In order to reduce the adverse effect from a thermal medium splashing as a result of a vapor chamber bursting, this protective structure is provided with a perforation member comprising an end section that: comprises an upper surface and a lower surface; either comes into contact with a first surface, which is either the upper surface or the lower surface, or is located near the first surface, before a flat vapor chamber in contact with an electronic component is overheated by heat from the electronic component; and breaks an outer member of the vapor chamber and penetrates into the interior when the vapor chamber is overheated by the heat.

Provided is a joining method that can prevent a plastic flowing material from flowing out from a butt section and that can reduce the thickness and weight of metal members. The joining method is for joining a first metal member and a second metal member by using a rotary tool comprising a stirring pin, and is characterized in that: the stirring pin comprises a flat surface perpendicular to the rotation axis of the rotary tool and comprises a protruding section protruding from the flat face; and in a friction stirring step, the flat surface is brought into contact with the first metal member and the second metal member, and a front end face of the protruding section is inserted deeper than an upper overlapping section to join an upper front butt section and the upper overlapping section.

A method of joining a semiconductor die to a substrate includes: applying a solder preform to a metal region of the semiconductor die or to a metal region of the substrate, the solder preform having a maximum thickness of 30 μm and a lower melting point than both metal regions; forming a soldered joint between the metal region of the semiconductor die and the metal region of the substrate via a diffusion soldering process and without applying pressure directly to the die; and setting a soldering temperature of the diffusion soldering process so that the solder preform melts and fully reacts with the metal region of the semiconductor die and the metal region of the substrate to form one or more intermetallic phases throughout the entire soldered joint, each intermetallic phase having a melting point above the melting point of the preform and the soldering temperature.

A method for welding at least three cables, each with two conductors protruding from the sheath ends of the cables includes stripping ends of the first conductors and stacking from opposite directions atop one another forming a first stack. The stripped ends of the second conductors are stacked atop one another from opposite directions at a working distance from the first stack forming a second stack. The first stack is arranged in a welding area of a welding device and welded to a first welding point, while the second stack is arranged in a waiting area spaced by the working distance from the welding area. The first welding point is moved by the working distance from the welding area to a storage area, while the second stack is moved by the working distance from the waiting area into the welding area and is welded to a second welding point.

A method of friction stir processing (FSP) includes contacting a first workpiece with a FSP tool, where the first workpiece is a low-melting temperature metal or alloy and the FSP tool is a single-body FSP tool having a diamond working surface. The method also includes rotating the FSP tool in contact with the first workpiece at an interface and generating thermal energy at the interface to heat the first workpiece. The method further includes conducting thermal energy away from the interface with the FSP tool, and friction stirring the first workpiece at a temperature of the FSP tool below 800° C.

A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.

A surgical instrument and related methods are described. The surgical instrument includes a first jaw including a first structural jaw element and a first sealplate fixed to the first structural jaw element and a second jaw including a second structural jaw element and a second sealplate fixed to the second structural jaw element. The second structural jaw element is moveably coupled to the first structural jaw element to facilitate pinching tissue between the first and second sealplates. The first and second sealplates are configured to facilitate sealing tissue pinched therebetween. The first jaw further includes a metallized tie layer between the first sealplate and the first structural jaw element, wherein the first sealplate is fixed to the first structural jaw element via a metal to metal joint between the first sealplate and the metallized tie layer.

A method of bonding two or more metallic components into a single piece. The bonding surfaces of the metallic components are protected from reaction with the environment. A force is applied to the metallic components to push the bonding surfaces together. Simultaneous with applying the force, an electric current is passed through the bonding surfaces to joule heat and weld the bonding surfaces together to form the single piece. The bonding surfaces may be protected by plating with a noble metal, applying a coating, shielding with a noble gas, or placing into a vacuum. A press may be used to apply the force. The force and the electric current may be sufficient to push out metal around the joint of the bonding surfaces, and at least one of the bonding surfaces may be drafted to facilitate pushing out the metal. The electric current may be pulsed to induce electroplasticity.

A method of securing an insert in a preselected region of a workpiece. An opening wall is formed in the workpiece with an opening wall surface defining an opening to produce a remainder segment of the workpiece. The opening encompasses or coincides with the preselected region. An insert is provided to fit in the opening. An insert heated portion and a remainder segment heated portion are heated to a hot working temperature, at which they are plastically deformable. While the insert is subjected to an engagement motion, to move the insert relative to the remainder segment, an insert engagement surface of the insert is pressed against the opening wall surface, for plastic deformation of the insert heated portion and of the remainder segment heated portion, creating a metallic bond between the insert and the remainder segment. The insert and the remainder segment are allowed to cool, to bond them together.

A method of attaching a tube having a tube wall defining a tube channel therein to a workpiece having a workpiece wall. A workpiece opening defined by a workpiece opening wall surface is formed in the workpiece wall. A tube engagement surface is formed on the tube wall for engagement with the workpiece opening wall surface. A workpiece heated portion in the workpiece, and a tube heated portion in the tube, are heated in a non-oxidizing atmosphere by energized heating elements to a hot working temperature. The tube is subjected to an engagement motion, moving the tube engagement surface relative to the workpiece opening wall surface. While the heated portions are at the hot working temperature, and while the tube is subject to the engagement motion, the tube engagement surface is pressed against the workpiece opening wall surface, for plastic deformation of the heated portions, to create a metallic bond.