The present invention relates to a magnet wire bonding method and a bonding structure, and more particularly to a new improvement for ultrasonically bonding a longitudinal outer peripheral surface of a magnet wire having no entangling part to a flat surface of a flat part of a terminal pin. A magnet wire bonding method and structure, comprising: using a terminal pin (11) having a flat plate part (40) provided in a pin part (11a) as a terminal pin holding part (3); placing a magnet wire (13) in a longitudinally spread state on a flat surface (40a) of the flat plate part (40) without being entangled; and ultrasonically bonding an outer peripheral surface (13E) of the magnet wire (13) onto the flat surface (40a) with an ultrasonic horn (50).

One aspect relates to a feedthrough system. The feedthrough system includes a feedthrough and a wire. At least a portion of the feedthrough is made of an insulator and at least one area forming an electrically conductive cermet pathway. The cermet pathway may include an electrically conductive metal. The wire may be at least partially connected to the cermet pathway so that the material of the wire forms a joint microstructure with the electrically conductive material in the cermet pathway.

A metal wiring bonding structure 100 comprises contacts 753 of connection FPC 75 and heater lands 46 of a sheet heater 30 to be bonded by a solder bonding member 766. A connection FPC 75 includes contact opposed lands 754 famed of metal and disposed at positions respectively opposed to the plurality of contacts 753 on a surface of a support layer 751 opposite from a surface on which metal wires 750 are provided, and through holes 755 penetrating the contact opposed lands 754, the support layer 751, and contacts 753. Solder bonding members 756 cover surfaces of contact opposed lands 754 and are filled inside through holes 755 and in a bonding space C.

A wire bonding apparatus of an aspect includes: a clamp apparatus, having a pair of arms; a stage, moving the clamp apparatus in a horizontal direction; a rod member; a contact detection part, detecting contact between the rod member and the clamp apparatus; and a control apparatus, controlling opening and closing of the pair of arms and an operation of the stage and acquiring position information of the clamp apparatus. The control apparatus obtains an opening amount of the pair of arms based on position information of the clamp apparatus at a time when an outer side surface of a first arm contacts the rod member in a state where the pair of arms are closed and position information of the clamp apparatus at the time when the outer side surface of the first arm contacts the rod member in a state where the pair of arms are open.

Provided is a wire setting apparatus of a tabbing apparatus. A wire setting apparatus of a tabbing apparatus according to the present invention includes: a conveyer; a wire placement platform installed adjacent to the conveyer such that a portion of a wire placed on the conveyor lies on the wire placement platform; and a placement gripper device configured to grip the wire and to place the wire on the wire placement platform.

A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method thereof. One or more layers of a three-dimensional structure are deposited on a substrate. The three-dimensional structure is configured to include one or more internal cavities using, an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure includes one or more structural integrated metal objects spanning the one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties and bonded between two or more other metal objects located at the same layer or different layers of the three-dimensional structure.

The inventors experimentally demonstrated NO.sub.2 gas sensing performance of multilayer black phosphorous (BP) field effect transistors. The BP sensors were sensitive to NO.sub.2 concentration down to 5 ppb making them comparable in sensitivity to the best 2D material based sensors. Raman spectroscopy comparison revealed no apparent change in the spectra before and after exposure to NO.sub.2, which shows that thick BP flakes can maintain their relative stability after sensing. Moreover, the BP device sensing performance fitted well with the Langmuir Isotherm for molecules adsorbed on a surface, which confirms charge transfer as the dominant mechanism for sensing. The systematic increase in conductance with increasing NO.sub.2 concentrations suggests NO.sub.2 molecules withdraw electrons and dope BP flakes with holes. These results lay the ground work for BP to be applied to various sensing applications including chemical, gas, and bio-sensors.

An inductive thermo-crimping apparatus is provided, which is provided for crimping a crimping body which is formed by the contact of the connecting body and the to-be-joined member. The inductive thermo-crimping apparatus includes a driving part, a stamper part, and a heating part, the driving part is connected to the stamper part, and the heating part is fixedly connected to the driving part. After the heating part is activated, the crimping body is disposed on the heating part. The heating part includes an inductive heating coil. The inductive heating coil surrounds in the heating part. The inductive heating coil is provided for heating the crimping body to soften the crimping body, in which the driving part is provided for driving the stamper part to press the soften crimping body, so that the connecting body and the to-be-joined member is crimped and to form a rigid crimping body after cooling. The present invention utilizes the coil with an alternative current to heat the crimping body by an electromagnetic induction, so that the process of the crimping technology is convenient and fast.

A bonding apparatus has a bonding tool for bonding a wire to a bonding surface, a bonding tool retainer configured to releasably retain the bonding tool, a bonding tool holder configured to hold at least one bonding tool, a bonding tool manipulator configured to transfer said bonding tool between said bonding tool holder and said bonding tool retainer, and a bonding tool guide configured to guide said bonding tool to be received by said bonding tool retainer during transfer by said bonding tool manipulator.

Methods for processing a metal substrate for use in a power electronics device are provided. In one example, the method includes placing a metal substrate on a support associated with a laser system. The method includes performing a pulsed laser treatment process on at least a portion of the surface of the metal substrate. The pulsed laser treatment process exposes the at least a portion of the surface of the metal substrate to a plurality of laser pulses to modify a surface roughness of the at least a portion of the surface of the metal substrate. After performing the pulsed laser treatment process, the method includes creating a metallized interface for coupling an electrical component to the metal substrate at the at least a portion of the surface of the metal substrate.