A method for fixing a strip end segment of a metal strip wound into a coil to a strip winding of the coil arranged adjacent to the strip end segment. In order to enable the production of metal strip with improved quality, the strip end segment is fixed by materially bonding on the strip winding by means of a friction welding method.

A pyrolysis surface such as a rotating retort is provided by copper sheet supported by a nickel alloy framework. Pyrolysis is used to destroy calorific waste and/or to produce gas therefrom.

A pyrolysis surface such as a rotating retort is provided by copper sheet supported by a nickel alloy framework. Pyrolysis is used to destroy calorific waste and/or to produce gas therefrom.

The present disclosure provides a wire and arc additive manufacturing (WAAM) method for a magnesium alloy. The method includes the following steps: step 1: performing a WAAM process assisted by cooling and rolling; step 2: milling side and top surfaces of an additive part; step 3: performing, by friction stir processing (FSP) equipment, an FSP process on the additive part, and applying cooling and rolling to a side wall of the additive part through a cooling and rolling device during the FSP process; step 4: finish-milling the top surface of the additive part for a WAAM process in the next step; and step 5: repeating the above steps cyclically until final forming of the part is finished. The present disclosure completely breaks dendritic structures and refines grains in the WAAM process of the magnesium alloy, thereby effectively repairing defects such as pores and cracks.

The present disclosure provides a wire and arc additive manufacturing (WAAM) method for a titanium alloy. The method includes the following steps: step 1: performing a WAAM process assisted by cooling and rolling; step 2: milling side and top surfaces of an additive part; step 3: performing, by friction stir processing (FSP) equipment, an FSP process on the additive part, and applying cooling and rolling to a side wall of the additive part through a cooling and rolling device during the FSP process; step 4: finish-milling the top surface of the additive part for a WAAM process in the next step; and step 5: repeating the above steps cyclically until final forming of the part is finished. This WAAM method completely breaks dendritic structures and refines grains in the WAAM process of the titanium alloy, thereby effectively repairing defects such as pores and cracks.

The present disclosure provides a wire and arc additive manufacturing (WAAM) method for a titanium alloy. The method includes the following steps: step 1: performing a WAAM process assisted by cooling and rolling; step 2: milling side and top surfaces of an additive part; step 3: performing, by friction stir processing (FSP) equipment, an FSP process on the additive part, and applying cooling and rolling to a side wall of the additive part through a cooling and rolling device during the FSP process; step 4: finish-milling the top surface of the additive part for a WAAM process in the next step; and step 5: repeating the above steps cyclically until final forming of the part is finished. This WAAM method completely breaks dendritic structures and refines grains in the WAAM process of the titanium alloy, thereby effectively repairing defects such as pores and cracks.

Implementations are provided for fabricating a finished workpiece having a shaped portion. One implementation includes: a superplastic formation diffusion bonding (SPFDB) component; a cold spray additive manufacturing (CSAM) component; and a mold having a concavity. Various configurations can operate on a workpiece with the SPFDB and CSAM components in different orders. An implementation is configured to cold spray (with the CSAM component) an additive material onto the workpiece; and perform superplastic forming (with the SPFDB component) on the workpiece with the mold, thereby rendering the workpiece into the finished workpiece having the shaped portion. The shaped portion conforms to a shape defined by the concavity. Cold spraying results in an increased thickness of the finished workpiece in a target region, which can provide structural reinforcement, and which can have a tapered edge. The workpiece can be a metal substrate made of titanium, aluminum, stainless steel, or another material.

An electronic device includes: a first semiconductor die having a metal region; a substrate having a plurality of metal regions; a first soldered joint between the metal region of the first semiconductor die and a first metal region of the substrate, the first soldered joint having one or more intermetallic phases throughout the entire soldered joint, each of the one or more intermetallic phases formed from a solder preform diffused into the metal region of the first semiconductor die and the first metal region of the substrate; and a second semiconductor die soldered to the first or different metal region of the substrate.

Apparatus and method for tool mark free stich bonding. In some embodiments, a method for wire bonding can include feeding a wire through a capillary tip and attaching a first end of the wire to a first location, thereby forming a ball bond. The method can further include moving the capillary tip towards a second location while the wire feeds out of the capillary tip. The method can further include attaching a second end of the wire to the second location while preventing contact between the capillary tip and the second location, thereby forming a stitch bond without a tool mark at the second location.

A peeling apparatus includes: an ingot holding unit holding an ingot with an ingot portion corresponding to a wafer being faced up; an ultrasonic wave oscillating unit which has an end face facing the ingot portion corresponding to the wafer and oscillates an ultrasonic wave; a water supplying unit supplying water to an area between the ingot portion corresponding to the wafer and the end face of the ultrasonic wave oscillating unit; and a peeling unit that holds the ingot portion corresponding to the wafer with suction and peels off the wafer from the ingot.