Patent classifications
B23K20/004
WEDGE BONDING COMPONENT
There is provided with a surface for contacting a wire. At least a part of the surface comprises a surface of a ceramic sintered body containing aluminum oxide as a main ingredient and titanium carbide as an accessory ingredient.
Wire tensioner
A wire tensioner has a wire passage through which a wire is inserted. The wire passage include: an inlet through which a compressed gas enters; a first outlet through which the compressed gas is discharged and is provided on an upper side of the inlet; a first flow contraction portion provided on the upper side of the inlet, and for contracting an area of the wire passage; a second flow contraction portion provided on a lower side of the inlet, and for contracting the area of the wire passage; a third flow contraction portion provided on a side of a bonding tool of the second flow contraction portion, and for making the flow of the compressed gas to the side of the bonding tool contracted; and a second outlet through which the compressed gas is discharged and is provided on the lower side of the second flow contraction portion.
Hot Press Electrode and Method For Manufacturing the Same
A hot press electrode includes a non-diamond substrate having a diamond edge part. The edge part is formed on an edge of the substrate and is adapted to press a wire and heat the wire to achieve a hot press welding of the wire.
Wire tension adjustment method and wire tension adjuster
Provided is a wire tension adjuster (60) that adjusts tension (T) applied to a wire (18) of a wire bonding apparatus (100). In the wire tension adjuster (60), in a state in which the wire (18) is gripped by a wire clamper (17), air is supplied to a wire tensioner (40) and a height position (H) of a tip (14f) of a bonding arm (14) is detected, and a flow rate (G) of the air supplied to the wire tensioner (40) is adjusted based on the height position (H) detected, thereby adjusting the tension (T) applied to the wire (18).
Device for heating and determining an actual temperature of a bonding tool of an ultrasonic bonding device
A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.
METAL WIRING BONDING STRUCTURE AND PRODUCTION METHOD THEREFOR
A metal wiring bonding structure 100 comprises contacts 753 of connection FPC 75 and heater lands 46 of a sheet heater 30 to be bonded by a solder bonding member 766. A connection FPC 75 includes contact opposed lands 754 formed of metal and disposed at positions respectively opposed to the plurality of contacts 753 on a surface of a support layer 751 opposite from a surface on which metal wires 750 are provided. In addition to base surfaces 461 opposed to the contacts 753, the heater lands 46 respectively include extended surfaces 462 opposed to imaginary extended portions 753b imaginarily extended ahead from the contacts 753. A solder bonding member 756 covers surfaces of the contact opposed lands 754, a distal end surface of the connection FPC 75, and the extended surfaces 462 of the heater lands 46, and is filled in a bonding space C.
WIRE TRANSFER APPARATUS OF TABBING APPARATUS
Provided is a wire transfer apparatus of a tabbing apparatus. A wire transfer apparatus of a tabbing apparatus according to the present invention includes: a first transfer gripper unit configured to grip a wire; a second transfer gripper unit disposed in parallel to the first transfer gripper unit and configured to grip the wire at a location spaced apart from the first transfer gripper unit together with the first transfer gripper unit; and a gripper transfer unit configured to transfer the wire while moving the first transfer gripper unit and the second transfer gripper unit.
DEVICE AND METHOD FOR ESTABLISHING ELECTRIC CONTACT BETWEEN AN ENERGY STORAGE CELL AND A CONDUCTOR PLATE STRUCTURE USING A CONDUCTOR CABLE
A device for establishing an electric contact between an electric energy storage cell and an electrically conductive conductor plate structure via an electrically conductive conductor wire. A tool establishes an electric contact between the electrically conductive conductor wire and the electric energy storage cell, and establishes an electric contact between the electrically conductive conductor wire and the electrically conductive conductor plate structure. The tool has a tool element that is movable through a perforation on the side of a conductor plate structure at least with its free end. In the region of the free end, a contacting device is arranged or built for forming an electric contact between the energy storage cell.
WEDGE BONDING TOOLS, WEDGE BONDING SYSTEMS, AND RELATED METHODS
A wedge bonding tool including a body portion including a tip portion is provided. The tip portion includes a working surface configured to contact a wire material during formation of a wedge bond. A plurality of notches are defined by one or more surfaces of the body portion.
Wire splicing device, wire splicing method, and method for manufacturing splice structure
A wire connection device includes: a holding base which is provided with a wire accommodation groove having a width, the wire accommodation groove being configured to accommodate a plurality of wires; a pressing plate which is positioned above the holding base; a heating body which is positioned above the pressing plate and includes a heating member; a first driver which drives the holding base and the pressing plate away from or toward one another; and a second driver which drives the holding base and the heating body toward or away from one another, in which the pressing plate which is driven toward the holding base by the first driver presses together the plurality of wires accommodated in the wire accommodation groove with solder interposed therebetween.