A laser machining system includes a state measurement unit that observes an internal state of a machining head or a varying state of a workpiece and outputs a machining state signal; an inference unit that determines a degree of quality of the laser beam machining as an inference result for each of machining defects concerning at least one type of machining defect on the basis of the machining state signal; a machining monitoring unit that monitors the workpiece for presence or absence of the machining defect and outputs a monitoring signal; a machining decision unit that decides whether there is the machining defect and determines a quality of the machining as a decision result; and a machinery safety unit that outputs, on the basis of the inference result and the decision result, a control signal that gives an instruction on whether to stop or continue the laser beam machining.

A laser machining system includes a state measurement unit that observes an internal state of a machining head or a varying state of a workpiece and outputs a machining state signal; an inference unit that determines a degree of quality of the laser beam machining as an inference result for each of machining defects concerning at least one type of machining defect on the basis of the machining state signal; a machining monitoring unit that monitors the workpiece for presence or absence of the machining defect and outputs a monitoring signal; a machining decision unit that decides whether there is the machining defect and determines a quality of the machining as a decision result; and a machinery safety unit that outputs, on the basis of the inference result and the decision result, a control signal that gives an instruction on whether to stop or continue the laser beam machining.

A laser descaling device and process includes a first laser sending a ray to the product to be descaled, reflected rays being intercepted by sensors that send collected information into a processing unit that calculates the absorption of the ray by the surface of the product, deduces the emissivity of the oxidized surface in the direction of the reflected rays, and correlates this emissivity with reference information prerecorded inside the processing unit; a second laser sends a ray onto the surface of the product, the spots of the rays covering the entire surface to be descaled, the second laser being controlled by a control unit receiving information provided by the processing unit making it possible to determine the operating parameters to be imposed on the second laser to obtain the descaling of the surface of the product, compared with experimental results prerecorded in the control unit.

A laser processing device includes a setting device that sets an irradiation condition of laser light, and a first storage that stores the set irradiation condition. The setting device sets different irradiation conditions respectively for cells included in test cells. A verification device captures an image of the processing pattern and calculates luminance values for the cells respectively. The setting device sets at least one of the irradiation conditions for main processing, based on information on luminance values of the test cells extracted from the luminance values for the cells and based on the irradiation conditions set for the test cells.

A measuring device determines a distance between a processing head for a laser processing system configured to process a workpiece with a laser beam and the workpiece. The measuring device includes an optical coherence tomograph to measure a distance between the processing head and workpiece. In the optical coherence tomograph, measuring light generated by a measuring light source and reflected by the workpiece interferes with measuring light reflected in a reference arm with two or more reference stages. The stages include a first reference stage configured such that the measuring light reflected therein travels a first optical path length, and a second reference stage configured such that the measuring light reflected therein travels a second optical path length different from the first length, wherein the measuring light reflected by the workpiece interferes with reflected measuring light of the first reference stage and reflected measuring light of the second reference stage.

A process for the continuous production of thin-walled, radially closed hollow profiles which are composed of nonferrous metals and have a small cross section comprises supply of a flat strip of the nonferrous metal to a forming apparatus (212) at a first supply speed, where the thickness of the strip corresponds to the wall thickness of the hollow profile. The forming apparatus (212) is configured for continuous forming of the flat strip supplied into a shape corresponding to the hollow profile. After forming, two opposite edges of the flat strip rest flush against one another in a contact region. A welding apparatus (216) continuously welds the edges which rest flush against one another by means of a laser which emits light having a wavelength of less than 600 nm. The laser heats a point in a welding region which has a diameter which is less than 20% of the cross-sectional dimension of the hollow profile. The welded hollow profile is taken off from the welding region, provided in a corrugator (225) with parallel or helical corrugation in sections and taken up in an uptake device (226).

The inventive concept provides a mask treating method. The mask treating method includes treating a mask by supplying a liquid to the mask, and irradiating a laser to a region of the mask on which a specific pattern is formed while the liquid remains on the mask; moving an optical module including a laser unit configured to irradiate the laser between a process position for treating the substrate and a standby position deviating from the process position; and adjusting a state of the optical module at an inspection port provided at the standby position to a set condition before the optical module is moved to the process position.

A manipulator device such as a robot arm that is capable of increasing manufacturing throughput for additively manufactured parts, and allows for the manipulation of parts that would be difficult or impossible for a human to move is described. The manipulator can grasp various permanent or temporary additively manufactured manipulation points on a part to enable repositioning or maneuvering of the part.

A manipulator device such as a robot arm that is capable of increasing manufacturing throughput for additively manufactured parts, and allows for the manipulation of parts that would be difficult or impossible for a human to move is described. The manipulator can grasp various permanent or temporary additively manufactured manipulation points on a part to enable repositioning or maneuvering of the part.

The invention relates to a device (100) for an additive manufacture. The device (100) comprises a laser device (110) for machining material using a laser beam (112), said laser device (110) being designed to deflect the laser beam (112) onto a machining region of a workpiece (10); at least one supply device (130) for a supply material, said supply device being designed to supply the supply material to the machining region; and an interferometer (140) which is designed to measure a distance to the workpiece (10) by means of an optical measuring beam (142).