the tip is a free end. The pressurizing shaft is connected with the holder and transmits a force of pressing the press part against the bonding scheduled part so that the vibrator unit moves substantially perpendicularly to the longitudinal axis. The holder is provided with a restraint portion. The restraint portion contacts with the vibrator unit at a counterforce dispersion position located between a main hold position for holding the vibrator unit by the holder and the free end.

A manufacturing method of an electric wire bundle includes arranging the conductor core wire of a first electric wire among the plurality of electric wires from which the conductor core wire is exposed at a processing position of a welding machine, arranging a second electric wire of the plurality of electric wires at the processing position so as to align an end position of the conductor core wire of the second electric wire with an end position of the conductor core wire of the first electric wire, performing a welding process to the conductor core wire of the first electric wire and the conductor core wire of the second electric wire by the welding machine to form a preliminary welding portion, and forming the core wire welding portion by repeating processes for all of the plurality of electric wires.

A manufacturing method of an electric wire bundle includes arranging a conductor core wire of a first electric wire at a processing position of a welding machine, arranging a second electric wire at the processing position so as to align an end position of a conductor core wire of the second electric wire with an end position of the conductor core wire of the first electric wire, forming a welding process to the conductor core wire of the first electric wire and the conductor core wire of the second electric wire by the welding machine to form a preliminary welding portion, forming the core wire welding portion by repeating processes for all of the plurality of electric wires, and controlling a magnitude of an energy used in the welding process based on characteristics of conductor core wires to be welded by the welding machine.

A bonding apparatus includes: a clamper able to clamp a wire between a pair of arms; a horn, in which a first through hole able to hold a capillary, and a second through hole adjacent to the first through hole and penetrating the horn in an up-down direction are further formed; and a bonding stage able to carry a workpiece. An alignment method for aligning a horn and a damper of a bonding apparatus with each other includes: disposing a mirror surface to be parallel to a bonding stage; aligning a mirror image of a second through hole reflected on the mirror surface with a center of the second through hole when the mirror surface is viewed through the second through hole; and aligning the damper based on a position of the mirror image and the horn.

An ultrasonic welding device includes a sonotrode, an anvil, a touching element, a lateral slide, a stop element and a receiving chamber in which joining partners are received and which is defined by bordering components of the ultrasonic welding device. The receiving chamber is defined on a first side by the sonotrode and on a second side by the anvil. The receiving chamber is further defined on a third side by the touching element and on a fourth side by the lateral slide. The receiving chamber is further defined on a fifth side, extending transverse to the first to fourth sides, by the stop element. The first stop element is electrically conductive on its surface directed toward the receiving chamber in order to form a first electrode.

A method is provided for electrically conductively connecting a contact part to a conductor having a multiplicity of individual wires includes inserting the conductor into a cavity in the contact part and lowering a tool for friction stir welding onto the contact part. The tool for friction stir welding is moved on the contact part in a plane, thus giving rise to a planar cohesive connection between the contact part and the conductor. In this way, a direct cohesive connection of a stranded conductor and a contact part is produced without the need for an additional part such as a sleeve, for example, to prevent the stranded conductor from sticking out.

A method of adjusting a clamping of a semiconductor element against a support structure on a wire bonding machine is provided. The method includes: (a) detecting an indicia of floating of the semiconductor element with respect to the support structure at a plurality of locations of the semiconductor element; and (b) adjusting the clamping of the semiconductor element against the support structure based on the results of step (a).

In an ultrasonic joining apparatus according to the present disclosure, an ultrasonic joining apparatus control board controls an operation of a lead set unit and a tension adjustment unit including a dancer roller to perform joining tension control processing. The joining tension control processing includes steps of: making a lead wire housing mechanism perform a rewinding driving of rewinding a lead wire in a lead cassette when the dancer roller reaches a lower limit adjustment position in a tension adjustment range; and making the lead wire housing mechanism perform a delivery driving of sending out the lead wire from the lead cassette when the dancer roller reaches an upper limit adjustment position in the tension adjustment range.

A wire bonding method for connecting a wire to two different surfaces by bonding with a single wire bonding step. The wire bonding method includes: bonding one end of a wire fed from a distal end of a capillary to a first bonding surface; moving the capillary in the Z direction; moving the capillary the X and/or Y direction; moving the capillary in the X, Y, and/or Z direction, a plurality of times; moving the capillary to a highest position; and bonding another end of the wire to the second bonding surface. The wire bonding method includes, at any timing, rotating the first bonding surface about a rotation axis to move the second bonding surface to a position capable of bonding. An angle formed by the first bonding surface and the second bonding surface on a side where the wire is stretched is 200? or more.

A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.