An ultrasonic welding system. The system includes an ultrasonic transducer assembly having a horn and a first transducer and a second transducer arranged to impart ultrasonic energy into the horn. The horn has a first part-interfacing surface and a second part-interfacing surface opposite the first part-interfacing surface. An actuator assembly is operatively coupled to the ultrasonic transducer assembly and configured to cause rotation of the horn. A controller is configured to: cause the actuator assembly to rotate the horn so that the first part-interfacing surface applies the ultrasonic energy to a first part along an entire length of the first part-interface surface while a first ultrasonic energy is applied through the horn via the first transducer to cause the first part-interfacing surface to vibrate back and forth along its entire length as the first ultrasonic energy is applied by the first transducer to the horn.

An ultrasonic tool comprising a first end face and a second end face, which is opposite the first end face, as well as a tool cover surface connecting the first end face and the second end face, wherein the ultrasonic tool is elongated in a longitudinal direction of the tool, wherein at least the first end face is formed as a connecting contact surface, which is arranged for pressing the ultrasonic tool against a connecting component, and wherein the ultrasonic tool comprises an end region comprising the connecting contact surface, which extends from the connecting contact surface in the longitudinal direction of the tool over 15 mm, but at most extends one third of the length of the ultrasonic tool in the direction of the opposite end face, and wherein in the end region, a first partial surface of the tool cover surface is formed as a surface-structured absorption surface.

A bonding arrangement comprising a bonding tool, having a tool shank which is designed to extend in a longitudinal direction of the tool, and a tool tip which connects to the tool shank. A first end side of the bonding tool is provided on the tool tip, which is designed to come into contact with a connection part. A second end side of the bonding tool is provided on the tool shank. The bonding tool has a casing surface connecting the first end side and the second end side, said bonding arrangement comprising a laser generator for providing a laser beam and comprising a light guide designed to guide the laser beam to the bonding tool. A functional recess is formed on the bonding tool on the casing side and the light guide is associated with the bonding too on the casing side from the outside and at a distance.

A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.

An ultrasonic welding system is provided. The ultrasonic welding system includes a support structure for supporting a workpiece. The ultrasonic welding system also includes a weld head assembly including an ultrasonic converter carrying a sonotrode. The weld head assembly is moveable along a plurality of substantially horizontal axes. The sonotrode is configured to operate during a welding operation at a bond force of between 5-500 kg, and with a sonotrode tip motion amplitude of between 5-150 microns.

A bonding apparatus is provided. This bonding apparatus uses images captured by an imaging apparatus and performs a packaging process for a semiconductor chip and additional processes other than the packaging process. The bonding apparatus is provided with: an aperture switching mechanism provided in an optical system of the imaging apparatus and capable of switching between a first aperture and a second aperture that has an aperture hole diameter greater than that of the first aperture; and a control unit which controls the aperture switching mechanism to switch to either the first aperture or the second aperture. The control unit performs the packaging process using an image captured by switching to the first aperture and performs the additional processes using an image captured by switching to the second aperture.

A device for welding rod-shaped electrical conductors and a sonotrode for such includes a compression space for receiving two connection regions of the conductors to be connected, said connection regions extending in a first axial direction (x-axis), the compression space being defined by a working surface of a sonotrode, which transmits ultrasonic vibrations, and a counterface of an anvil at two opposite sides in a second axial direction (z-axis) and by a boundary surface of a slider element, displaceable in the second axial direction (z-axis), and a boundary surface of a boundary element on two opposite sides in a third axial direction (y-axis). In a special contact zone, which is a section of the working surface of the sonotrode and serves to subject at least one connection region to ultrasonic vibrations, the working surface has a surface configuration that differs from a contact zone formed by the remaining working surface.

An electric cable includes a terminal, and a manufacture method thereof is to suppress shedding of wire strands from a core wire. The electric cable with terminal includes an end of an electric cable connected to the terminal. The electric cable includes a core wire that is a bundle of a plurality of wire strands. The terminal includes a connection portion in which the core wire is exposed at the end of the electric cable. The core wire is placed on the connection portion including a welded portion that is to be ultrasonic welded to the connection portion. The welded portion includes a high compression portion in which the core wire is compressed, and a low compression portion in which a position that is closer than the high compression portion to the end of the core wire is compressed at a compression lower than that of the high compression portion.

An energy apparatus can be configured for providing energy to an item being transferred over a rotatable drum. The energy apparatus can include a first energy mechanism configured to be fixedly coupled to the rotatable drum and rotate with the rotatable drum. The energy apparatus can also include a second energy mechanism configured to rotate around a circumference of the rotatable drum. The energy apparatus can additionally include a translation system coupled to the second energy mechanism and configured to move the second energy mechanism to an end position that allows the second energy mechanism and the first energy mechanism to provide energy to the item while there is no relative motion between the first energy mechanism and the second energy mechanism. Methods of providing energy to an item utilizing an energy apparatus are also disclosed.

An ultrasound sonotrode (101), the first end of which is adapted to be connected to a mechanical vibrations source, equipped with a working tip (105,205,405,805) at the opposite end of the sonotrode (101), equipped with a body (104) with a cooling jacket (103), sealed at the place of contact with the body (104) of the sonotrode (101) with the use of the first seal (106) and the second seal (107), characterized in that according to the invention the first seal (106) is placed at a distance less than or equal to 20 mm from the node of the standing wave excited in the sonotrode in the working conditions, and the second seal (107,207,407,507,607) is equipped with a resilient element (108,208,408,508,608) and is located at a distance less than or equal to 20 mm from the working tip (105,205 405,805). A method for metal alloying, in which the material is melted on the working tip (105, 205, 405, 805) of the sonotrode excited to mechanical vibrations, according to the invention characterized in that a sonotrode according to the invention is used.