A removable calibration plate (10) comprises a sheet (20) comprising an upper face (21) intended to face towards the powerful incident-radiation beam, and bearing a reference marking (30) and being intended to receive a test marking (40), and a lower face (23). The plate (10) comprises an etching layer (22) to be etched by a powerful incident-radiation beam (F),this layer being secured to the upper face (21) of the sheet (20) and opaque to visible light, and being able to be destroyed locally by the powerful incident-radiation beam (F) in order to form the at least one test marking (40), the sheet (20) being transparent to visible light, the lower face (23) of the sheet (20) being frosted.

In a method for welding using a wire-shaped filler and at least one laser beam, the wire-shaped filler is advanced in the direction of the surface of the workpiece by a wire feed mechanism. The wire-shaped filler is successively fused during the feed movement thereof. The wire-shaped filler and the material are connected to an electrical voltage source and form an electrical circuit. The electrical voltage, the electrical current and/or the electrical resistance are measured and used as control variables for the wire feed movement and/or the power of the at least one laser beam. Use of the laser beam is modified when a predefined threshold value of the electrical voltage and/or of the electrical current are fallen short of or a predefined threshold value of the electrical resistance is exceeded.

Described herein is an electronics circuit board design tool. The tool includes a substantially planar non-conductive substrate adapted to be positioned on an electronics breadboard. The substrate includes a plurality of guide apertures at locations corresponding to predefined electrical inputs of the breadboard such that electronic components are able to be connected to the electronics breadboard through respective ones of the guide apertures. The tool also includes indicia printed on a surface of substrate. The indicia is indicative of the type or position of electrical connections or components to be connected with the breadboard through corresponding ones of the guide apertures.

A manual laser cleaning device for removing foreign matter present on the surface of a workpiece according to an embodiment includes a laser generator oscillating a laser beam, a controller controlling the laser generator, and a laser cleaning head receiving the laser beam emitted from the laser generator through an optical fiber and irradiating a surface of a workpiece with the received laser beam. The laser cleaning head includes a head housing having a handle, a collimator placed in the head housing and collimating the laser beam scattered at one end of the optical fiber into parallel light, a high-speed Galvano scanner scanning the laser beam transmitted through the collimator at high speed using a mirror mounted on a scanning motor, and a focal lens focusing the laser beam scanned by the high-speed Galvano scanner at a focal distance and irradiating the surface of the workpiece with the laser beam.

A manual laser cleaning device for removing foreign matter present on the surface of a workpiece according to an embodiment includes a laser generator oscillating a laser beam, a controller controlling the laser generator, and a laser cleaning head receiving the laser beam emitted from the laser generator through an optical fiber and irradiating a surface of a workpiece with the received laser beam. The laser cleaning head includes a head housing having a handle, a collimator placed in the head housing and collimating the laser beam scattered at one end of the optical fiber into parallel light, a high-speed Galvano scanner scanning the laser beam transmitted through the collimator at high speed using a mirror mounted on a scanning motor, and a focal lens focusing the laser beam scanned by the high-speed Galvano scanner at a focal distance and irradiating the surface of the workpiece with the laser beam.

A laser processing apparatus includes a laser oscillator that emits a laser beam, a beam condenser that condenses the laser beam emitted by the laser oscillator and positions the condensed point to a wafer, a condensed point position adjuster that is disposed between the laser oscillator and the beam condenser and adjusts the position of the condensed point, and an upper surface position detector that detects the upper surface position of the wafer. The upper surface position detector includes a detection light source that emits detection light of a wide wavelength band and a selector that selects detection light with a specific wavelength from the detection light emitted by the detection light source.

Laser processing device (1) includes: laser-beam switching apparatus (70) that switches between a first optical path and a second optical path as an optical path along which a laser beam is to travel, the first optical path including first fiber (11), the second optical path including second fiber (21) that has a core diameter that is larger than a core diameter of first fiber (11); and processing head (80) that illuminates a same processed point on workpiece (900) with a laser beam that has passed through the first optical path or the second optical path. When illumination with laser beam that has passed through the first optical path is performed for a predetermined period of time, laser-beam switching apparatus (70) switches from the first optical path to the second optical path.

A system includes an orientation determination system comprising a camera where the camera is configured to capture an image of an orientation feature of a physical dental model of a dental arch of a customer with material thermoformed thereon. The orientation determination system is configured to identify an offset of the physical dental model with respect to a fixture plate during positioning or before or after the physical dental model is positioned on the fixture plate by determining an actual orientation of the physical dental model based on the orientation feature. The system also includes a laser trimming system configured to cut the material along a trim line based on the identified offset while the fixture plate is moved about at least two axes to produce a dental aligner specific to the customer and being configured to reposition one or more teeth of the customer.

A machine learning device for learning a focal position offset of a laser processing apparatus. A data acquisition section acquires a learning dataset which includes data of a focal position command for a light-focusing optical system given to the laser processing apparatus and detection data of a physical quantity of light detected when a laser beam is emitted from a laser oscillator in accordance with a processing command including the focal position command. A learning section generates a learning model by using the learning dataset, which represents correlativity between the physical quantity of the detected light and the positional relationship of an effective light-focusing position of the light-focusing optical system relative to a workpiece. When performing processing, the physical quantity of light is detected so that a positional relationship between the workpiece and the effective light-focusing position during processing can be estimated from the detected quantity and the learning model.

A system for welding a first component to a second component. The system includes a first laser head configured to emit a first laser beam and be movably disposable on a first side of the first component. The system further includes a second laser head configured to emit a second laser beam and be movably disposable on an opposing second side of the first component. The system further includes a controller configured to independently control a first power of the first laser beam and a second power of the second laser beam. The controller is also configured to independently and simultaneously control movement of the first laser head and movement of the second laser head relative to the first component.