An ultrasonic horn (50) includes: a vibration source part (53) to which an ultrasonic vibrator (58) is mounted; a tip end part (56) to which a capillary (18) is mounted; and an intermediate part (54) which is interposed between the tip end part (56) and the vibration source part (53) and propagates vibration generated by the ultrasonic vibrator (58) to the tip end part (56). The intermediate part (54) is formed with a single spiral hole (68) which is a hole penetrating in a radial direction of the ultrasonic horn (50) and advances in an axial direction as the spiral hole advances in a circumferential direction.

The invention relates to a method for cutting material to be cut, which is preferably realized as a rod-shaped element, comprising a receiving device for fixedly receiving the material to be cut in such a manner that a part to be separated from the material to be cut protrudes over an element edge of the receiving device realized as a counter knife edge (42), and comprising a knife unit having a knife (24), which is movable with respect to the receiving device and which moves a knife edge (25) past the counter knife edge (42) in a cutting movement for executing a separating cut, the welding material being subjected to ultrasound for executing oscillations during the cutting movement.

A wire bonding method includes: arranging a plurality of wires by inserting the wires with partially-exposed conductors into each groove of a wire arrangement tool provided with a plurality of grooves; and sandwiching the conductors of the plurality of wires arranged by the wire arrangement tool in a predetermined direction and bonding the conductors to each other. Further, in this wire bonding method, the sandwiching causes one arbitrary conductor among the conductors to receive a biasing force in a direction intersecting a direction of a force applied by the sandwiching, from another conductor in contact with the one arbitrary conductor among the conductors.

The present disclosure relates to a system of modular functional blocks that may be used to facilitate easy assembly of a welding head assembly in any one of a wide variety of configurations to allow for distribution of welding wire, gas, cooling fluid and other media throughout an interconnected assembly of the modular functional blocks. As such, the modular functional blocks can be mixed and matched into any desired configuration as needed depending on the welding process being undertaken. The modular functional blocks may be in the form of one or more different welding wire delivery blocks, gas delivery blocks, cooling water delivery blocks, shim plates, end plates, shield cup, cover plates, insulating plates, etc.

A method for operating an ultrasonic wire bonder. The ultrasonic wire bonder has a bonding head with a bonding tool and with a transducer for exciting ultrasonic vibrations in the bonding tool and a controller (2) for the transducer (1). In a first process phase I a bonding wire is bonded to a substrate. The bonding wire is pressed against the substrate with a bonding force via a tool tip of the bonding tool, and the bonding tool is then excited so as to undergo ultrasonic vibrations in order to produce a bond between the bonding wire and the substrate, the transducer (1) being excited so as to vibrate for a specified or variable bonding time. In a second process phase II, the actuation of the transducer (1) is changed and reverberations of the bonding tool are counteracted, the transducer (1) being operated in a damped manner.

In a described example, an electrical apparatus includes a substrate having a first surface and lead pads on the first surface of the substrate for surface mounting components. A ribbon wire bond is provided having open ends and a central portion between the open ends, the open ends of the ribbon wire bond connected to the lead pads. An electrical component is bonded to the central portion of the ribbon wire bond. The central portion of the ribbon wire bond and the electrical component are spaced from the first surface of the substrate.

A wire bonding apparatus (100) includes a bonding stage (12), a bonding head (20), an XY driving mechanism (30), and a frame (50). The XY driving mechanism (30) includes: an X-direction guide (31) installed to the frame (50); an X-direction slider (32), supported by the X-direction guide (31) and moving in the X direction, an X-direction mover (41) being installed thereto; a Y-direction guide (33) installed to a lower side of the X-direction slider (32); and a Y-direction slider (34), supported by the Y-direction guide (33) and moving in the Y direction, the bonding head (20) being installed thereto. The XY driving mechanism (30) is installed to the frame (50), so that a portion of the Y-direction guide (33) is overlapped with a mounting surface (12a) of a bonding stage (12) above the mounting surface (12a) and behind the mounting stage (12) in the Y direction.

An ultrasonic horn is provided with: a vibration generating unit configured to generate longitudinal vibration having a frequency in the ultrasonic band on the basis of a signal having a frequency in the ultrasonic band input from an oscillator; a vibration amplifying unit configured to amplify the vibration generating unit while transmitting the longitudinal vibration from the vibration generating unit; and a longitudinal-torsional vibration conversion slit unit having slits formed in a groove-like shape on the surfaces of the vibration amplifying unit and configured to convert the longitudinal vibration into torsional vibration. The vibration amplifying unit has a polygonal shape in a plane view, and has a plurality of surfaces provided with slits along with a surface not provided with slits.

There is provided with a surface for contacting a wire. At least a part of the surface comprises a surface of a ceramic sintered body containing aluminum oxide as a main ingredient and titanium carbide as an accessory ingredient.

A system of forming a bimetal medical device from dissimilar metal components includes a first metal component, a second metal component, a retaining device, a compression mechanism, and an energy source. A method of forming the bimetal medical device with the system includes applying a first pulse of laser energy to a joint formed between the first and second metal components retained by the retaining device and compressing the first and second metal components together with the compression mechanism to form a welded region.