A conductor connection device for joining a plurality of conductors with ultrasonic welding, the conductor connection device comprising: a horn including a contact surface that is brought into contact with the conductors, the horn being configured to be ultrasonically vibrated; a pair of restricting portions configured to be brought into contact with the contact surface and to be relatively movable along the contact surface; and an anvil that is relatively moved toward and away from the contact surface, the horn and the pair of restricting portions being moved relative to the anvil to sandwich the anvil between the pair of restricting portions facing each other, and at least one of the pair of restricting portions being moved toward the other.

Two aluminum alloy plates are sandwiched between an anvil and a chip of a horn which is being vibrated by a vibration unit, to perform ultrasonic bonding. A deposit removing unit is provided above the horn. When the horn is vibrated by the vibration unit and raised by an elevator, the chip positioned on the top of the horn comes into contact with a removal section, with the chip being vibrated, to allow the removal section to remove a deposit adhering to the chip.

An ultrasonic transducer system is provided. The ultrasonic transducer system includes: a transducer mounting structure; a transducer, including at least one mounting flange for coupling the transducer to the transducer mounting structure; and a tuned resonator having a desired resonant frequency, the tuned resonator being integrated with at least one of the transducer mounting structure and the at least one mounting flange.

The present invention relates to an ultrasonic vibration system (1) comprising a sonotrode which has two sonotrode end faces (8, 8′) and a circumferential lateral surface that connects said sonotrode end faces (8, 8′) with each other. The sonotrode has an elongate core element (2) and at least one wing element (3, 4), each core element (2) and wing element (3, 4) longitudinally extending from the one sonotrode end face (8) to the other sonotrode end face (8′). The wing element (3, 4) has a sealing surface (7) which is designed to be in contact with a material for the purpose of processing same and which is connected to the core element (2) via a plurality of longitudinally interspaced connecting portions (5, 6). The ultrasonic vibration system further comprises a converter (9) which is optionally connected to the sonotrode via an amplitude transformer (11). According to the invention, the converter (9) or the amplitude transformer (11) is connected to the lateral surface of the sonotrode.

An ultrasonic systems and methods for sealing complex interfaces or for metal forming. Complex interfaces, such as a Gable top, have multiple and a variety of layers across the interface, or an oval or round spout having a complex geometry. An example system includes two ultrasonic horns arranged opposite a gap between which the interface is provided. The frequency and phase of the ultrasonic energy are synchronized as the energy is applied simultaneously while the interface is pressed between a jaw and the energy is applied to both sides of the interface. Another example system includes two ultrasonic transducers synchronized in frequency and phase and used to vibrate a horn mechanically to facilitate a sealing or welding interface or to assist in a metal-forming process.

An ultrasonic metal welding device for welding electrical conductors using a compression chamber that is adjustable at least n height and that is delimited on opposite sides by a section of a sonotrode as a first delimiting surface and by at least one section of a counter electrode (156) as a second delimiting surface, wherein for welding, the counter electrode and the sonotrode are displaced relative to one another. The counter electrode used is one that comprises sections (152, 154) of geometrically different working surfaces or is composed of at least two sections that are displaceable relative to one another.

A bonding apparatus is provided. This bonding apparatus uses images captured by an imaging apparatus and performs a packaging process for a semiconductor chip and additional processes other than the packaging process. The bonding apparatus is provided with: an aperture switching mechanism provided in an optical system of the imaging apparatus and capable of switching between a first aperture and a second aperture that has an aperture hole diameter greater than that of the first aperture; and a control unit which controls the aperture switching mechanism to switch to either the first aperture or the second aperture. The control unit performs the packaging process using an image captured by switching to the first aperture and performs the additional processes using an image captured by switching to the second aperture.

The invention relates to a bonding arrangement comprising a bonding tool including a tool shank, which is designed as elongated in a tool longitudinal direction, and including a tool tip, which adjoins the tool shank, and comprising a light guide designed to conduct a laser beam, the light guide being provided in a longitudinal recess of the bonding tool, the longitudinal recess extending from an end face of the bonding tool opposite the tool tip in the direction of the tool tip, a functional recess being formed on the lateral surface of the bonding tool, and the longitudinal recess being made to extend up to the functional recess. The invention further relates to a bonding tool having a functional application as well as the use of the bonding arrangement according to the invention and/or the bonding tool for ultrasonic bonding.

Provided is an ultrasonic joining apparatus capable of easily changing the elliptical ratio and the amplitude of a complex vibration. An ultrasonic joining apparatus (1) includes an ultrasonic LT horn (4) transmitting an ultrasonic vibration to a horn tip (6), in which the horn tip (6) is attached to a lower side of a tip portion (4b) of the ultrasonic LT horn (4) and detachable adjustment screws (5) are attached to positions (screw holes 4b1, 4b2, 4b4) not interfering with the horn tip (6) of the tip portion (4b).

A welding method includes: moving a welding head toward a plurality of workpieces, wherein each of the plurality of workpieces includes a polymeric composite, the polymeric composite includes a polymer matrix and a plurality of fibers, and each of the fibers includes a magnetic material; applying a joining pressure to the workpieces with the welding head; applying energy to the plurality of workpieces to melt an interface between the plurality of workpieces, wherein a weld plane is defined at the interface between the plurality of workpieces; and applying a magnetic field to the plurality of workpieces to change an orientation of the plurality of fibers relative to the polymer matrix in the weld area so that the fibers in a weld area are at an angle relative to the weld plane.